Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2004
11/24/2004CN1549408A Method for producing electric connector
11/24/2004CN1549336A Wiring board, semiconductor device having wiring board and manufacturing method thereof and packaging method
11/24/2004CN1549317A Device having resin package and method of producing the same
11/24/2004CN1548393A Insulative ceramic compact
11/24/2004CN1177517C Manufacture of multi-layered ceramic substrate
11/24/2004CN1177516C Heat radiator assembly and its assembling method
11/24/2004CN1177401C Surface mounting type switching mains and its mounting method
11/24/2004CN1177392C Electric connector and manufacturing method thereof
11/24/2004CN1177364C Device for electronic packaging and pin jig fixture
11/24/2004CN1177362C Radiating structure of integrated circuit (IC)
11/24/2004CN1177329C Bidirectional non-solid impedance controlled reference plane and its forming method
11/24/2004CN1177255C Flexible printed board
11/23/2004US6823374 Adjusting the cacheability of web documents according to the responsiveness of its content server
11/23/2004US6823040 X-ray inspection method and apparatus used for the same
11/23/2004US6822876 High-speed electrical router backplane with noise-isolated power distribution
11/23/2004US6822872 Housing for receiving a component which can be connected to the housing in a pluggable manner
11/23/2004US6822867 Electronic assembly with solderable heat sink and methods of manufacture
11/23/2004US6822725 Liquid crystal display substrates integrated by sealant formed inside cutting lines
11/23/2004US6822720 Liquid crystal display having improved connection between TFT and TCP
11/23/2004US6822468 Method and apparatus for implementing printed circuit board high potential testing to identify latent defects
11/23/2004US6822376 Method for making electrical connection to ultrasonic transducer
11/23/2004US6822339 Semiconductor device
11/23/2004US6822332 Fine line circuitization
11/23/2004US6822331 Electrical circuit assembly having components bonded together with electrically conductive joint structure comprising flexible mesh infiltrated by solder material; solder-free portion of mesh extends outside of joint, forming jumper
11/23/2004US6822320 Microelectronic connection components utilizing conductive cores and polymeric coatings
11/23/2004US6822191 Method for producing a trench structure in a polymer substrate
11/23/2004US6822170 Embedding resin and wiring substrate using the same
11/23/2004US6822169 Flexible printed circuit board and connecting method thereof
11/23/2004US6822168 Cable harness arrangement
11/23/2004US6821878 Area-array device assembly with pre-applied underfill layers on printed wiring board
11/23/2004US6821823 Molded substrate stiffener with embedded capacitors
11/23/2004US6821555 Edge connectors for printed circuit boards comprising conductive ink
11/23/2004US6821472 Method of laser machining materials with minimal thermal loading
11/23/2004US6821407 Anode and anode chamber for copper electroplating
11/23/2004US6821143 Device supporting a light-emitting diode for an automobile signalling system, and a method of manufacturing such a device
11/23/2004US6821130 Device and method using a flexible circuit secured for reliably inter-connecting components therein in the presence of vibration events
11/23/2004US6820798 Method for producing circuit arrangments
11/23/2004US6820794 Solderless test interface for a semiconductor device package
11/23/2004US6820545 Apparatus and method of screen printing
11/23/2004US6820544 Screen printing apparatus and method of screen printing
11/23/2004US6820525 Precision Fiducial
11/23/2004US6820332 Laminate circuit structure and method of fabricating
11/23/2004US6820331 Method of manufacturing a circuit board and its manufacturing apparatus
11/23/2004US6820330 Method for forming a multi-layer circuit assembly
11/23/2004US6820328 Method of removing heat from an electronic assemblage
11/23/2004US6820321 Holes are formed through a ferromagnetic substrate and plated with conductive material; substrate is used for a magnetic core; rings are etched on a substrate; minimal eddy current effects
11/18/2004WO2004100630A1 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
11/18/2004WO2004100629A1 Flux transferring device and method of transferring flux
11/18/2004WO2004100628A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof
11/18/2004WO2004100627A2 Method for the production of a printed board
11/18/2004WO2004100625A1 Rf module and production method thereof
11/18/2004WO2004100623A2 Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method
11/18/2004WO2004100316A2 Electronic system, printed circuit and radiocommunication module comprising a coaxial connector and corresponding assembly method
11/18/2004WO2004100264A1 Module including circuit elements
11/18/2004WO2004100260A1 High-density multi-layered printed wiring board, multi-chip carrier, and semiconductor package
11/18/2004WO2004100253A2 Electronic component as well as system support and panel for the production thereof
11/18/2004WO2004100186A1 Circuit protection device
11/18/2004WO2004100179A1 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
11/18/2004WO2004100136A1 An improved electrical connection between a suspension flexure cable and a head stack assembly flexible circuit
11/18/2004WO2004099836A1 Conductive patterned sheet utilizing multilayered conductive channels
11/18/2004WO2004099272A1 Photocuring/thermosetting inkjet composition and printed wiring board using same
11/18/2004WO2004098887A1 Screen printing device mask overlap mounting method, and screen printing device
11/18/2004WO2004054332A3 Strip-line topology for a high speed pcb with low dissipation
11/18/2004US20040229507 Miniature contact block packaging for printed circuit
11/18/2004US20040229480 Memory module
11/18/2004US20040229406 Stencil and method for depositing material onto a substrate
11/18/2004US20040229402 Low profile chip scale stacking system and method
11/18/2004US20040229396 Multilayer flip-chip substrate interconnect layout
11/18/2004US20040229391 LED lamp manufacturing process
11/18/2004US20040229070 Copper foil for printed-wiring board
11/18/2004US20040229035 Thermally conductive elastomeric pad
11/18/2004US20040229032 Electrical interconnect using locally conductive adhesive
11/18/2004US20040229025 Voltage tunable photodefinable dielectric and method of manufacture therefore
11/18/2004US20040229024 Multi-layer printed circuit board and method for manufacturing the same
11/18/2004US20040228964 Liquid drop supplying means is scanned; liquid crystal displays
11/18/2004US20040228539 Image coding apparatus and method, and program and recording medium
11/18/2004US20040228437 In-situ monitoring system for bonding process and method therefor
11/18/2004US20040228107 LED backlight module
11/18/2004US20040228096 Printed circuit board with improved cooling of electrical component
11/18/2004US20040228089 Temperature-controlled rework system
11/18/2004US20040228039 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit
11/18/2004US20040228036 Manufacturing method and apparatus of magnetic head device, and magnetic head device
11/18/2004US20040227897 Method of repairing electrode pattern defects
11/18/2004US20040227688 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
11/18/2004US20040227638 Seat buckle sensor
11/18/2004US20040227259 Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment
11/18/2004US20040227253 Flip chip package, circuit board thereof and packaging method thereof
11/18/2004US20040227239 Wiring board
11/18/2004US20040227230 Heat spreaders
11/18/2004US20040227227 Aerosol deposition process
11/18/2004US20040227224 Mounting structure of semiconductor device and mounting method thereof
11/18/2004US20040227197 Composition of carbon nitride, thin film transistor with the composition of carbon nitride, display device with the thin film transistor, and manufacturing method thereof
11/18/2004US20040227156 Surface mounted power supply circuit apparatus and method for manufacturing it
11/18/2004US20040226929 Method for fixing functional material apparatus for fixing functional material, device fabrication method, electrooptical device, and electronic equipment
11/18/2004US20040226914 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
11/18/2004US20040226828 electroplating multiple electrodes; electrically connecting electrodes via plating wires; activation; sealing with resin
11/18/2004US20040226827 Method of manufacturing electronic device
11/18/2004US20040226826 Electrolytic cells; immersion bath; wire mesh screen; variations in pattern density on substrate surface
11/18/2004US20040226745 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
11/18/2004US20040226744 Module with built-in circuit component and method for producing the same