Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2005
06/23/2005WO2005056200A1 Stencil and method for depositing a viscous product about solder balls therewith
06/23/2005WO2004107826B1 Multi functional timepiece module with application specific printed circuit boards
06/23/2005WO2004056162A8 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
06/23/2005US20050138592 Apparatuses and methods to route line to line
06/23/2005US20050137277 Thermosetting resin compositions containing maleimide and/or vinyl compounds
06/23/2005US20050136852 Wireless transceiver for automotive vehicle
06/23/2005US20050136718 Connecting structure between busbar base and printed circuit board and assemblies thereof
06/23/2005US20050136711 Electrical connector assembly with pick up cap
06/23/2005US20050136708 Bus bar substrate for vehicle interior light
06/23/2005US20050136703 Flexible cable interconnect assembly
06/23/2005US20050136654 Multiple stage electroless deposition of a metal layer
06/23/2005US20050136646 Method of providing printed circuit board with conductive holes and board resulting therefrom
06/23/2005US20050136641 Solder structures for out of plane connections and related methods
06/23/2005US20050136639 Pin-deposition of conductive inks for microelectrodes and contact via filling
06/23/2005US20050136638 Low temperature sintering nanoparticle compositions
06/23/2005US20050136625 Ultra-thin glass devices
06/23/2005US20050136620 Maleimide compounds in liquid form
06/23/2005US20050136326 Low cost electrical terminals manufactured from conductive loaded resin-based materials
06/23/2005US20050136246 Anisotropic conductive film
06/23/2005US20050136231 an electronic device; depositing an ink containing metal nanoparticles onto a polymeric film, then shrinking the film causing the metal particles to form a circuit; fewer processing steps, easy and inexpensive fabrication, rapid prototyping, custom circuitry
06/23/2005US20050135758 Optical data link
06/23/2005US20050135074 Printed circuit dielectric foil and embedded capacitors
06/23/2005US20050135072 Printed wire board and associated mobile terminal
06/23/2005US20050135067 Semiconductor module with vertically mounted semiconductor chip packages
06/23/2005US20050134557 ACF assembly apparatus and method
06/23/2005US20050134420 Microconverter and laminated magnetic-core inductor
06/23/2005US20050134142 Plated piezoelectric composite and process for plating a piezoelectric composite
06/23/2005US20050133930 Packaging substrates for integrated circuits and soldering methods
06/23/2005US20050133929 Flexible package with rigid substrate segments for high density integrated circuit systems
06/23/2005US20050133928 Wire loop grid array package
06/23/2005US20050133918 Via including multiple electrical paths
06/23/2005US20050133913 Stress distribution package
06/23/2005US20050133910 Metal article intended for at least partially coating with a substance and a method for producing the same
06/23/2005US20050133904 Method of forming metal pattern for hermetic sealing of package
06/23/2005US20050133900 Microelectronic assemblies with composite conductive elements
06/23/2005US20050133898 Printed circuit board and inkjet head
06/23/2005US20050133823 Method and apparatus for forming a wiring, wiring board, and ink set
06/23/2005US20050133574 Emulsified in water by a (meth)acrylic acid-ethylene glycol graft polymer modified with a hydrophobic phenylalkylphenol and a stabilizing tris(phenylalkyl)phenol; prefered epoxy being bisphenol A propoxylate diglycidyl ether; nanoemulsions with reasonable viscosity
06/23/2005US20050133573 Solder contact reworking using a flux plate and sequeegee
06/23/2005US20050133572 Methods of forming solder areas on electronic components and electronic components having solder areas
06/23/2005US20050133571 Flip-chip solder bump formation using a wirebonder apparatus
06/23/2005US20050133570 Method and apparatus for conductive ball bonding of components
06/23/2005US20050133362 Transferable micro spring structure
06/23/2005US20050133346 Device and method for conveying and holding plate-like member
06/23/2005US20050133257 Printed circuit board with low cross-talk noise
06/23/2005US20050133256 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board
06/23/2005US20050133255 Method and apparatus for trace shielding and routing on a substrate
06/23/2005US20050133251 Substrate with micro-via structures by laser technique
06/23/2005US20050133249 Printed wiring board and semiconductor device
06/23/2005US20050133241 Chip orientation and attachment method
06/23/2005US20050132566 Circuits, multilayer circuits, and method of manufacture thereof
06/23/2005DE10356305A1 Flat conductor for use in motor vehicle, has isolation body including protruding sections on its external surface, where the sections provide defined gap, so that adhesive is uniformly distributed on surface of conductor
06/23/2005DE10353042A1 Verfahren zur Verifizierung von Haarrissen in einer Lötstelle, die ein Bauteil mit einer Leiterplatte verbindet A method of verification of hairline cracks in a solder joint connecting a component to a circuit board
06/23/2005DE10353035A1 Multilayer circuit board, especially for electronic circuit for motor vehicle, has core with copper and intermediate layers, mean resin content greater than 15 and less than 50 per cent of its weight
06/23/2005DE10335129B3 Kühlanordnung für auf einer Leiterplatte angeordnete elektrische Bauelemente, insbesondere SMD-Bausteine Cooling arrangement for arranged on a printed circuit board electrical components, in particular SMD components
06/23/2005DE102004043267A1 Vorrichtung zur Substratbearbeitung Apparatus for substrate processing
06/23/2005DE102004014221A1 Gedruckte Schaltkarte und Herstellungsverfahren für diese Printed circuit board and manufacturing method for this
06/23/2005DE10055436B4 Kühlverguss für ein elektrisches Bauteil Kühlverguss for an electrical part
06/22/2005EP1545176A1 Multilayer printed wiring board and production method therefor
06/22/2005EP1545175A2 Method of providing printed circuit board with conductive holes and board resulting therefrom
06/22/2005EP1545174A2 Method and apparatus for soldering or repairing an electronic component mounted on a circuit board
06/22/2005EP1545173A1 Wiring circuit board
06/22/2005EP1545172A1 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board
06/22/2005EP1545171A1 Method of forming pattern on ceramic green sheet and conductive paste for use in the method
06/22/2005EP1545170A1 Wiring circuit board
06/22/2005EP1545169A2 Switch module
06/22/2005EP1544948A2 Flexible cable interconnect assembly
06/22/2005EP1544916A1 Raised solder pad and method using the same
06/22/2005EP1544905A1 Electric circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor
06/22/2005EP1544320A2 Passivated end surfaces
06/22/2005EP1543977A1 Substrate for liquid discharge head, liquid discharge head using substrate for liquid discharge head and method of manufacturing the same
06/22/2005EP1543946A1 Transfer functional film, method for forming functional layer and object to which functional layer is applied
06/22/2005EP1543704A1 Printing process and solder mask ink composition
06/22/2005EP1543703A1 Plating process
06/22/2005EP1543558A2 Radio frequency identificaton device and method
06/22/2005EP1543453A1 System and method for modifying electronic design data
06/22/2005EP1543083A1 Process and ink for making electronic devices
06/22/2005EP1393371B1 Electronic module and method for assembling same
06/22/2005CN1631067A Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board
06/22/2005CN1631065A Device and method for transporting flat workpieces in conveyorized processing lines
06/22/2005CN1630946A Electronic circuit component
06/22/2005CN1630939A Forming printed circuit board structure using piezoelectric micro-coating method
06/22/2005CN1630917A Etching solution for forming an embedded resistor
06/22/2005CN1630735A Method for the deposition of materials from mesomorphous films
06/22/2005CN1630467A Electronic component mounting apparatus
06/22/2005CN1630463A Operating circuit for a lamp with a heat sink
06/22/2005CN1630460A Multilayer wiring board
06/22/2005CN1630459A Printed wiring board and method for manufacturing the same
06/22/2005CN1630458A Method for forming plain conductor pattern by means of ink-jet
06/22/2005CN1630457A Method for arranging electric control circuit on touch control panel by using metal filming technique
06/22/2005CN1630456A Electric contact arrangement and method for preparing same
06/22/2005CN1630455A Wired circuit board holding sheet and production method thereof
06/22/2005CN1630454A Printed wiring board and semiconductor device
06/22/2005CN1630068A Wiring circuit board
06/22/2005CN1630067A Wiring circuit board
06/22/2005CN1630066A High wireability microvia substrate
06/22/2005CN1629946A Optical pickup actuator
06/22/2005CN1629909A Structures for coupling and grounding a circuit board in a plasma display device
06/22/2005CN1629648A Method, apparatus, system, program and medium for inspecting a circuit board and an apparatus incorporating the circuit board
06/22/2005CN1629440A Wireless transceiver for automotive vehicle