| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/06/2005 | CN1209877C Appts. and method for generating electromigration |
| 07/06/2005 | CN1209815C Welding pad structure for semiconductor package |
| 07/06/2005 | CN1209814C Process for the manufacture of printed circuit board with plated resistor |
| 07/06/2005 | CN1209804C Spiral contactor and manufacturing method thereof, semiconductor detection apparatus using same and electronic element |
| 07/06/2005 | CN1209803C Manufacturing method of grid array packaged connector pin surface binding |
| 07/06/2005 | CN1209802C Method for producing electronic device and electronic device |
| 07/06/2005 | CN1209771C Insulator ceramic composition |
| 07/06/2005 | CN1209747C Suspension holder for HDD and its producing method |
| 07/06/2005 | CN1209632C Printed circuit board test apparatus and method |
| 07/06/2005 | CN1209585C Power source board and producing method thereof, and air conditioner outdoor apparatus using with the same electric power board |
| 07/06/2005 | CN1209440C Composition containing azacyclic compound and glycol for grain decoration of resin material, removal of stain and removal of resin material |
| 07/06/2005 | CN1209240C Polyimide metal laminated plate and its producing method |
| 07/06/2005 | CN1209201C Negative pressure plasma device and cleaning method |
| 07/05/2005 | US6914786 Converter device |
| 07/05/2005 | US6914566 Ball grid array antenna |
| 07/05/2005 | US6914513 Materials system for low cost, non wire-wound, miniature, multilayer magnetic circuit components |
| 07/05/2005 | US6914500 Filter circuit device and method of manufacturing the same |
| 07/05/2005 | US6914379 Thermal management in electronic displays |
| 07/05/2005 | US6914324 Memory expansion and chip scale stacking system and method |
| 07/05/2005 | US6914322 Semiconductor device package and method of production and semiconductor device of same |
| 07/05/2005 | US6914200 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 07/05/2005 | US6914199 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 07/05/2005 | US6914198 Electrical device allowing for increased device densities |
| 07/05/2005 | US6914196 Reel-deployed printed circuit board |
| 07/05/2005 | US6913952 Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages |
| 07/05/2005 | US6913950 Semiconductor device with chamfered substrate and method of making the same |
| 07/05/2005 | US6913948 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
| 07/05/2005 | US6913947 Multi-layer circuit board and method of manufacturing the same |
| 07/05/2005 | US6913945 Method of mounting a chip |
| 07/05/2005 | US6913814 Lamination process and structure of high layout density substrate |
| 07/05/2005 | US6913812 Releasing laminated film |
| 07/05/2005 | US6913794 Diode-laser curing of liquid epoxide encapsulants |
| 07/05/2005 | US6913681 Plating method and plating apparatus |
| 07/05/2005 | US6913476 Temporary, conformable contacts for microelectronic components |
| 07/05/2005 | US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 07/05/2005 | US6913343 Methods for forming and protecting electrical interconnects and resultant assemblies |
| 07/05/2005 | US6913229 Wire management system |
| 07/05/2005 | US6913187 Method and arrangement for providing Vias in printed circuit boards |
| 07/05/2005 | US6912781 Method of manufacturing electronic packaging device with insertable leads |
| 07/05/2005 | US6912780 Method and structure for repairing or modifying surface connections on circuit boards |
| 07/05/2005 | US6912779 Method of manufacturing flexible wiring board |
| 06/30/2005 | WO2005060324A1 Multilayer printed wiring board and method for manufacturing the multilayer printed wiring board |
| 06/30/2005 | WO2005060100A1 Control and user interface for electronic device |
| 06/30/2005 | WO2005059993A2 Packaging substrates for integrated circuits and soldering methods |
| 06/30/2005 | WO2005059930A2 Printed circuit embedded capacitors |
| 06/30/2005 | WO2005059823A2 Systems and methods for detecting defects in printed solder paste |
| 06/30/2005 | WO2005059206A2 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
| 06/30/2005 | WO2005059057A2 Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (mea) |
| 06/30/2005 | WO2005058748A1 Method and system for self-aligning parts in mems |
| 06/30/2005 | WO2005044451A9 Electrical connection of components |
| 06/30/2005 | WO2005043965A3 Method for production of a transponder |
| 06/30/2005 | WO2005031812A3 Improved copper bath for electroplating fine circuitry on semiconductor chips |
| 06/30/2005 | WO2005022969A3 Method and system for creating fine lines using ink jet technology |
| 06/30/2005 | WO2004095544A3 Substrate with multiple conductive layers and methods for making and using same |
| 06/30/2005 | WO2004093145A3 Voltage tunable photodefinable dielectric and method of manufacture therefore |
| 06/30/2005 | US20050143534 relatively low lamination temperature; low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter |
| 06/30/2005 | US20050142917 Electrically insulating body, and electronic device |
| 06/30/2005 | US20050142871 Method of forming a conductive via plug |
| 06/30/2005 | US20050142852 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 06/30/2005 | US20050142839 Conductive layers and fabrication methods thereof |
| 06/30/2005 | US20050142835 Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed |
| 06/30/2005 | US20050142813 Lamination through a mask |
| 06/30/2005 | US20050142693 Semiconductor device with intermediate connector |
| 06/30/2005 | US20050142551 Fabrication of a high resolution biological molecule detection device with aluminum electrical conductors |
| 06/30/2005 | US20050142376 Vapor deposition film having structured layers of a variety of diverse metals, metal compositions, alloys or insulators on one or both sides of a carrier material |
| 06/30/2005 | US20050142374 Flexible copper foil structure and fabrication method thereof |
| 06/30/2005 | US20050142345 multi-layer imprinting process flow that reduces pattern loss during processing of a subsequent layer; double-embossed structure |
| 06/30/2005 | US20050142293 separating pattern layouts into discrete design layers having only parallel layout features; multi-pass features can be avoided, and homogenous, smooth-edged printed patterns can be printed |
| 06/30/2005 | US20050141819 Electrical component connector with misaligment compensation |
| 06/30/2005 | US20050141236 Interactive LED display device |
| 06/30/2005 | US20050141150 Electrical connection of components |
| 06/30/2005 | US20050140814 Connecting structure for connecting an image pick-up unit to a wiring plate |
| 06/30/2005 | US20050140745 Ink jet nozzle to eject ink |
| 06/30/2005 | US20050140715 Screen printing machine having a replaceable ink jet printing unit |
| 06/30/2005 | US20050140709 Fabrication of functional device mounting board making use of inkjet technique |
| 06/30/2005 | US20050140490 Printed-circuit board with fuse |
| 06/30/2005 | US20050140488 Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same |
| 06/30/2005 | US20050140434 Inductor element containing circuit board and power amplifier module |
| 06/30/2005 | US20050140042 Low cost roofing shingles manufactured from conductive loaded resin-based materials |
| 06/30/2005 | US20050140026 Fabrication methods for electronic system modules |
| 06/30/2005 | US20050140019 Semiconductor multilayer wiring substrate of coaxial wiring structure and method of fabricating the same |
| 06/30/2005 | US20050140009 Method and apparatus for the production of an electronic component with external contact areas |
| 06/30/2005 | US20050140008 Electronic circuit unit and method of fabricating the same |
| 06/30/2005 | US20050140001 Integrated circuit arrangement |
| 06/30/2005 | US20050139988 Semiconductor device and electronic equipment using the same |
| 06/30/2005 | US20050139986 Methods of making microelectronic assemblies including compliant interfaces |
| 06/30/2005 | US20050139972 System and method for improving solder joint reliability in an integrated circuit package |
| 06/30/2005 | US20050139864 Multi-layer substrate structure for reducing layout area |
| 06/30/2005 | US20050139812 molding polymers containing electroconductive fibers, powders and/or mixtures, then processing the surfaces to expose segments of the electroconductive materials |
| 06/30/2005 | US20050139811 Surface preparation method for articles manufactured from conductive loaded resin-based materials |
| 06/30/2005 | US20050139684 Flexible display assembly having flexibly connected screen |
| 06/30/2005 | US20050139644 Electronic devices and methods of forming electronic devices |
| 06/30/2005 | US20050139643 Method and system for applying solder |
| 06/30/2005 | US20050139478 forming copper seed layer by applying electroplating power with current density of between about 1.0 mA/cm2 and about 5.0 mA/cm2, in periodic pulses; enhancing the deposition of copper layer; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 06/30/2005 | US20050139390 Printed circuit board and package having oblique vias |
| 06/30/2005 | US20050139389 Method of mounting electronic component on substrate without generation of voids in bonding material |
| 06/30/2005 | US20050139387 Wiring circuit board |
| 06/30/2005 | US20050139386 Multi-layer printed circuit board and method for manufacturing the same |
| 06/30/2005 | US20050139384 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| 06/30/2005 | US20050139383 Direct contact power transfer pad and method of making same |