Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2005
08/04/2005WO2005072030A2 Providing differentiated levels of solder paste for a circuit paste for a circuit board
08/04/2005WO2005071750A2 Conductive material compositions, apparatus, systems, and methods
08/04/2005WO2005071745A1 Laminated electronic part and its manufacturing method
08/04/2005WO2005071742A1 Multilayer electronic component manufacturing method
08/04/2005WO2005071732A1 Carrier for electronic components and methods for encapsulating and separating an electronic component
08/04/2005WO2005071487A1 Photosensitive film and method for manufacturing printed wiring board using same
08/04/2005WO2005071183A1 Façade covering
08/04/2005WO2005069734A2 A liquid thermosetting ink
08/04/2005WO2005069733A2 Reactive fine particles
08/04/2005WO2005029634A3 Dielectric loading of distributed printed circuits
08/04/2005WO2002004715A3 Deposition uniformity control for electroplating apparatus, and associated method
08/04/2005US20050171273 shelf life stability; coating is applied by vapor deposition; curable coated-conductive particles are dispersed within curable component; anisotropically conductive bond formed by the cure
08/04/2005US20050170679 Non-reciprocal device
08/04/2005US20050170652 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170631 Manufacturing method for wiring substrates
08/04/2005US20050170622 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170613 Wafer dividing method
08/04/2005US20050170560 Method of manufacturing an electronic device
08/04/2005US20050170291 Process and apparatus for manufacturing printed circuit boards
08/04/2005US20050170270 Composition for forming wiring protective film and uses thereof
08/04/2005US20050170198 Includes an intermediate layer that contains at least one element selected from Mo, Cr, Ni, Si, Fe, Al and an oxygen and water barrier film; can enhance the bonding strength between a conductive layer and a polyimide film at high temperatures
08/04/2005US20050170094 Polymerisable composition
08/04/2005US20050170079 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170078 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials
08/04/2005US20050170077 Adhesion method
08/04/2005US20050169514 Systems and methods for detecting defects in printed solder paste
08/04/2005US20050168961 Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/04/2005US20050168960 Module with a built-in component, and electronic device with the same
08/04/2005US20050168957 Transmission/reception optical module
08/04/2005US20050168917 Method for manufacturing ceramic multilayer substrate
08/04/2005US20050168533 Printer nozzle for ejecting ink
08/04/2005US20050168318 Laser trimming of resistors
08/04/2005US20050168304 Signal line circuit device
08/04/2005US20050168141 Method for producing an electronic component and a display
08/04/2005US20050167931 Low cost gaskets manufactured from conductive loaded resin-based materials
08/04/2005US20050167873 Low cost fuel cell bipolar plates manufactured from conductive loaded resin-based materials
08/04/2005US20050167851 Semiconductor part for component mounting, mounting structure and mounting method
08/04/2005US20050167850 Flip-chip adaptor package for bare die
08/04/2005US20050167831 Semiconductor device and method of fabricating the same
08/04/2005US20050167830 Pre-solder structure on semiconductor package substrate and method for fabricating the same
08/04/2005US20050167829 Partially etched dielectric film with conductive features
08/04/2005US20050167818 Mold release layer transferring film and laminate film
08/04/2005US20050167817 Microelectronic adaptors, assemblies and methods
08/04/2005US20050167815 Circuit carrier and package structure thereof
08/04/2005US20050167813 Method and apparatus for molding module electronic devices and a module electronic device molded thereby
08/04/2005US20050167804 Substrate for packaging IC device and method for manufacturing the same
08/04/2005US20050167803 Film substrate, fabrication method thereof, and image display substrate
08/04/2005US20050167794 Semiconductor device and method of manufacturing same
08/04/2005US20050167640 adding reducing agents to aqueous reaction systems containing silver salts and silver oxide, to deposit silver particles, andadding a chelating agent to the aqueous reaction system as dispersants; free-flowing particles used to form films having a uniform thickness on substrates
08/04/2005US20050167639 Electronic material composition, electronic product and method of using electronic material composition
08/04/2005US20050167519 Jetting device and method at a jetting device
08/04/2005US20050167474 Soldering method of nonaqueous-electrolyte secondary-battery
08/04/2005US20050167284 immersing printed circuits, substrates, metal maskings, semiconductor wafers or magnetic heads having patterned conductive layers, in neutral solutions, then applying a voltage to induce current between the conductive layer and a counter electrode at a specified current density, rinsing and drying
08/04/2005US20050167281 Production method of suspension board with circuit
08/04/2005US20050167189 Low cost acoustical structures manufactured from conductive loaded resin-based materials
08/04/2005US20050167188 Low cost acoustical structures manufactured from conductive loaded resin-based materials
08/04/2005US20050167155 Apparatus and method for fixing component of circuit substrate
08/04/2005US20050167154 Printed wiring board
08/04/2005US20050167153 Spacer, printed circuit board, and electronic equipment
08/04/2005US20050167133 Low cost gaskets manufactured from conductive loaded resin-based materials
08/04/2005US20050166956 Low cost roofing shingles manufactured from conductive loaded resin-based materials
08/04/2005US20050166772 Device and method for positioning a substrate to be printed
08/04/2005DE4313980B4 Integrierte Hybridschaltung und Verfahren zu deren Herstellung A hybrid integrated circuit, and processes for their preparation
08/04/2005DE202004020555U1 Electronic component for mounting on electronic circuit board, has soldered contacts brought out from solder-free housing
08/04/2005DE19859064B4 Bearbeitungsvorrichtung und -verfahren Processing apparatus and method
08/04/2005DE19633797B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen Device for electroplating of electronic circuit boards or the like
08/04/2005DE10340438B4 Sendemodul mit verbesserter Wärmeabführung Transmitter module with improved heat dissipation
08/04/2005DE10330754B4 Verfahren zur Herstellung einer elektrischen Schaltung A method of producing an electrical circuit
08/04/2005DE10254662B4 Montageträger für Lichtemissionsdioden, Verfahren zum Montieren von Lichtemissionsdioden, flexibles Lichtemissionsdioden-Modul und Verfahren zur Herstellung desselben The same mounting support for light-emitting diodes, method for mounting light emitting diodes, a flexible light-emitting diode module and process for preparing
08/04/2005DE102004042032A1 Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung Laser processing method and laser processing apparatus
08/04/2005DE102004001108A1 Product production process for chips and actuators places foil and component on a substrate with a gap between them that is closed by foil wrinkling
08/04/2005CA2554113A1 Method for the production of a circuit board element and circuit board element
08/03/2005EP1560242A1 Controller with a thermal protector and a heating device incorporating the controller
08/03/2005EP1559740A1 Oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester, process of preparation and use
08/03/2005EP1559557A2 A method of making an inkjet printhead
08/03/2005EP1559296A1 Transparent window with non-transparent contact surface for a soldering bonding
08/03/2005EP1559147A2 Film comprising organic semiconductors
08/03/2005EP1558923A2 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors
08/03/2005EP1558422A1 Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam
08/03/2005EP1558373A2 Printing method using rubber stamp
08/03/2005EP1252804B1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
08/03/2005EP1135777B1 Particles
08/03/2005CN2715468Y Transmission device for wiring board producing machine
08/03/2005CN2715466Y Mixed insulation layer for soft printed circuit board
08/03/2005CN1650680A Circuit board with at least one electronic component
08/03/2005CN1650679A Method and device for treating flat and flexible work pieces
08/03/2005CN1650678A Method for creating a trench structure in a polymer substrate
08/03/2005CN1650476A Solder-bearing articles and method of retaining a solder mass thereon
08/03/2005CN1650429A A modular integrated circuit chip carrier
08/03/2005CN1650414A Method for the production of contact pads on a substrate and device for carrying out said method
08/03/2005CN1650413A 半导体器件 Semiconductor devices
08/03/2005CN1650230A Photocurable compositions containing reactive particles
08/03/2005CN1650057A Plural layer woven electronic textile, article and method
08/03/2005CN1650046A Method of plating nonconductor product
08/03/2005CN1649539A Woven electronic textile, yarn and article
08/03/2005CN1649480A Printed circuit board with electromagnetic interferring radiation inhibiting function
08/03/2005CN1649473A Production method of suspension board with circuit
08/03/2005CN1649472A Surface-mount base for electronic element
08/03/2005CN1649471A Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
08/03/2005CN1649470A Flexible board, connection method thereof, and connection structure thereof
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