| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/25/2005 | CN1619731A Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
| 05/25/2005 | CN1619421A Exposure apparatus extendible corresponding to substrate for printed circuitboard |
| 05/25/2005 | CN1618609A Apparatus for supplying a droplet on a substrate and method of manufacturing display apparatus using the same |
| 05/25/2005 | CN1618556A Setting method of printing circuit board hole drilling path |
| 05/25/2005 | CN1618555A Processing method of variable speed cutting tool |
| 05/25/2005 | CN1618532A Vacuum cleaner |
| 05/25/2005 | CN1203748C Electronic device producing method |
| 05/25/2005 | CN1203745C Method for mfg. of laminated circuit assembly |
| 05/25/2005 | CN1203742C Etching liquid, and method for mfg .flexible distributing board |
| 05/25/2005 | CN1203741C Method for mfg. printed circuit board |
| 05/25/2005 | CN1203740C Method for mfg. flexible base board |
| 05/25/2005 | CN1203739C Interconnect assembly for printed circuit boards and manufacturing method thereof |
| 05/25/2005 | CN1203738C Method for manufacturing flexible circuit board |
| 05/25/2005 | CN1203737C Making process of metallized ceramic base plate |
| 05/25/2005 | CN1203736C Laser imaging of thin film circuit material |
| 05/25/2005 | CN1203735C Method for producing severe tolerance imbedded elements for printing circuit board |
| 05/25/2005 | CN1203734C Method for manufacturing printed circuit board |
| 05/25/2005 | CN1203733C Solder-bearing wafer for usein soldering operations |
| 05/25/2005 | CN1203731C Method for producing multilayer circuit board and multilayer circuit board produced by said method |
| 05/25/2005 | CN1203554C Module with film circuit |
| 05/25/2005 | CN1203546C High density design for organic chip carrier |
| 05/25/2005 | CN1203542C Power semiconductor device |
| 05/25/2005 | CN1203375C Two-side exposure system |
| 05/25/2005 | CN1203374C Photopolymerizable thermosetting resin compositions and its use |
| 05/25/2005 | CN1203371C Method for individualised marking of circuit boards |
| 05/25/2005 | CN1203358C Display unit installation and connection device |
| 05/25/2005 | CN1203163C 洗涤液 Washing liquid |
| 05/24/2005 | US6898775 System for ensuring correct pin assignments between system board connections using common mapping files |
| 05/24/2005 | US6898058 Composite substrate for use in magnetic recording-and-reproducing device |
| 05/24/2005 | US6897956 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device |
| 05/24/2005 | US6897933 Substrate terminal structure, liquid-crystal device and electronic apparatus |
| 05/24/2005 | US6897761 Ball grid array resistor network |
| 05/24/2005 | US6897571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 05/24/2005 | US6897568 Electronic component with flexible contacting pads and method for producing the electronic component |
| 05/24/2005 | US6897562 Electronic component and method of manufacturing same |
| 05/24/2005 | US6897405 Method of laser milling using constant tool path algorithm |
| 05/24/2005 | US6897378 Technique for surface mounting electrical components to a circuit board |
| 05/24/2005 | US6897151 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/24/2005 | US6897142 Formation of solder balls having resin member as reinforcement |
| 05/24/2005 | US6897093 Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package |
| 05/24/2005 | US6897092 Method of supporting a substrate film |
| 05/24/2005 | US6897078 Programmable multi-chip module |
| 05/24/2005 | US6896967 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/24/2005 | US6896953 Wiring board and process of producing the same |
| 05/24/2005 | US6896938 Vapor deposition |
| 05/24/2005 | US6896784 Method for controlling local current to achieve uniform plating thickness |
| 05/24/2005 | US6896526 Flanged terminal pins for DC/DC converters |
| 05/24/2005 | US6896525 IC tester socket with flexible contact points |
| 05/24/2005 | US6896393 Light emitting module |
| 05/24/2005 | US6896173 Method of fabricating circuit substrate |
| 05/24/2005 | US6896172 Lead-free solder paste for reflow soldering |
| 05/24/2005 | US6895667 Transfer of patterned metal by cold-welding |
| 05/24/2005 | US6895661 Component alignment apparatuses and methods |
| 05/24/2005 | CA2141604C Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
| 05/19/2005 | WO2005046299A1 An apparatus and method for manufacturing integrated circuits, microelectromechanical system (mems) devices and nanofilters |
| 05/19/2005 | WO2005046298A1 Method of conformal coating using noncontact dispensing |
| 05/19/2005 | WO2005046297A2 Measurement standard for testing optical recognition systems in smd assembly and method for producing said standard |
| 05/19/2005 | WO2005046289A1 Method and device for heating flat objects having a metallic coating |
| 05/19/2005 | WO2005045997A2 An electrical circuit assembly with improved shock resistance |
| 05/19/2005 | WO2005045851A1 Insulated conductive particles and an anisotropic conductive film containing the particles |
| 05/19/2005 | WO2005045098A1 Process for etching metal and alloy surfaces |
| 05/19/2005 | WO2005044969A1 Solvent compositions containing chlorofluoroolefins or hydrochiloroolefins |
| 05/19/2005 | WO2005044931A1 Inkjet ink composition |
| 05/19/2005 | WO2005044893A1 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
| 05/19/2005 | WO2005044777A1 Tetra(meth)acrylate compound, curing composition containing same, and cured products of those |
| 05/19/2005 | WO2005044499A1 Vertical removal of excess solder from a circuit substrate |
| 05/19/2005 | WO2005044451A1 Electrical connection of components |
| 05/19/2005 | WO2004025724A9 Jet singulation of a substrate |
| 05/19/2005 | US20050108671 Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package design |
| 05/19/2005 | US20050107975 Method of diagnosing circuit layout and computer system for performing the same |
| 05/19/2005 | US20050107556 Polymer from a phosphorus-containing polyol, a polyisocyanate having two or more functional groups and a hydroxyl group-containing (meth)acrylate; inks, paint coating compositions and adhesives; solder resists, for film-like printed wiring boards, miniature devices, photosensitive compositions |
| 05/19/2005 | US20050107501 Compound resin molding and process for producing the same |
| 05/19/2005 | US20050107497 thermosetting resins, substrates, sheet, laminated boards, resin-bearing copper foils, copper-clad laminates, tapes, printed circuits, prepregs and adhesive sheets, having dimensional stability, heat resistance and flame retardance |
| 05/19/2005 | US20050107003 Ultra fine particle film forming method and apparatus |
| 05/19/2005 | US20050106917 Multifunctional apparatus |
| 05/19/2005 | US20050106913 Floating contact assembly for a steering wheel |
| 05/19/2005 | US20050106904 Connector and method of manufacturing the same |
| 05/19/2005 | US20050106903 Joint member and joint connector for wire harness |
| 05/19/2005 | US20050106902 Interposer with electrical contact button and method |
| 05/19/2005 | US20050106867 Method and device for treating objects by means of a liquid |
| 05/19/2005 | US20050106854 Process for manufacturing a wiring substrate |
| 05/19/2005 | US20050106839 Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance |
| 05/19/2005 | US20050106834 Method and apparatus for filling vias |
| 05/19/2005 | US20050106775 Pattern forming method, film structure, electro-optical apparatus, and electronic device |
| 05/19/2005 | US20050106507 Device and method for laser structuring functional polymers and the use thereof |
| 05/19/2005 | US20050106505 defining a base bump of solder mask material by a photolithography process, and covering the base bump with a conductive bump layer of copper |
| 05/19/2005 | US20050106504 Photoimaged dielectric polymer and film, and circuit package containing the same |
| 05/19/2005 | US20050106408 features separated by distance bridged by tin whisker; silver or silver alloy layer coating at least one surface of features; fine grain tin or tin alloy layer directly coating silver layer; silver phase is beneficial to minimize increase in resistivity due to oxidation of fretting wear debris |
| 05/19/2005 | US20050106382 comprises a metal powder having the form of a lot of fine metal particles being linked in a chain shape as a conductive component formed of a metal having paramagnetism |
| 05/19/2005 | US20050106370 Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| 05/19/2005 | US20050106368 Printed circuit board and manufacturing method thereof |
| 05/19/2005 | US20050106366 Biocompatibility protective coating; dielectrics; prevent current leakage |
| 05/19/2005 | US20050106337 Transfer sheet |
| 05/19/2005 | US20050106329 Selective deposition of solder particles over metal interconnect features on electronic device substrate, such as a silicon wafer substrate, to provide electrical interconnection between substrate interconnect features and devices to be attached to substrate, using electrokinetic or electrostatic means |
| 05/19/2005 | US20050106060 Lead-free solder balls and method for the production thereof |
| 05/19/2005 | US20050106059 Controlled melting; silver with silver or copper; reduced expansion; stress relieving |
| 05/19/2005 | US20050105915 Compact optical transceivers for host bus adapters |
| 05/19/2005 | US20050105478 Duplexer fabrication method using embedded PCB and duplexer fabricated by the same |
| 05/19/2005 | US20050105360 Memory card with adapter |
| 05/19/2005 | US20050105281 Electronic module with removable circuitry and method therefor |