| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/17/2005 | US6893530 Removal cutting dusts; cleaning stacks under vacuum; vacuation, pressurization cycles; dryers |
| 05/17/2005 | US6893512 For use in electric or electronic device |
| 05/17/2005 | US6893326 Coating removal |
| 05/17/2005 | US6893271 Circuit board assembly, main and connector boards, and connector pins for same |
| 05/17/2005 | US6893244 Apparatus for encasing array packages |
| 05/17/2005 | US6892925 Solder hierarchy for lead free solder joint |
| 05/17/2005 | US6892646 Granular matter filled weapon guidance electronics unit |
| 05/17/2005 | US6892616 Cutting apparatus |
| 05/17/2005 | US6892452 Securing positive electrical connection between wiring board and semiconductor device; pattern forming bumps having pointed tapering end in vertical cross section |
| 05/17/2005 | US6892451 Method of making an interposer sub-assembly in a printed wiring board |
| 05/17/2005 | US6892441 Method for forming electrically conductive pathways |
| 05/17/2005 | CA2340527C Drilling apparatus for flexible sheet made of thick thermoplastic material |
| 05/12/2005 | WO2005043966A1 Solder stop barrier |
| 05/12/2005 | WO2005043965A2 Method for production of a transponder |
| 05/12/2005 | WO2005043758A2 Method and device for reflow soldering with volume flow control |
| 05/12/2005 | WO2005043699A2 Laser processing of a locally heated target material |
| 05/12/2005 | WO2005043681A1 Method of fabricating an rf substrate with selected electrical properties |
| 05/12/2005 | WO2005042807A1 Support layer for thin copper foil |
| 05/12/2005 | WO2005042203A1 Solder pastes for providing high elasticity, low rigidity solder joints |
| 05/12/2005 | WO2005041890A2 Erysipelothrix rhusiopathiae-haemophilus parasuis vaccine and methods of using the same |
| 05/12/2005 | WO2005033799A3 Spin-printing of electronic and display components |
| 05/12/2005 | WO2004093140A3 Electronic component and method of manufacturing same |
| 05/12/2005 | WO2003083182A3 Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths |
| 05/12/2005 | WO2001032323A8 Cleaning processes using hydrofluorocarbon and/or hydrochlorofluorocarbon compounds |
| 05/12/2005 | US20050101734 Acrylic adhesive sheet |
| 05/12/2005 | US20050101164 Compliant interconnect assembly |
| 05/12/2005 | US20050101136 Etching method and method of manufacturing circuit device using the same |
| 05/12/2005 | US20050101058 Microchip controller board manufacturing method |
| 05/12/2005 | US20050101052 Manufacturing method of semiconductor device and semiconductor device |
| 05/12/2005 | US20050101051 Method of manufacturing an electroconductive film, and an apparatus including it |
| 05/12/2005 | US20050101037 Test system with interconnect having conductive members and contacts on opposing sides |
| 05/12/2005 | US20050100822 Printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition derived from the reaction of a multifunctional oxetane compound, an acrylic acid, where the hydroxy group of the subsequent acrylate ester is reacted with an acid anhydride to form carboxyl groups |
| 05/12/2005 | US20050100743 Multilayer; joining layers with different thermal expansion |
| 05/12/2005 | US20050100735 Coating metal particles |
| 05/12/2005 | US20050100720 Multilayer printed wiring board with filled viahole structure |
| 05/12/2005 | US20050100719 Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto |
| 05/12/2005 | US20050100474 Anti-tombstoning lead free alloys for surface mount reflow soldering |
| 05/12/2005 | US20050100421 Circuit board router apparatus and method thereof |
| 05/12/2005 | US20050100294 Techniques for joining an opto-electronic module to a semiconductor package |
| 05/12/2005 | US20050099785 Substrate with stacked vias and fine circuits thereon, and method for fabricating the same |
| 05/12/2005 | US20050099784 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 05/12/2005 | US20050099783 Hyperbga buildup laminate |
| 05/12/2005 | US20050099778 Circuit assembly and method for producing the same |
| 05/12/2005 | US20050099763 Controlled compliance fine pitch electrical interconnect |
| 05/12/2005 | US20050099762 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance |
| 05/12/2005 | US20050099402 Touch panel and liquid crystal display apparatus using the same |
| 05/12/2005 | US20050099089 Method for enhancing epoxy adhesion to gold surfaces |
| 05/12/2005 | US20050098902 Anisotropic conductive film bonding pad |
| 05/12/2005 | US20050098901 Bonding structure with compliant bumps |
| 05/12/2005 | US20050098885 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/12/2005 | US20050098882 Multilayer wiring circuit board |
| 05/12/2005 | US20050098875 Semiconductor package board using a metal base |
| 05/12/2005 | US20050098874 Ceramic multilayer substrate and method for manufacturing the same |
| 05/12/2005 | US20050098868 Multi-chips module assembly package |
| 05/12/2005 | US20050098857 Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
| 05/12/2005 | US20050098775 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment |
| 05/12/2005 | US20050098613 Method for diffusion bond welding for use in a multilayer electronic assembly |
| 05/12/2005 | US20050098611 Substrate for producing a soldering connection |
| 05/12/2005 | US20050098610 Apparatus and method for mounting electronic components |
| 05/12/2005 | US20050098607 Method and structure for implementing column attach coupled noise suppressor |
| 05/12/2005 | US20050098606 Ball mounting apparatus and method |
| 05/12/2005 | US20050098549 Laser beam machining apparatus |
| 05/12/2005 | US20050098538 Methods of cleaning copper surfaces in the manufacture of printed circuit boards |
| 05/12/2005 | US20050098537 Method for large-area patterning dissolved polymers by making use of an active stamp |
| 05/12/2005 | US20050098533 Method and structure for substrate having inserted electrodes for flat display device and the device using the structure |
| 05/12/2005 | US20050098439 immersing substrate in baths containing plating solutions, then washing the surfaces, forming a second plating layer and drying; filling pits for fine wires formed in semiconductor wafers with copper or alloys |
| 05/12/2005 | US20050098347 Multi-layer printed circuit board and fabricating method thereof |
| 05/12/2005 | US20050098346 Reducing noise effects in circuit boards |
| 05/12/2005 | US20050098338 Electronic part, and electronic part mounting element and an process for manufacturing such the articles |
| 05/12/2005 | US20050098270 Bonding flexible film circuit and electronic circuit board |
| 05/12/2005 | US20050098262 Method of laminating copper foil onto a printed circuit board |
| 05/12/2005 | US20050098254 Method and apparatus for determining processing size of bonding material |
| 05/12/2005 | US20050098099 Patterning apparatus and film patterning method |
| 05/12/2005 | US20050097735 Process for forming metal layers |
| 05/12/2005 | US20050097727 Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board |
| 05/12/2005 | US20050097716 Method of manufacturing piezoelectric device and ferroelectric device, droplet ejection head, and electronic equipment |
| 05/12/2005 | DE4335879B4 Anordnung zur Qualitätskontrolle und -überwachung von durchkontaktierten Mehrlagen-Leiterplatten Arrangement for quality control and monitoring of plated through multi-layer printed circuit boards |
| 05/12/2005 | DE19853805B4 Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung Electrically conductive, thermoplastic and heat-activatable adhesive film and the use thereof |
| 05/12/2005 | DE10392578T5 System und Verfahren zur Herstellung von gedruckten Schaltungsplatinen unter Verwendung von nichtgleichmässig modifizierten Bildern System and method for manufacture of printed circuit boards using non-uniformly modified images |
| 05/12/2005 | DE10392500T5 Lottragende Artikel und Verfahren zum Zurückhalten einer Lotmasse darauf Solder-bearing articles and methods for retaining a solder mass on it, |
| 05/12/2005 | DE10358149B3 Process for contact-free transport and treatment of flat material by wet chemical and/or electrolytic processing useful in the transport and treatment, e.g. cleaning and etching, of conductive films and plates |
| 05/12/2005 | CA2544298A1 Erysipelothrix rhusiopathiae-haemophilus parasuis vaccine and methods of using the same |
| 05/12/2005 | CA2543594A1 Support layer for thin copper foil |
| 05/12/2005 | CA2543463A1 Laser processing of a locally heated target material |
| 05/12/2005 | CA2542132A1 Method of fabricating an rf substrate with selected electrical properties |
| 05/11/2005 | EP1530411A1 Circuit assembly, producing method of the same, distribution unit and bus bar substrate |
| 05/11/2005 | EP1529812A1 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto |
| 05/11/2005 | EP1529419A1 An electronic product, a body and a method of manufacturing |
| 05/11/2005 | EP1529126A2 Electrolytic copper plating solutions |
| 05/11/2005 | EP1528977A1 Method for the production of a fixed connection between two layers of a multilayer system, and multilayer system |
| 05/11/2005 | EP1163080B1 Filling device and method for filling balls in the apertures of a ball-receiving element |
| 05/11/2005 | CN2699626Y Multi-board type printed circuit board positioning equipment |
| 05/11/2005 | CN1615676A Circuit-component-containing module |
| 05/11/2005 | CN1615560A Grouped element transmission channel link termination assemblies |
| 05/11/2005 | CN1615559A Grouped element transmission channel link |
| 05/11/2005 | CN1615542A Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| 05/11/2005 | CN1615468A A method of applying an edge electrode pattern to a touch screen |
| 05/11/2005 | CN1615379A Electrode and apparatus for plating |
| 05/11/2005 | CN1615347A Method of producing coating composition and coating composition made therefrom |
| 05/11/2005 | CN1615201A Soldering method and solder alloy for additional supply |