| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/18/2004 | US20040226742 Package modification for channel-routed circuit boards |
| 11/18/2004 | US20040226739 Conformal sealing film |
| 11/18/2004 | US20040226647 ceramic capacitor between electrodes in laminated layer with apertures; supplying fillers; applying pressure, laser radiation |
| 11/18/2004 | DE4312409B4 Einstellbarer Kondensator Variable capacitor |
| 11/18/2004 | DE19717039B4 Vorrichtung zum Trocknen von starren und flexiblen gedruckten Leiterplatten An apparatus for drying of rigid and flexible printed circuit boards |
| 11/18/2004 | DE19710187B4 Verfahren zum Herstellen eines Keramikmehrschichtsubstrats A method for manufacturing a ceramic multi-layer substrate |
| 11/18/2004 | DE10319454A1 Dikupfer(I)oxalat-Komplexe als Precursor zur metallischen Kupferabscheidung Dicopper (I) oxalate complexes as precursors for the metallic copper deposition |
| 11/18/2004 | DE10210538B4 Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut Horizontal continuous flow system and method for electroplating treatment of treated |
| 11/18/2004 | DE102004022456A1 Flachdrahtüberbrückungselement Flat wire bridging element |
| 11/18/2004 | DE102004018639A1 System und Verfahren zum Löten von Elektronikkomponenten auf einem wärmeempfindlichen flexiblen Substrat mit Kühlung für einen vektortransienten Aufschmelzprozess System and method for the soldering of electronic components on a heat-sensitive flexible substrate with a cooling system for reflow vektortransienten |
| 11/18/2004 | DE10052960B4 Bleifreie Chemisch-Nickellegierung und Verfahren zu Ihrer Herstellung Lead-free electroless nickel alloy and process for their preparation |
| 11/17/2004 | EP1478216A1 Process for manufacturing a support board for electric circuits |
| 11/17/2004 | EP1478215A2 Package modification for channel-routed circuit boards |
| 11/17/2004 | EP1478023A1 Module part |
| 11/17/2004 | EP1478016A2 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate |
| 11/17/2004 | EP1477928A1 Antenna coil for IC card and manufacturing method thereof |
| 11/17/2004 | EP1477841A1 Liquid crystal display device and manufacturing method thereof |
| 11/17/2004 | EP1477588A1 Copper Electroplating composition for wafers |
| 11/17/2004 | EP1477587A2 Improved tin plating method |
| 11/17/2004 | EP1477230A1 Ultra-small diameter fluid jet device |
| 11/17/2004 | EP1477049A1 Solder interconnections for flat circuits |
| 11/17/2004 | EP1476914A1 Grouped element transmission channel link with power delivery aspects |
| 11/17/2004 | EP1476274A1 Spindle with axially acting collet-opening device |
| 11/17/2004 | EP1476273A1 Workpiece clamp with two alternately applicable compression rings |
| 11/17/2004 | EP1287182B1 Cathode for electrochemical regeneration of permanganate etching solutions |
| 11/17/2004 | EP1050093A4 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 11/17/2004 | EP0898443B1 Reflow soldering device |
| 11/17/2004 | CN2657331Y Fixture |
| 11/17/2004 | CN1547877A Horizontal component retention socket |
| 11/17/2004 | CN1547875A Audio coding and decoding |
| 11/17/2004 | CN1547874A Thermosetting electroconductive paste for electroconductive bump use |
| 11/17/2004 | CN1547772A Interconnect module with reduced power distribution impedance |
| 11/17/2004 | CN1547248A Aggregate of semiconductor devices |
| 11/17/2004 | CN1547246A Manufacturing method of ceramic packaging substrate |
| 11/17/2004 | CN1176567C Method of manufacturing multilayer wiring board |
| 11/17/2004 | CN1176566C Thermal trip arrangements |
| 11/17/2004 | CN1176496C Semiconductor device and mfg. method thereof |
| 11/16/2004 | US6819789 Scaling and registration calibration especially in printed circuit board fabrication |
| 11/16/2004 | US6819570 Circuit board with lead frame |
| 11/16/2004 | US6819540 Dielectric structure |
| 11/16/2004 | US6819406 Aligner |
| 11/16/2004 | US6819373 Lamination of liquid crystal polymer dielectric films |
| 11/16/2004 | US6819127 Method for testing semiconductor components using interposer |
| 11/16/2004 | US6819045 Display device |
| 11/16/2004 | US6819004 Encapsulated with epoxy resin; fluid flow |
| 11/16/2004 | US6819000 High density area array solder microjoining interconnect structure and fabrication method |
| 11/16/2004 | US6818988 Packaging |
| 11/16/2004 | US6818987 Electronic component and process for manufacturing the same |
| 11/16/2004 | US6818984 Programmable multi-chip module |
| 11/16/2004 | US6818979 High-frequency semiconductor device |
| 11/16/2004 | US6818977 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages |
| 11/16/2004 | US6818972 Reduction of chip carrier flexing during thermal cycling |
| 11/16/2004 | US6818840 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 11/16/2004 | US6818839 Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board |
| 11/16/2004 | US6818837 Wiring connection structure and transmitter using the same |
| 11/16/2004 | US6818836 Printed circuit board and its manufacturing method |
| 11/16/2004 | US6818835 Processor and power supply circuit |
| 11/16/2004 | US6818821 Electromagnetic wave absorption material and an associated device |
| 11/16/2004 | US6818702 Thermosetting resin composition and flexible circuit overcoating material comprising the same |
| 11/16/2004 | US6818608 A mixture comprising tetrabutylammonium fluoride, 1,8-diazabicyclo(5.4.0)undec-7-ene or diethylhyroxlyamine, a solvent of n,n-dimethylacetamide or methyl ethyl ketone; antisoilants removing polysiloxanes, acrylic, epoxy resins |
| 11/16/2004 | US6818574 Jointed body of glass-ceramic and aluminum nitride sintered compact and method for producing the same |
| 11/16/2004 | US6818544 Compliant, solderable input/output bump structures |
| 11/16/2004 | US6818542 Tape circuit board and semiconductor chip package including the same |
| 11/16/2004 | US6818477 Method of mounting a component in an edge-plated hole formed in a printed circuit board |
| 11/16/2004 | US6818469 Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same |
| 11/16/2004 | US6818461 Method of producing mounting structure and mounting structure produced by the same |
| 11/16/2004 | US6818382 Photosensitive composition, cured article thereof, and printed circuit board using the same |
| 11/16/2004 | US6818318 Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex |
| 11/16/2004 | US6818289 Mesoporous films having reduced dielectric constants |
| 11/16/2004 | US6818284 Single-sided paper phenolic resin copper-clad laminate with both sides having resists of same material |
| 11/16/2004 | US6818168 Process of shaping a printed circuit board |
| 11/16/2004 | US6818155 Attaching components to a printed circuit card |
| 11/16/2004 | US6818142 Potassium hydrogen peroxymonosulfate solutions |
| 11/16/2004 | US6818115 For circuit boards; provides improved flow of electrolyte through holes of printed circuit boards, which generates improved throwing power of plating inside through holes and blind vias |
| 11/16/2004 | US6818090 Semiconductor device in chip format and method for producing it |
| 11/16/2004 | US6818086 Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method |
| 11/16/2004 | US6817870 Technique for interconnecting multilayer circuit boards |
| 11/16/2004 | US6817869 Connector for transporting signals between contact pads on two surfaces |
| 11/16/2004 | US6817527 Carriers for printed circuit board marking |
| 11/16/2004 | US6817094 Method of making an electrical connector |
| 11/16/2004 | US6817093 Electronic component and manufacturing method therefor |
| 11/16/2004 | US6817092 Method for assembling a circuit board apparatus with pin connectors |
| 11/16/2004 | CA2291402C Stress relieved call grid array package |
| 11/14/2004 | CA2465448A1 Package modification for channel-routed circuit boards |
| 11/11/2004 | WO2004098258A1 Gluing method and device |
| 11/11/2004 | WO2004098257A1 Multilayer printed wiring board and method for manufacturing same |
| 11/11/2004 | WO2004098256A1 A method for processing a thin film substrate |
| 11/11/2004 | WO2004098254A1 Article comprising conductive conduit channels |
| 11/11/2004 | WO2004098253A1 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor |
| 11/11/2004 | WO2004098252A1 Printed wiring board connection structure |
| 11/11/2004 | WO2004098251A1 Printed wiring board connection structure |
| 11/11/2004 | WO2004098250A1 Connection structure for printed wiring board |
| 11/11/2004 | WO2004098249A1 Connection structure of printed wiring board |
| 11/11/2004 | WO2004098248A1 Connection structure of printed wiring board |
| 11/11/2004 | WO2004098247A2 Electronic control module for a removable connector and methods of assembling same |
| 11/11/2004 | WO2004097998A2 Interposed electrical connector which is intended to connect two stacked electronic circuits and to the method of mounting same |
| 11/11/2004 | WO2004097937A1 Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly |
| 11/11/2004 | WO2004097848A1 Terminated conductive patterned sheet utilizing conductive conduits |
| 11/11/2004 | WO2004097847A1 Heat selective electrically conductive polymer sheet |
| 11/11/2004 | WO2004096937A1 Adhesive for nonelectrolytic plating and process for the preparation thereof |