| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/25/2004 | WO2004101865A2 Device for treating objects, in particular for plating printed circuit boards |
| 11/25/2004 | WO2004101863A2 Method and device for coating a substrate |
| 11/25/2004 | WO2004101849A1 Surface treating agent for tin or tin alloy material |
| 11/25/2004 | WO2004101201A1 Fine copper powder and method for producing the same |
| 11/25/2004 | WO2004101174A1 Method for forming relief image and paatern formed by that method |
| 11/25/2004 | WO2004086202B1 A security housing for a circuit |
| 11/25/2004 | WO2003025254A3 Device for the transport and wet-chemical or electrolytic treatment of very thin and planar items to be treated |
| 11/25/2004 | US20040235996 Thermoplastic polymer or thermosetting resin (particulary an epoxy) and a catalyst, and optionally a phenoxy-containing compound; expandable filler(s); solvent; expands with heat to form a closed-cell foam structure used to apply chip scale packages to electronic components |
| 11/25/2004 | US20040235317 Housing system for an electric device |
| 11/25/2004 | US20040235287 Method of manufacturing semiconductor package and method of manufacturing semiconductor device |
| 11/25/2004 | US20040235267 Lamination and delamination technique for thin film processing |
| 11/25/2004 | US20040235222 Integrated circuit stacking system and method |
| 11/25/2004 | US20040235221 Electronic device and method for manufacturing the same |
| 11/25/2004 | US20040235219 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 11/25/2004 | US20040234903 Forming a film with plasma deposition on photosensitive film on substrate and silicon donor with silane, disilane and nonsilicon exposure to ultraviolet radiation |
| 11/25/2004 | US20040234777 Method for electroless plating without precious metal sensitization |
| 11/25/2004 | US20040234763 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device |
| 11/25/2004 | US20040234752 Multi-layered structures and methods for manufacturing the multi-layered structures |
| 11/25/2004 | US20040234695 Composition and method for electroless plating of non-conductive substrates |
| 11/25/2004 | US20040234689 Method of using pre-applied underfill encapsulant |
| 11/25/2004 | US20040234679 Self-aligned corrosion stop for copper C4 and wirebond |
| 11/25/2004 | US20040234678 Pattern forming method, pattern forming apparatus, device manufacturing method, conductive film wiring, electro-optical device, and electronic apparatus |
| 11/25/2004 | US20040234119 System for and method of analyzing surface condition of PCB using RGB colors |
| 11/25/2004 | US20040233651 Method and components for manufacturing multi-layer modular electrical circuits |
| 11/25/2004 | US20040233650 Multilayer wiring board, method of mounting components, and image pick-up device |
| 11/25/2004 | US20040233642 Heat dissipation structure |
| 11/25/2004 | US20040233640 Electronic control unit |
| 11/25/2004 | US20040233611 Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| 11/25/2004 | US20040233596 Electrostatic discharge protection apparatus for a circuit board |
| 11/25/2004 | US20040233581 System and method related to a flexible circuit |
| 11/25/2004 | US20040233112 Low cost antennas using conductive plastics or conductive composites |
| 11/25/2004 | US20040233007 Electronic device having adjustable VCO |
| 11/25/2004 | US20040232562 System and method for increasing bump pad height |
| 11/25/2004 | US20040232561 System and method to increase die stand-off height |
| 11/25/2004 | US20040232560 Flip chip assembly process and substrate used therewith |
| 11/25/2004 | US20040232550 Solder filler |
| 11/25/2004 | US20040232530 Pre-applied thermoplastic reinforcement for electronic components |
| 11/25/2004 | US20040232508 Connector integrated with a LED element, method for manufacturing the same, and a LED including the same connector |
| 11/25/2004 | US20040232507 Sensor package |
| 11/25/2004 | US20040232452 Module component |
| 11/25/2004 | US20040232391 Anisotropic electroconducting connectors comprising epoxy resins and particles having breakable dielectric coatings |
| 11/25/2004 | US20040232386 Paste composed of metal or alloy powder having the form of fine metal particles linked in a chain shape; may be paramagnetic; capable of further reducing the electrical resistance of an anisotropic conductive film; forming a plated coating having a uniform crystal structure |
| 11/25/2004 | US20040232005 For treating electric circuit boards and other circuit carriers, particularly those that demand very thin base layers; counterelectrodes are each subdivided into at least two electrode segments: a contact-near electrode segment and a contact-remote electrode, each fed by a separate current source |
| 11/25/2004 | US20040231998 Two-step process involving immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst; produces a a seam-free and void-free metal microelectronic conductor. |
| 11/25/2004 | US20040231995 Contains a pyridinium, bipyridinium, phenanthrolinium, quinolinium or phenazinium salt in the form of onium with an N-alkyl, N-aralkyl, N-aryl, N-alkylene or N-aralkylene moiety; each via-hole is filled totally with the conductive material |
| 11/25/2004 | US20040231888 High speed circuit board and method for fabrication |
| 11/25/2004 | US20040231886 PCB design and method for providing vented blind vias |
| 11/25/2004 | US20040231885 Printed wiring boards having capacitors and methods of making thereof |
| 11/25/2004 | US20040231884 Circuit board assembly employing solder vent hole |
| 11/25/2004 | US20040231878 Electronic circuit connecting structure, and its connecting method |
| 11/25/2004 | US20040231873 Shielding base member and method of manufacturing the same |
| 11/25/2004 | US20040231872 EMI shielding for electronic component packaging |
| 11/25/2004 | US20040231597 Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation |
| 11/25/2004 | US20040231594 Microdeposition apparatus |
| 11/25/2004 | US20040231593 Apparatus for microdeposition of multiple fluid materials |
| 11/25/2004 | US20040231152 Method for pre-applied thermoplastic reinforcement of electronic components |
| 11/25/2004 | US20040231151 Multilayer circuit board and method for manufacturing the same |
| 11/25/2004 | US20040231150 Gating grid and method of making same |
| 11/25/2004 | US20040231141 Laminate and its producing method |
| 11/25/2004 | DE202004014811U1 Device for applying coating to circuit board or electronic module, includes reversing device for double-sided application of coating to circuit-board |
| 11/25/2004 | DE202004009010U1 Vorrichtung zur zumindest dreistufigen Säuberung durch Reinigen, Spülen und Trocknen, von im Wesentlichen flächigen Gegenständen Device for at least three-stage cleaning by cleaning, rinsing and drying, of substantially flat articles |
| 11/25/2004 | DE10360987A1 Erzeugung von Merkmalen in Dickfilmtinten Generation of features in thick film inks |
| 11/25/2004 | DE10332579A1 Electronic circuit board is manufactured with both external and internal conductor tracks |
| 11/25/2004 | DE10327195A1 Klebeverfahren und -vorrichtung Bonding method and apparatus |
| 11/25/2004 | DE10321260A1 Special purpose machine tool for electronic circuit boards has board moved under computer control relative to fixed cutting tools |
| 11/25/2004 | DE10319979A1 Verfahren zum Herstellen einer Leiterplatte A method of manufacturing a printed circuit board |
| 11/25/2004 | DE10319525A1 Strip-like arrangement comprises a strip conductor structure and electrically connected electronic components arranged on a strip conductor support which is connected to a covering part |
| 11/25/2004 | DE102004016744A1 Mehrschichtige gedruckte Schaltungskarte und Verfahren zur Herstellung derselben A multilayer printed circuit board and method of manufacturing the same |
| 11/24/2004 | EP1480298A2 Press fitting head, apparatus and method for press fitting |
| 11/24/2004 | EP1480291A2 Electronic assembly |
| 11/24/2004 | EP1480269A1 Printed Circuit Board with improved cooling of electrical component |
| 11/24/2004 | EP1480264A1 Electrical circuit device |
| 11/24/2004 | EP1479746A2 Flame resistant heat-activated pressure sensitive adhesive |
| 11/24/2004 | EP1479451A2 Viscous material noncontact jetting system |
| 11/24/2004 | EP1479060A1 Compact display assembly |
| 11/24/2004 | EP1478607A1 Method for metallizing titanate-based ceramics |
| 11/24/2004 | EP1478551A1 Method for creating a conductor track on a carrier component and corresponding carrier component |
| 11/24/2004 | EP1478249A1 Method and device for integrating electronics in textiles |
| 11/24/2004 | EP1404164B1 Method for manufacturing printed circuit boards from an extruded polymer |
| 11/24/2004 | EP1337687A4 Systems and methods for preventing and/or reducing corrosion in various articles |
| 11/24/2004 | EP1325545A4 Electronic transformer/inductor devices and methods for making same |
| 11/24/2004 | EP1278806B1 Adhesive bonding laminates |
| 11/24/2004 | EP1257157B1 Method for manufacturing printed circuit boards |
| 11/24/2004 | EP1200509B1 Composites of powdered fillers and polymer matrix and process for preparing them |
| 11/24/2004 | EP1200224B1 Printhead for jetting a hot liquid medium |
| 11/24/2004 | EP1193280B1 Polyimide resin composition with improved moisture resistance, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these |
| 11/24/2004 | EP1099362B1 A device and method for mounting electronic components on printed circuit boards |
| 11/24/2004 | EP1078426B1 Display device |
| 11/24/2004 | EP1002322B1 Chemical compounds made of intrinsically conductive polymers and metals |
| 11/24/2004 | EP0878984B1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg |
| 11/24/2004 | EP0710430B1 Processing low dielectric constant materials for high speed electronics |
| 11/24/2004 | CN1550124A Liquid crystal polymers for flexible circuits |
| 11/24/2004 | CN1550123A Component arrangement |
| 11/24/2004 | CN1550047A Surface-mountable, radiation-emitting component and method for the production thereof |
| 11/24/2004 | CN1549843A Fluxing compositions |
| 11/24/2004 | CN1549673A Multilayer printed circuit board and method for its manufacturing |
| 11/24/2004 | CN1549672A Bonded assemblied printing steel board and producing process applied to the surface of non-extended leg electronic parts |
| 11/24/2004 | CN1549671A Method for automatic generating device mark in printed circuit board design |
| 11/24/2004 | CN1549670A Method and apparatus for examining uniformity |
| 11/24/2004 | CN1549669A Method for producing plate body and method for producing circuit device utilizing the same plate body |