Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2005
05/11/2005CN1615200A Flux collection method and system
05/11/2005CN1615077A Device and method for installing electronic elements
05/11/2005CN1615070A Manufacture of PCB with resistors embedded
05/11/2005CN1615069A Multi-layer printed circuit board and fabricating method thereof
05/11/2005CN1615067A Differential wire assembling method for eliminating high speed board interferes
05/11/2005CN1614757A High density microvia substrate with high wireability
05/11/2005CN1614699A Circuit board transmitting high frequency signal
05/11/2005CN1614624A Touch panel and liquid crystal display apparatus using the same
05/11/2005CN1614351A Three directional measuring device
05/11/2005CN1614093A Etchant and replenishment solution therefor, and etching method and method for producing wiring board using them
05/11/2005CN1613932A Non-sticky water-based conformal coating material
05/11/2005CN1201645C Production method of laminated base material with high integrated level
05/11/2005CN1201644C Method and device for laser drilling of organic materials
05/11/2005CN1201643C 电子电路组件 Electronic circuit assembly
05/11/2005CN1201642C Printed circuit plate and its mfg. method
05/11/2005CN1201641C Duplicated material and making method thereof, and distribution substrate made of same
05/11/2005CN1201615C High-frequency circuit board and high-frequency antenna switch module using same
05/11/2005CN1201440C Connection terminal and method for mounting the same terminal on electric circuit board
05/11/2005CN1201383C Electronic parts mounting method and device therefor, and electronic parts device
05/11/2005CN1201348C Electronic device and manufacture thereof
05/11/2005CN1201265C Method for making smart cards capable of operating with and without contact
05/11/2005CN1201204C Method for forming pattern of non-photo-imaing ceramic strip
05/11/2005CN1201161C Probe card for probing wafers with raised contact elements
05/11/2005CN1200976C Heat resistant compsns.
05/11/2005CN1200808C Polyester film and its producing method
05/11/2005CN1200776C Sheet material surface treatment device
05/10/2005US6891967 Systems and methods for detecting defects in printed solder paste
05/10/2005US6891732 Multilayer circuit board and semiconductor device using the same
05/10/2005US6891463 Mounting structure of fuse connection terminals on board
05/10/2005US6891360 Plated probe structure
05/10/2005US6891314 Lattice array-structured piezoelectric actuator and method for producing the same
05/10/2005US6891272 Multi-path via interconnection structures and methods for manufacturing the same
05/10/2005US6891198 Film carrier tape for mounting an electronic part
05/10/2005US6891109 Monolithic ceramic substrate and method for making the same
05/10/2005US6890844 Methods and apparatus for forming solder balls
05/10/2005US6890795 Wafer level super stretch solder
05/10/2005US6890792 Method of formation of a capacitor with a solid electrolyte layer comprising an organic semiconductor, and method of production of circuit board
05/10/2005US6890664 Entry boards for use in drilling small holes
05/10/2005US6890663 Process of forming a pattern on a substrate
05/10/2005US6890629 Integrated thin film capacitor/inductor/interconnect system and method
05/10/2005US6890449 Method for manufacturing printed-circuit board
05/10/2005US6890447 Method of forming noble metal thin film pattern
05/10/2005US6890430 Solder dross removal apparatus and method
05/10/2005US6890416 Copper electroplating method and apparatus
05/10/2005US6890413 Method and apparatus for controlling local current to achieve uniform plating thickness
05/10/2005US6890050 Method for the printing of homogeneous electronic material with a multi-ejector print head
05/10/2005US6889886 Transfer apparatus for arraying small conductive bumps on substrate and/ or chip
05/10/2005US6889738 Method and apparatus for determining processing size of bonding material
05/10/2005US6889433 Method of manufacturing printed-circuit board
05/10/2005US6889432 First electric conductor wiring meets requirement of high-density fine wiring because it is formed by plating; second electric conductor wiring is formed by subtractive method, thus, flexing characteristic can be obtained
05/10/2005US6889431 Manufacturing method of electronic circuit including multilayer circuit board
05/10/2005US6889429 Copper leads has a lower thermal resistance than packages using solder ball leads, which lowers the die temperature to further improve reliability
05/10/2005US6889426 To prevent dimensional change during heating and rolling, circuit board is heated in its rolled state; spacers are used to prevent uncured thermosetting resin from contacting the wired circuit board which is wound over it
05/10/2005CA2310504C Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
05/06/2005WO2005041626A1 A method of producing a conductive layer on a substrate
05/06/2005WO2005041624A2 Method for printed circuit board panelization
05/06/2005WO2005041352A1 Device with integrated antenna for encapsulation of radio electronics and a method for fabrication of such devices
05/06/2005WO2005041265A2 Paste for forming an interconnect and interconnect formed from the paste
05/06/2005WO2005041213A1 Conductive paste
05/06/2005WO2005040461A1 Method and system for selectively coating metal surfaces
05/06/2005WO2005010990A3 Memory stack using flexible circuit and low-profile contacts
05/06/2005WO2005007929A3 Resin substrate having a resin-metal composite layer and method for manufacturing thereof
05/06/2005WO2003095709A3 Multistep release method for electrochemically fabricated structures
05/05/2005US20050096773 Procedure for determining modifications made to an electronic card and methods of fabricating an electronic card and an item equipment provided with an electronic card
05/05/2005US20050096432 Two-pack type adhesive
05/05/2005US20050096429 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto
05/05/2005US20050096423 Hardenable reaction resin system
05/05/2005US20050096409 Ink composition and method for use thereof in the manufacturing of electrochemical sensors
05/05/2005US20050096246 Solvent compositions containing chlorofluoroolefins
05/05/2005US20050095883 Electric connector with tine plate
05/05/2005US20050095882 Tine plate
05/05/2005US20050095880 Stress relieved contact array
05/05/2005US20050095878 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
05/05/2005US20050095866 Method for forming patterned conductive film, electrooptical device, and electronic appliance
05/05/2005US20050095862 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
05/05/2005US20050095748 Method for the selective surface treatment of planar workpieces
05/05/2005US20050095441 Curable coatings having low permeable to silfur-bearing gases
05/05/2005US20050095410 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
05/05/2005US20050095366 Jetting viscous liquid onto substrate; applying drops; valves; accuracy zones and edges; soldering
05/05/2005US20050095365 Conformal coating applicator and method
05/05/2005US20050094922 Printed circuit board including waveguide and method of producing the same
05/05/2005US20050094358 Information processing apparatus
05/05/2005US20050094356 Circuit assembly, producing method of the same, distribution unit and bus bar substrate
05/05/2005US20050094120 Direct exposure system and user interface
05/05/2005US20050094083 Liquid crystal display device and method of fabricating the same
05/05/2005US20050093957 Assembly for material deposition
05/05/2005US20050093938 System for delivering material onto a substrate
05/05/2005US20050093932 Micro-electromechanical fluid ejection device that incorporates a shape memory alloy based actuator
05/05/2005US20050093902 Drawing method, drawing apparatus and display apparatus
05/05/2005US20050093672 Electronic transformer/inductor devices and methods for making same
05/05/2005US20050093642 Circuit board transmitting high frequency signal
05/05/2005US20050093558 Carrier for cleaning sockets for semiconductor components having contact balls
05/05/2005US20050093201 Singular molded and co-molded electronic's packaging pre-forms
05/05/2005US20050093177 Semiconductor package, method for manufacturing the same and lead frame for use in the same
05/05/2005US20050093172 Electronic circuit device, and method and apparatus for manufacturing the same
05/05/2005US20050093164 Filler and electroconductive binder particles; stencil printing
05/05/2005US20050093153 BGA package with component protection on bottom
05/05/2005US20050093148 Interconnection element for BGA housings and method for producing the same
05/05/2005US20050093146 Support body for semiconductor element, method for manufacturing the same and semiconductor device
05/05/2005US20050093133 High density microvia substrate with high wireability