| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/16/2005 | US20050127143 Solder joint structure and method for soldering electronic components |
| 06/16/2005 | US20050127134 Nano-metal composite made by deposition from colloidal suspensions |
| 06/16/2005 | US20050126919 Plating method, plating apparatus and a method of forming fine circuit wiring |
| 06/16/2005 | US20050126820 Method for fabricating wiring board provided with passive element, and wiring board provided with passive element |
| 06/16/2005 | US20050126819 Methods to prevent mechanical flexure related BGA failure |
| 06/16/2005 | US20050126818 Multilayer wiring board |
| 06/16/2005 | US20050126707 Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process |
| 06/16/2005 | US20050126682 Shrinkage resistance during sintering; firing green laminate at the sintering temperature for the green functional ceramic material |
| 06/16/2005 | US20050126605 Apparatus and method for cleaning surfaces |
| 06/16/2005 | US20050126472 Jet singulation |
| 06/16/2005 | US20050126429 Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA) |
| 06/16/2005 | US20050126339 Monodisperse spherical metal particles and manufacturing method therefor |
| 06/16/2005 | US20050126080 Semiconductor polishing compound, process for its production and polishing method |
| 06/16/2005 | US20050126003 Method of manufacturing electronic component and member to be used in the same method |
| 06/16/2005 | US20050126002 Method of manufacturing electronic component and member to be used in the same method |
| 06/16/2005 | US20050125997 Method and device for through-hole plating of substrates and printed circuit boards |
| 06/16/2005 | DE4443372B4 Lötflussmittel Soldering flux |
| 06/16/2005 | DE19926746B4 Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten Multiple arrangement of printed circuit boards equipped with LEDs and connectors for the connection of printed circuit boards |
| 06/16/2005 | DE19509173B4 Masse aus einem Epoxygruppen enthaltenden thermoplastischen Norbornenharz und ihre Verwendung Mass containing epoxy groups from a thermoplastic norbornene and their use |
| 06/16/2005 | DE10350648A1 Transponder Transponder |
| 06/16/2005 | DE10349957A1 Method of soldering components onto a printed circuit board involves applying fluid solder by machine to a locally defined area of the circuit board |
| 06/15/2005 | EP1542523A1 Part mounting recognition mark recognition device and method |
| 06/15/2005 | EP1542520A1 Method for forming bump on electrode pad with use of double-layered film |
| 06/15/2005 | EP1542519A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 06/15/2005 | EP1542518A1 Board for printed wiring, printed wiring board, and method for manufacturing them |
| 06/15/2005 | EP1542517A1 Printed Circuit Board for Mounting a Quad Flat Package IC, Method of Soldering a Quad Flat Package IC, and Air Conditioning Apparatus with such a Printed Circuit Board |
| 06/15/2005 | EP1542273A1 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 06/15/2005 | EP1542266A1 Semiconductor abrasive, process for producing the same and method of polishing |
| 06/15/2005 | EP1542029A2 Surface mounting electronic module and method of testing the same |
| 06/15/2005 | EP1541972A1 Dial module, manufacturing method thereof, led display element, display module, movement module, connector module, and meter using them |
| 06/15/2005 | EP1541720A2 An electroplating machine |
| 06/15/2005 | EP1541719A2 An electroplating machine |
| 06/15/2005 | EP1541654A1 Conductive adhesive and circuit comprising it |
| 06/15/2005 | EP1541002A1 Apparatus and method for inspecting cream solder printed on a substrate |
| 06/15/2005 | EP1540928A1 Electrical subassembly and use thereof |
| 06/15/2005 | EP1540193A1 Fastener for assembly and disassembly |
| 06/15/2005 | EP1539418A1 Method and device for the punctiform machining of a workpiece by means of a laser beam |
| 06/15/2005 | EP1435021B1 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 06/15/2005 | EP1388019B1 Device for arranging a photoelectric transducer at an electric signal processing device |
| 06/15/2005 | EP1314172B8 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly |
| 06/15/2005 | EP1120449B1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
| 06/15/2005 | EP0840676B1 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
| 06/15/2005 | CN2704863Y Installing structure of semiconductor device, electro-optical device and electronic apparatus |
| 06/15/2005 | CN2704439Y Double-pipe combined reutilizing hobbing |
| 06/15/2005 | CN1628321A Method for manufacturing RFID labels |
| 06/15/2005 | CN1628282A Input device, mobile telephone, and mobile information device |
| 06/15/2005 | CN1627896A Electronic circuit unit |
| 06/15/2005 | CN1627885A Semiconductor packing and solder filler for printed circuit board, and its mfg. method |
| 06/15/2005 | CN1627884A Manufacturing method of ceramic substrate and electronic component modular using such substrate |
| 06/15/2005 | CN1627883A Method of making substrate for flexible circuit board |
| 06/15/2005 | CN1627882A Printed circuit board for mounting a quad flat package IC, method of soldering a quad flat package IC, and air conditioning apparatus with such a printed circuit board |
| 06/15/2005 | CN1627880A 柔性印刷电路板 A flexible printed circuit board |
| 06/15/2005 | CN1627565A Connector tine plate |
| 06/15/2005 | CN1627514A Semiconductor device and electronic device, and methods for manufacturing thereof |
| 06/15/2005 | CN1627513A Semiconductor device and electronic device, and methods for manufacturing thereof |
| 06/15/2005 | CN1627491A Method for flattening tin ball and fixture |
| 06/15/2005 | CN1627489A Load supporting base plate for semiconductor chip and fabricating method |
| 06/15/2005 | CN1627366A Suspension board with circuit |
| 06/15/2005 | CN1627189A Dry film photo resist |
| 06/15/2005 | CN1627121A Scanner system |
| 06/15/2005 | CN1626342A Apparatus and method of printing screen |
| 06/15/2005 | CN1206899C Electronic element welder and method, circuit board and electronic element mounting device |
| 06/15/2005 | CN1206896C Surface mount technology compatible EMI gasket and method of installing EMI gasket on ground trace |
| 06/15/2005 | CN1206893C Electronic arrangement equiped with electronic circuit substrate |
| 06/15/2005 | CN1206888C Method for preparing surface treated copper foil |
| 06/15/2005 | CN1206887C Printed circuit assembly, its mfg. method |
| 06/15/2005 | CN1206885C Printed circuit and its mfg. method |
| 06/15/2005 | CN1206729C Semiconductor device and its making process, circuit board and electronic instrument |
| 06/15/2005 | CN1206713C Printed circuit board through-hole making method |
| 06/15/2005 | CN1206677C Method of manufacturing ceramic electronic components |
| 06/15/2005 | CN1206667C Method for forming transparent cnoductive film by using chemically amplified resist |
| 06/15/2005 | CN1206317C Liquid crystal polymer film and stacked body and its producing method, and laminated installation loop base plate |
| 06/15/2005 | CN1206259C Adhesive polyimide resin and adhesive laminate |
| 06/15/2005 | CN1206042C Spraying nozzle with cover for spraying printed-circuit board, and wet treatment prodn. line appts. for printed circuit board |
| 06/14/2005 | US6906924 Temperature-controlled rework system |
| 06/14/2005 | US6906910 Structures for implementing integrated conductor and capacitor in SMD packaging |
| 06/14/2005 | US6906541 Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance |
| 06/14/2005 | US6906429 Semiconductor device and method of fabricating the same |
| 06/14/2005 | US6906425 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
| 06/14/2005 | US6906423 Mask used for exposing a porous substrate |
| 06/14/2005 | US6906417 Ball grid array utilizing solder balls having a core material covered by a metal layer |
| 06/14/2005 | US6906415 Semiconductor device assemblies and packages including multiple semiconductor devices and methods |
| 06/14/2005 | US6906412 Preventing die bonding paste climbing; improving semiconduc-tor sensing chip positioning |
| 06/14/2005 | US6906407 Field programmable gate array assembly |
| 06/14/2005 | US6906268 Heat-shrinkable retainer for PCB double-sided assembly |
| 06/14/2005 | US6906253 Method for fabricating a solar tile |
| 06/14/2005 | US6905979 Apparatus and method for improving AC coupling on circuit boards |
| 06/14/2005 | US6905952 Recovery processing method of an electrode |
| 06/14/2005 | US6905911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal |
| 06/14/2005 | US6905810 Permanent resist, permanent resist-laminated substrate and process for producing the same |
| 06/14/2005 | US6905782 Tarnish deterring tin coating |
| 06/14/2005 | US6905757 Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate |
| 06/14/2005 | US6905738 Positioning source of laser energy in a spaced relation to the target substrate; positioning receiving substrate in a spaced relation to target substrate; exposing target substrate to the laser energy for deposition |
| 06/14/2005 | US6905628 Preapplying passivation layer before etching; electrochemical wet etching |
| 06/14/2005 | US6905589 Multilayer printed circuits; vertical adjusted electroconductive apertures; high density circuits |
| 06/14/2005 | US6905587 Method for enhancing the solderability of a surface |
| 06/14/2005 | US6905569 Method of embedding optical fiber in multilayer printed circuit board |
| 06/14/2005 | US6905361 Electrical device |
| 06/14/2005 | US6905349 Technique for connector to printed circuit board decoupling to eliminate flexure |
| 06/14/2005 | US6905348 Circuit-connecting structure including a terminal piece |