Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2005
05/26/2005WO2005048669A1 Flexible devices
05/26/2005WO2005048667A1 Conductive paste and multilayer ceramic substrate
05/26/2005WO2005048666A1 Partially flexible circuit board
05/26/2005WO2005048663A2 Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards
05/26/2005WO2005048408A1 Connector chip and manufacturing method thereof
05/26/2005WO2005048407A1 Anisotropic conductive sheet, manufacturing method thereof, and product using the same
05/26/2005WO2005048303A2 Anti-tombstoning lead free alloys for surface mount reflow soldering
05/26/2005WO2005047063A1 Method for fixing ribbon cable systems
05/26/2005WO2005046994A2 A frame unit for tensioning a printing screen and a jig for fitting a printing screen to or removing a printing screen from a frame unit
05/26/2005WO2005046986A1 Release film for forming ceramic green sheet
05/26/2005WO2004107831A3 A fabric interface
05/26/2005WO2004105993A8 Electrode for machine for electromagnetic induction welding of the layers forming a multi-layer printed circuit
05/26/2005WO2004034434A9 Components, methods and assemblies for multi-chip packages
05/26/2005US20050114816 Parallel design processes for integrated circuits
05/26/2005US20050112948 Mechanism for testing printed circuit board
05/26/2005US20050112913 Device and method using flexible circuit secured for reliably inter-connecting components therein in the presence of vibration events
05/26/2005US20050112911 Plug
05/26/2005US20050112910 Method and apparatus to pre-form two or more integrated connectorless cables in the flexible sections of rigid-flex printed circuit boards
05/26/2005US20050112880 Selective plating of package terminals
05/26/2005US20050112810 Method for manufacturing conductive pattern forming body
05/26/2005US20050112798 Electronics circuit manufacture
05/26/2005US20050112500 Photocurable/therosetting resin composition, photosensitive dry film formed therefrom and method of forming pattern with the same
05/26/2005US20050112369 Printed circuit board manufacture
05/26/2005US20050112344 Apparatus and method for use in printed circuit board drilling applications
05/26/2005US20050111280 Memory card with push-push connector
05/26/2005US20050111206 Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials
05/26/2005US20050111205 Printed wiring board for mounting electronic components, and production process thereof and semiconductor device
05/26/2005US20050111166 Circuit assembly and heat-insulating member for circuit assembly
05/26/2005US20050111162 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
05/26/2005US20050110935 Semiconductor chip, tape carrier package having the same mounted thereon, and liquid crystal display apparatus including the tape carrier package
05/26/2005US20050110852 Apparatus for supplying a droplet on a substrate and method of manufacturing display apparatus using the same
05/26/2005US20050110406 Interconnector, method for manufacturing a plasma display device using the same, and a plasma display device with the same
05/26/2005US20050110397 Film forming method, device manufacturing method, and electro-optic device
05/26/2005US20050110166 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
05/26/2005US20050110162 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
05/26/2005US20050110155 Semiconductor device and method of manufacturing the same, circuit board and electronic device
05/26/2005US20050110149 Semiconductor multilayer wiring board and method of forming the same
05/26/2005US20050110049 Semiconductor device and its manufacturing method, electronic module, and electronic unit
05/26/2005US20050109853 Print-circuit board forming method and print-circuit board
05/26/2005US20050109820 Low temperature solder chip attach structure and process to produce a high temperature interconnection
05/26/2005US20050109734 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the
05/26/2005US20050109631 Tape substrate and method for fabricating the same
05/26/2005US20050109535 High performance chip carrier substrate
05/26/2005US20050109534 Circuit board with localized stiffener for enhanced circuit component reliability
05/26/2005US20050109533 Circuit board and manufacturing method thereof that can easily provide insulating film between projecting electrodes
05/26/2005US20050109532 Method for manufacturing a sequential backplane
05/26/2005US20050109524 Solder-bearing contacts and method of manufacture thereof and use in connectors
05/26/2005US20050108876 Methods for making plated through holes usable as interconnection wire or probe attachments
05/26/2005US20050108875 Methods for making vertical electric feed through structures usable to form removable substrate tiles in a wafer test system
05/26/2005US20050108874 Method of manufacturing capacitor-embedded printed circuit board (PCB)
05/25/2005EP1534054A2 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
05/25/2005EP1534052A2 Circuit board with localized stiffener for enchanced circuit component reliability
05/25/2005EP1534051A1 Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials
05/25/2005EP1534050A1 Process for manufacturing printed circuit boards and printed circuit board
05/25/2005EP1533400A1 A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus
05/25/2005EP1533354A1 Anisotropic conductive film
05/25/2005EP1532851A1 Production of electronic organic circuits by contact printing
05/25/2005EP1532850A2 Method for forming printing inspection data
05/25/2005EP1532842A1 Hearing aid or similar audio device and method for producing a hearing aid
05/25/2005EP1532681A1 Multi-layer circuit carrier and production thereof
05/25/2005EP1459609B1 System to form a layering of electronically-interactive material
05/25/2005EP1303575B1 Liquid crystal polymers for flexible circuits
05/25/2005EP1078012B1 Composition and method for producing polythioethers having pendent methyl chains
05/25/2005EP0989914A4 Multilayer metalized composite on polymer film product and process
05/25/2005EP0886996B1 Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation
05/25/2005DE4422876B4 Elektrischer oder elektronischer Anschlußkontakt für gedruckte Schaltungen, Verfahren zu dessen Herstellung und seiner Befestigung an der gedruckten Schaltung Electrical or electronic connection contact for printed circuits, process for its preparation and its attachment to the printed circuit
05/25/2005DE202005004664U1 Technical screen printing screen has a fine mesh, electrically conducting, screen, preferably of stainless steel wires, with spaced electrical connections to the wires to provide for its resistive heating
05/25/2005DE19519499B4 Thermoplastische Klebstoffolie und deren Verwendung Thermoplastic adhesive and their use
05/25/2005DE10392557T5 Filtration von Flussmittelverunreinigungen Filtration flux impurities
05/25/2005DE10348734A1 Verfahren und System zum selektiven Beschichten von Metalloberflächen Method and system for selective coating of metal surfaces
05/25/2005DE10347622A1 Substrate for making solder connection to second substrate or chip has solder pad with solderable adhesive surfaces in addition to electrical contact surface
05/25/2005DE10347518A1 Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher Electronic component, circuit board design and electronics unit with heat storage
05/25/2005DE10326788B4 Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung Contact surfaces for electrical contacts and processes for preparing
05/25/2005DE102004041035A1 Attaching components to substrate involves clamping substrate between heating plate(s), counter pressure plate after populating with components or chips to harden adhesive, whereby at least one plate supports substrate over its area
05/25/2005CN2702581Y Circuit board assembly and chip module using the same
05/25/2005CN2702580Y Modified small-sized printed circuit board carrier
05/25/2005CN1620844A Printed-wiring board and electronic device
05/25/2005CN1620843A Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
05/25/2005CN1620725A Electrical component assembly and method of fabrication
05/25/2005CN1620341A Method and apparatus for detecting a liquid spray pattern
05/25/2005CN1620245A Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof
05/25/2005CN1620236A Interposer with electrical contact button and method
05/25/2005CN1620232A Wiring substrate and manufacturing process of the same
05/25/2005CN1620231A Process for manufacturing a wiring substrate
05/25/2005CN1620230A Process for manufacturing a wiring substrate
05/25/2005CN1620229A Process for manufacturing a wiring substrate
05/25/2005CN1620228A Method of realizing local crest welding and printed circuit board
05/25/2005CN1620227A Method of manufacturing substrate for circuit board and smart label having the substrate
05/25/2005CN1620226A Method of manufacturing capacitor-embedded printed circuit board (PCD)
05/25/2005CN1620225A Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
05/25/2005CN1620224A Printed wiring board for mounting electronic components, and production process thereof and semiconductor device
05/25/2005CN1620223A Multilayer printed wiring board
05/25/2005CN1620221A Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
05/25/2005CN1620220A Pattern transferring material, its manufacturing method, wiring substrate manufactured by using the same
05/25/2005CN1620202A Organic electric excitation lighting display
05/25/2005CN1620095A Multifunctional apparatus
05/25/2005CN1619809A Interconnect structures with engineered dielectrics with nanocolumnar porosity
05/25/2005CN1619797A Connector and method of manufacturing the same
05/25/2005CN1619768A Method of soldering semiconductor part and mounted structure of semiconductor part
05/25/2005CN1619735A Key board and manufacturing method of its flexible circuit board