| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/19/2005 | US20050105276 Environmentally tuned circuit card assembly and method for manufacturing the same |
| 05/19/2005 | US20050105250 Solid electrolytic capacitor |
| 05/19/2005 | US20050105218 Method and apparatus controlling communication in the main flex and bridge flex circuits for multiple micro-actuators in a hard disk drive |
| 05/19/2005 | US20050104922 Inkjet printhead with integral nozzle plate |
| 05/19/2005 | US20050104912 Droplet applying method and droplet applying device, and device and electronic equipment |
| 05/19/2005 | US20050104692 Signal transmission structure |
| 05/19/2005 | US20050104222 Flip chip device having supportable bar and mounting structure thereof |
| 05/19/2005 | US20050104221 High wireability microvia substrate |
| 05/19/2005 | US20050104220 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
| 05/19/2005 | US20050104218 High frequency circuit chip and method of producing the same |
| 05/19/2005 | US20050104213 Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same |
| 05/19/2005 | US20050104212 Mounting structure for semiconductor parts and semiconductor device |
| 05/19/2005 | US20050104210 Use of palladium in IC manufacturing with conductive polymer bump |
| 05/19/2005 | US20050104205 Substrate for electrical device and methods of manufacturing the same |
| 05/19/2005 | US20050104198 Circuit device and manufacturing method thereof |
| 05/19/2005 | US20050104191 Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication |
| 05/19/2005 | US20050103828 Solder wave process for solder shunts for printed circuit board |
| 05/19/2005 | US20050103826 Via heat sink material |
| 05/19/2005 | US20050103624 Biosensor and method of making |
| 05/19/2005 | US20050103601 Device and method for transporting flat workpieces in conveyorized processing lines |
| 05/19/2005 | US20050103524 Double sided wired circuit board |
| 05/19/2005 | US20050103523 Apparatus and method for routing electrical signals |
| 05/19/2005 | US20050103522 Stair step printed circuit board structures for high speed signal transmissions |
| 05/19/2005 | US20050103521 Surface mounting a power converter |
| 05/19/2005 | US20050103520 Wiring substrate and manufacturing process of the same |
| 05/19/2005 | US20050103516 Flip-chip mounting circuit board, manufacturing method thereof and integrated circuit device |
| 05/19/2005 | US20050102833 Release height adjustment of stressy metal devices by annealing before and after release |
| 05/19/2005 | US20050102831 Roughening the surface of an epoxy resin dielectric with silica filler particles by dipping in a heated permanganic acid bath for at least 20 minutes; reliable adhesion between wiring pattern layers |
| 05/19/2005 | US20050102830 Electrolessly plating a thin copper film onto a dielectric, forming plated resists, electrolytically plating copper, removing the plated resists and thin copper film layers, etching the wiring pattern layers, and forming another dielectric layer; high performance; miniaturization |
| 05/19/2005 | US20050102828 Recovery processing method of an electrode |
| 05/19/2005 | US20050102827 Frame attaching process |
| 05/19/2005 | US20050102820 Process to fabricate narrow-track CPP read head |
| 05/19/2005 | US20050102808 Process for producing laminated ceramic capacitor |
| 05/19/2005 | US20050102807 Matrix type actuator |
| 05/19/2005 | DE20221189U1 Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich Circuit board with at least one rigid portion and at least one flexible area |
| 05/19/2005 | DE20221182U1 Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin |
| 05/19/2005 | DE10358147B3 Transport and treatment method for circuit boards and conductor foils has electrolyte flow for electrolytic processing assisting transport of circuit boards or conductor foils in transport direction |
| 05/19/2005 | DE10353936B3 Method for removal of solder oxide residues from component of solder bath used in electronics manufacture by application of cleaning medium before immersion of component in solder bath |
| 05/19/2005 | DE10347338A1 Dünnstsubstrathalter Dünnstsubstrathalter |
| 05/19/2005 | DE102004038401A1 Flexible flat conductor and printed circuit board connecting method, involves heating applied brazing deposit through opening, present in or against electro-conducting zone, traversing conductor for soldering conductor to board |
| 05/19/2005 | CA2541977A1 Vertical removal of excess solder from a circuit substrate |
| 05/18/2005 | EP1531661A1 Circuit assembly and method for producing the same |
| 05/18/2005 | EP1531660A1 Surface mounting a power converter |
| 05/18/2005 | EP1531658A1 Double sided wired circuit board |
| 05/18/2005 | EP1531657A1 Multi-layer substrates having at least two dissimilar polyimide layers and a conductive layer, useful for electronics-type applications, and compositions relating thereto |
| 05/18/2005 | EP1531656A2 Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
| 05/18/2005 | EP1531655A1 Electronic module with removable circuitry and method for making |
| 05/18/2005 | EP1531654A1 Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
| 05/18/2005 | EP1531653A1 Differential signal electrical connectors |
| 05/18/2005 | EP1531492A2 Semiconductor device and its manufacturing method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
| 05/18/2005 | EP1531366A2 Back to front alignment with latent imaging |
| 05/18/2005 | EP1531051A2 Improvements relating to inkjet printerhead blockage detection |
| 05/18/2005 | EP1531025A1 Tin-zinc lead-free solder and solder-joined part |
| 05/18/2005 | EP1531024A1 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 05/18/2005 | EP1438881B1 Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby |
| 05/18/2005 | EP1405278A4 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 05/18/2005 | EP1324850B1 Method for ablating points of contact (debumping) |
| 05/18/2005 | EP1322967B1 Module for a testing device for testing printed circuit boards |
| 05/18/2005 | CN2701220Y Special tool for mounting spring clip |
| 05/18/2005 | CN2701219Y Automatic stripper for printed circuit board |
| 05/18/2005 | CN1618261A Electric circuit module and method for its assembly |
| 05/18/2005 | CN1618091A Compact display assembly |
| 05/18/2005 | CN1617950A Method for repairing fine pattern and apparatus for repairing fine pattern |
| 05/18/2005 | CN1617657A Double sided wired circuit board |
| 05/18/2005 | CN1617656A Treating method and treating device for electronic parts |
| 05/18/2005 | CN1617655A Positioning system positioning method for thin printed circuit board and pressing positioning device |
| 05/18/2005 | CN1617654A Anti-interference circuit board design and related program and storage medium |
| 05/18/2005 | CN1617653A Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
| 05/18/2005 | CN1617651A Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| 05/18/2005 | CN1617394A Connector |
| 05/18/2005 | CN1617295A Circuit board transferring apparatus and method and solder ball mounting method |
| 05/18/2005 | CN1616526A Method of making liquid crystal polymer films |
| 05/18/2005 | CN1616451A Process for the purification of thiophenes |
| 05/18/2005 | CN1616172A Method for producing blind hole on multiple layer base plate and automatic drilling machine for realizing said method |
| 05/18/2005 | CN1616156A Dispensing nozzle for adhesive and dispensing device for adhesive |
| 05/18/2005 | CN1202697C Method for filling through hole |
| 05/18/2005 | CN1202696C Method for mfg. printed circuit board |
| 05/18/2005 | CN1202516C Magnetic head gimbal assembly |
| 05/18/2005 | CN1202180C Ultraviolet curing resin composition and photoprotection welding ink |
| 05/17/2005 | US6894903 Optical data link |
| 05/17/2005 | US6894888 Multilayer board having precise perforations and circuit substrate having precise through-holes |
| 05/17/2005 | US6894585 High quality factor (Q) planar spiral inductor based CATV diplexer and telephony module |
| 05/17/2005 | US6894582 Microwave device having a slotted coaxial cable-to-microstrip connection and related methods |
| 05/17/2005 | US6894515 Inspection unit and method of manufacturing substrate |
| 05/17/2005 | US6894378 Electronic component with stacked semiconductor chips |
| 05/17/2005 | US6894375 Semiconductor device, semiconductor module and hard disk |
| 05/17/2005 | US6894374 Semiconductor package insulation film and manufacturing method thereof |
| 05/17/2005 | US6894373 Semiconductor chip wire bonded to substrate; encapsulation with resin; striped pattern |
| 05/17/2005 | US6894229 Mechanically enhanced package and method of making same |
| 05/17/2005 | US6894228 High performance dense wire for printed circuit board |
| 05/17/2005 | US6894105 Dyed fluoropolymers |
| 05/17/2005 | US6893952 Methods of forming a ball grid array including a non-conductive polymer core and a silver or silver alloy outer layer |
| 05/17/2005 | US6893904 Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed |
| 05/17/2005 | US6893885 Method for electrically and mechanically connecting microstructures using solder |
| 05/17/2005 | US6893790 Microencapsulated photohardenable particles in binder; exposure to actinic radiation |
| 05/17/2005 | US6893742 Copper foil with low profile bond enhancement |
| 05/17/2005 | US6893738 Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil |
| 05/17/2005 | US6893710 Multilayer ceramic composition |
| 05/17/2005 | US6893681 Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same |
| 05/17/2005 | US6893576 Method of manufacturing multi-layer printed wiring board |