| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/08/2005 | EP1125330A4 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 06/08/2005 | EP1073781B1 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 06/08/2005 | CN2704184Y Assembling structure for concealing electronic element |
| 06/08/2005 | CN1625925A Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 06/08/2005 | CN1625806A Multi-layer ceramic substrate, and method and device for producing the same |
| 06/08/2005 | CN1625788A Electrical devices and process for making such devices |
| 06/08/2005 | CN1625322A Method for solving faulty solder of self-plug electrolytic capacitor |
| 06/08/2005 | CN1625321A Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver |
| 06/08/2005 | CN1624942A Light emitting assembly |
| 06/08/2005 | CN1624912A Device package, a printed wiring board, and an electronic apparatus |
| 06/08/2005 | CN1624906A Circuit board and method for manufacturing the same, semiconductor package, component built-in module |
| 06/08/2005 | CN1624733A Interconnector, method for manufacturing a plasma display device using the same, and a plasma display device with the same |
| 06/08/2005 | CN1624207A Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment |
| 06/08/2005 | CN1623870A Substrate processing apparatus |
| 06/08/2005 | CN1205846C Printed-wiring board processing method |
| 06/08/2005 | CN1205845C Shielding thin film, its mfg. method, and method for mfg. circuit substrate using such shielding film |
| 06/08/2005 | CN1205702C Electrical connector having recessed solderball foot |
| 06/08/2005 | CN1205700C Display mounting assembly |
| 06/08/2005 | CN1205669C Circuit board and method for manufacturing the same, and electronic apparatus using it |
| 06/08/2005 | CN1205512C Pattern, wiring, circuit board, electron source and image forming device mfg. method |
| 06/08/2005 | CN1205294C Anisotyopic conductive adhesive |
| 06/07/2005 | US6904236 Camera and photographing lens barrel |
| 06/07/2005 | US6903941 Printed circuit board assembly employing a press fit electrical connector |
| 06/07/2005 | US6903938 Printed circuit board |
| 06/07/2005 | US6903920 Clip-on leadframe for large ceramic SMD |
| 06/07/2005 | US6903919 Multilayer ceramic electronic component and mounting structure and method for the same |
| 06/07/2005 | US6903916 Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection |
| 06/07/2005 | US6903794 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
| 06/07/2005 | US6903700 High frequency circuit substrate and method for forming the same |
| 06/07/2005 | US6903541 Film-based microwave and millimeter-wave circuits and sensors |
| 06/07/2005 | US6903463 COG-assembly and connecting material to be used therein |
| 06/07/2005 | US6903443 Semiconductor component and interconnect having conductive members and contacts on opposing sides |
| 06/07/2005 | US6903303 Method and equipment for welding conductors to substrates |
| 06/07/2005 | US6903271 Electronic assembly with thermally separated support |
| 06/07/2005 | US6903175 Polymer synthesis and films therefrom |
| 06/07/2005 | US6902995 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 06/07/2005 | US6902955 Method of manufacturing a semiconductor device having a flexible wiring substrate |
| 06/07/2005 | US6902949 Multi-layer wiring circuit board and method for producing the same |
| 06/07/2005 | US6902869 Solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces |
| 06/07/2005 | US6902852 Pattern transfer method using a mask and half tone mask |
| 06/07/2005 | US6902824 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
| 06/07/2005 | US6902660 Method of manufacturing printed circuit board and multi-layered PCB |
| 06/07/2005 | US6902626 A liquid etchant used for etching of a copper foil or a copper plate |
| 06/07/2005 | US6902261 Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly |
| 06/07/2005 | US6902102 Soldering method and solder joint member |
| 06/07/2005 | US6902100 Method of improving the quality of soldered connections |
| 06/07/2005 | US6902099 Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same |
| 06/07/2005 | US6902098 Solder pads and method of making a solder pad |
| 06/07/2005 | US6902097 Electrically conductive wire |
| 06/07/2005 | US6901852 Uphill screen printing in the manufacturing of microelectronic components |
| 06/07/2005 | US6901659 Method of manufacturing electron-emitting device using ink-jet discharge device |
| 06/07/2005 | CA2357628C Oscillator and electronic apparatus using the same |
| 06/02/2005 | WO2005051060A1 Multi-layer pcb and manufacturing method for the same |
| 06/02/2005 | WO2005051059A1 Rough contacts |
| 06/02/2005 | WO2005051058A1 Circuit board and method for manufacturing same |
| 06/02/2005 | WO2005051057A1 Circuit board |
| 06/02/2005 | WO2005051056A1 Environmentally tuned circuit card assembly and method for manufacturing the same |
| 06/02/2005 | WO2005050877A1 Compact optical transceivers for host bus adaptors |
| 06/02/2005 | WO2005050739A1 Contacting without external power |
| 06/02/2005 | WO2005050735A1 Land grid array package |
| 06/02/2005 | WO2005050733A1 Wiring structure for high-frequency wave, method for forming wiring structure for high-frequency wave, and method for shaping high-frequency signal waveform |
| 06/02/2005 | WO2005050708A2 Stair step printed circuit board structures for high speed signal transmissions |
| 06/02/2005 | WO2005050677A1 Surface mount composite electronic component and method for manufacturing same |
| 06/02/2005 | WO2005050318A1 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
| 06/02/2005 | WO2005050227A1 Non-rigid conductor link measurement sensor and method for the production thereof |
| 06/02/2005 | WO2005049887A2 Methods for the deposition of silver oxide films and patterned films |
| 06/02/2005 | WO2005049741A1 Formation of self-assembled monolayers |
| 06/02/2005 | WO2005049238A1 Dust extractor and dust extracting method |
| 06/02/2005 | WO2005033376A3 Plating method and apparatus |
| 06/02/2005 | WO2005011343A3 Circuit board with embedded components and method of manufacture |
| 06/02/2005 | WO2004114730A3 Metal foil composite structure for producing clad laminate |
| 06/02/2005 | WO2004095603A3 Method of producing membrane electrode assemblies |
| 06/02/2005 | WO2004082347A3 Solder on a sloped surface |
| 06/02/2005 | US20050118845 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| 06/02/2005 | US20050118787 System to form a layering of electronically-interactive material |
| 06/02/2005 | US20050118750 Wiring board sheet and its manufacturing method,multilayer board and its manufacturing method |
| 06/02/2005 | US20050118448 Laser ablation resistant copper foil |
| 06/02/2005 | US20050118438 Process for preparing metal-coated aromatic polyimide film |
| 06/02/2005 | US20050118436 Method for electroless deposition of a metal layer on selected portions of a substrate |
| 06/02/2005 | US20050118414 Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these |
| 06/02/2005 | US20050117835 Techniques for joining an opto-electronic module to a semiconductor package |
| 06/02/2005 | US20050117763 Hearing aid or similar audio device and method for producing a hearing aid |
| 06/02/2005 | US20050117312 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 06/02/2005 | US20050117302 Module structure and module comprising it |
| 06/02/2005 | US20050117257 Method to form electrostatic discharge protection on flexible circuits |
| 06/02/2005 | US20050116387 Component packaging apparatus, systems, and methods |
| 06/02/2005 | US20050116354 Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip |
| 06/02/2005 | US20050116351 Semiconductor interconnect having conductive spring contacts |
| 06/02/2005 | US20050116332 Method and apparatus for molding module electronic devices and a module electronic device molded thereby |
| 06/02/2005 | US20050116329 Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses |
| 06/02/2005 | US20050116328 Substrate and method of manufacture thereof |
| 06/02/2005 | US20050116299 Component packaging apparatus, systems, and methods |
| 06/02/2005 | US20050116239 Circuit interconnect for optoelectronic device |
| 06/02/2005 | US20050116224 Circuit board having test coupon and method for evaluating the circuit board |
| 06/02/2005 | US20050116202 Printing of organic conductive polymers containing additives |
| 06/02/2005 | US20050116069 Ultrafine fluid jet apparatus |
| 06/02/2005 | US20050115937 Laser-based method and system for memory link processing with picosecond lasers |
| 06/02/2005 | US20050115936 Laser-based method and system for memory link processing with picosecond lasers |
| 06/02/2005 | US20050115796 Substrate processing apparatus |
| 06/02/2005 | US20050115670 Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon |