| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/02/2005 | US20050115440 Granular matter filled weapon guidance electronics unit |
| 06/02/2005 | US20050115068 Apparatus for manufacturing a wiring board and method for manufacturing a wiring board |
| 06/02/2005 | US20050115066 Production method of wired circuit board |
| 06/02/2005 | US20050115039 Low temperature sintering of lead titanate, lead zirconate and lead zinc niobate; forming multilayer material having stable insulation resistance under high temperature and humidity conditions |
| 06/02/2005 | DE3913966B4 Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung Dispersion adhesive for electroless plating, as well as use for the preparation of a printed circuit |
| 06/02/2005 | DE202005005354U1 Anordnung mit einem Kontaktelement Arrangement with a contact element |
| 06/02/2005 | DE202005004295U1 Mounting plate for use with electrical circuit boards has a layer of electrically insulating resin as contact surface |
| 06/02/2005 | DE10354118A1 Verfahren zur Herstellung von Leiterplatten und Leiterplatte Process for the preparation of printed circuit boards and printed circuit board |
| 06/02/2005 | DE10352920A1 Verfahren zur Befestigung von Flachbandkabelsystemen A method of securing the ribbon cable systems |
| 06/02/2005 | DE10351209A1 Unfired adhering ceramic foil used in multiple layer ceramic applications comprises an unfired ceramic foil and an adhesive layer |
| 06/02/2005 | DE10348909A1 Filter element for filtering electromagnetic waves, especially bandpass filter or band blocking filter, has resonator held at distance from contacting structure in recess in circuit board by suitable attachment arrangement |
| 06/02/2005 | DE10348421A1 Betriebsschaltung für Lampe mit Kühlkörper Operating circuit for lamp heatsink |
| 06/02/2005 | DE102004043895A1 Mehrstrahliges Mikro-Bearbeitungssystem und Verfahren Multi-beam micro-processing system and method |
| 06/02/2005 | DE102004041173A1 Lötaufbau zwischen einem Streifen einer Stromschiene und einem bedruckten Substrat Lötaufbau between a strip of a bus bar and a printed substrate |
| 06/02/2005 | DE102004035283A1 Connection structure for a vibration absorber has a printed circuit board with an electronic component all cast in a casing with a plastic jacket to protect against dirt |
| 06/02/2005 | DE102004030588A1 Verbindungsmaterialschablone und Verfahren zur Verwendung Connecting material mask and method of using |
| 06/01/2005 | EP1536677A1 Part inserting head device, part inserting device, and part inserting method |
| 06/01/2005 | EP1536673A1 Composite multi-layer substrate and module using the substrate |
| 06/01/2005 | EP1536672A1 Circuit board device and method for board-to-board connection |
| 06/01/2005 | EP1536523A2 High density connector having a ball type of contact surface |
| 06/01/2005 | EP1536522A2 High density connector having a ball type of contact surface |
| 06/01/2005 | EP1536521A2 High density connector having a ball type of contact surface |
| 06/01/2005 | EP1536520A1 Connector, method for manufacturing the same, and wiring board structure employing it |
| 06/01/2005 | EP1536467A2 Retaining member and heat conducting member for electronic apparatus |
| 06/01/2005 | EP1536372A1 Method of manufacturing data carriers and the data carrier obtained by this method |
| 06/01/2005 | EP1536291A1 Removing solution |
| 06/01/2005 | EP1536038A1 Method for forming fine structure of a group of metal fine particles |
| 06/01/2005 | EP1535730A1 Layered arrangement and composite material for electromechanical articles |
| 06/01/2005 | EP1535499A1 Process for preparing a substantially transparent conductive layer configuration |
| 06/01/2005 | EP1535498A1 Controlled depth etched dielectric film |
| 06/01/2005 | EP1534788A1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 06/01/2005 | EP1534518A1 Support system and method for a screen printing unit |
| 06/01/2005 | EP1421618B1 Power electronics component |
| 06/01/2005 | EP0898857A4 Method for connecting area grid arrays to printed wire board |
| 06/01/2005 | CN2703384Y Secondary rolling device for film press |
| 06/01/2005 | CN2703295Y LED light source module for mark plate |
| 06/01/2005 | CN1623229A High-frequency module and its manufacturing method |
| 06/01/2005 | CN1623012A Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 06/01/2005 | CN1622740A Multilayer printed circuit board and method for manufacturing the same |
| 06/01/2005 | CN1622739A Elements preparing method for surface mounting machine and the surface mounting machine |
| 06/01/2005 | CN1622738A Hot pressing manufacturing method for printed circuit board |
| 06/01/2005 | CN1622359A Method of producing piezoelectric ceramic device |
| 06/01/2005 | CN1622315A High performance chip carrier substrate |
| 06/01/2005 | CN1622238A Method for fixing a wire on a substrate and products made thereby |
| 06/01/2005 | CN1621925A Semiconductor chip, tape carrier package having the same mounted thereon, and liquid crystal display apparatus including the tape carrier package |
| 06/01/2005 | CN1621567A 电镀组合物 Electroplating composition |
| 06/01/2005 | CN1621448A Silicon rubber composition for electrode circuit protection, electrode circuit protection material and electric, electronic parts |
| 06/01/2005 | CN1204791C Perforated copper foil excellent in laser perforating and production method therefor |
| 06/01/2005 | CN1204790C Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate |
| 06/01/2005 | CN1204789C Insulation sheet, multilayer wiring base board and mfg. method thereof |
| 06/01/2005 | CN1204787C Printed circuit board, radio wave receiving converter and antenna device |
| 06/01/2005 | CN1204786C Circuit base board and method for mfg. same |
| 06/01/2005 | CN1204651C Central electrode subassembly and its production method, nonreciprocal circuit device, communication device |
| 06/01/2005 | CN1204612C Contact switch for semiconductor device detection and its producing method |
| 06/01/2005 | CN1204610C Method for manufacturing parts after installation of electronic element and manufacturing device thereof |
| 06/01/2005 | CN1204458C Method and apparatus for applying photoresist dry film on printed circuit board or substrate |
| 06/01/2005 | CN1204447C Base board for display device and its mfg. method, liquid crystal device and electronic apparatus |
| 06/01/2005 | CN1204300C Circuitry and method for electroplating plant or etching plant pulse power supply |
| 06/01/2005 | CN1204201C Electronic material composition, and method for using electronic appliance and electronic material composition |
| 06/01/2005 | CN1204171C Process for production of prepregs and laminated sheets |
| 06/01/2005 | CN1203981C Heat-resisting lining pad for formation squeeze |
| 06/01/2005 | CN1203951C Welding method of contact pin |
| 06/01/2005 | CN1203926C Improved miniature surface mount capacitor and method of making the same |
| 05/31/2005 | US6901217 Multilayer; support, layer with groove with controlled depth, overcoating with photopolymerto seal grooves |
| 05/31/2005 | US6900992 Printed circuit board routing and power delivery for high frequency integrated circuits |
| 05/31/2005 | US6900989 Flexible printed wiring board with semiconductor chip and releasing layer |
| 05/31/2005 | US6900715 Fastening device |
| 05/31/2005 | US6900646 Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
| 05/31/2005 | US6900545 Variable thickness pads on a substrate surface |
| 05/31/2005 | US6900544 Integrated circuit package and printed circuit board arrangement |
| 05/31/2005 | US6900535 BGA/LGA with built in heat slug/spreader |
| 05/31/2005 | US6900533 Apparatus for routing electrical signals |
| 05/31/2005 | US6900529 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 05/31/2005 | US6900394 Electroless copper plating machine, and multi-layer printed wiring board |
| 05/31/2005 | US6900393 Solder-bearing wafer for use in soldering operations |
| 05/31/2005 | US6900392 Information handling system utilizing circuitized substrate |
| 05/31/2005 | US6900389 Cover for ball-grid array connector |
| 05/31/2005 | US6900383 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| 05/31/2005 | US6900117 Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin |
| 05/31/2005 | US6900078 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 05/31/2005 | US6900073 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates |
| 05/31/2005 | US6899999 Electroconductive wiring formed in dielectric body for use in electric/electronic appliances, and communication devices; electroless plating |
| 05/31/2005 | US6899829 For use on circuit boards, coatings prevent adhesion loss during electroplating |
| 05/31/2005 | US6899815 Multi-layer integrated circuit package |
| 05/31/2005 | US6899798 Reusable ceramic-comprising component which includes a scrificial surface layer |
| 05/31/2005 | US6899781 Method for forming resin composite material |
| 05/31/2005 | US6899560 Jump wire structure |
| 05/31/2005 | US6899551 Component for assembly on a printed circuit board |
| 05/31/2005 | US6899549 Electronic assembly having a socket with a support plane |
| 05/31/2005 | US6899546 Printed circuit board |
| 05/31/2005 | US6899534 Mold assembly for a package stack via bottom-leaded plastic (blp) packaging |
| 05/31/2005 | US6899025 Uphill screen printing in the manufacturing of microelectronic components |
| 05/31/2005 | US6898851 Electronic device manufacturing method |
| 05/31/2005 | US6898850 Method of manufacturing circuit board and communication appliance |
| 05/31/2005 | US6898847 Method for producing an electrical connection between a plug element and a printed circuit board |
| 05/31/2005 | US6898846 Method and components for manufacturing multi-layer modular electrical circuits |
| 05/31/2005 | US6898844 Method for reducing multiline effects on a printed circuit board |
| 05/31/2005 | US6898837 Tooling fixture |
| 05/26/2005 | WO2005048678A2 A method for generating a jetting program |
| 05/26/2005 | WO2005048670A2 Method for verifying hairline cracks in a soldered joint between a component and a printed circuit board |