| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/19/2005 | US6919158 Conductive pattern material and method for forming conductive pattern |
| 07/19/2005 | US6919137 Can be applied to a wiring structure, a circuit |
| 07/19/2005 | US6919013 Apparatus and method for electrolytically depositing copper on a workpiece |
| 07/19/2005 | US6919011 Electrolytic cell; vibration, agitation |
| 07/19/2005 | US6918989 Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same |
| 07/19/2005 | US6918666 Fabrication of functional device mounting board making use of inkjet technique |
| 07/19/2005 | US6918529 Method for producing metal/ceramic bonding circuit board |
| 07/19/2005 | US6918179 Method of deforming flexible cable sections extending between rigid printed circuit boards |
| 07/14/2005 | WO2005065001A1 Method and apparatus for manufacturing circuit board |
| 07/14/2005 | WO2005065000A1 Electromagnetically shielded slot transmission line |
| 07/14/2005 | WO2005064999A1 A printed wire board and associated mobile terminal |
| 07/14/2005 | WO2005064770A1 Surface mount-type vibration motor and fixation structure for surface mount-type vibration motor |
| 07/14/2005 | WO2005064668A1 Wafer level super stretch solder |
| 07/14/2005 | WO2005064354A1 Circuit pattern testing apparatus and circuit pattern testing method |
| 07/14/2005 | WO2005064262A1 Granular matter filled weapon guidance electronics unit |
| 07/14/2005 | WO2005064228A2 Lighting device of discharge lamp, illumination apparatus and illumination system |
| 07/14/2005 | WO2005064044A1 Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper foil |
| 07/14/2005 | WO2005063467A1 Method for producing flexible laminate |
| 07/14/2005 | WO2005063466A1 Method of producing flexible laminate sheet |
| 07/14/2005 | WO2005062803A2 Printed circuit dielectric foil and embedded capacitors |
| 07/14/2005 | WO2005062689A2 Suspension assembly method and the manufacture process |
| 07/14/2005 | WO2005033352A3 Deposition and patterning process |
| 07/14/2005 | WO2005008733A3 Modular electronic assembly and method of making |
| 07/14/2005 | WO2005004558A3 Method for the manufacture of printed circuit boards with embedded resistors |
| 07/14/2005 | WO2004112128A3 Low profile stacking system and method |
| 07/14/2005 | WO2004098247A3 Electronic control module for a removable connector and methods of assembling same |
| 07/14/2005 | WO2004022814A3 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 07/14/2005 | US20050154105 Compositions with polymers for advanced materials |
| 07/14/2005 | US20050153599 Electrode mounting structure and flat panel display employing the same |
| 07/14/2005 | US20050153567 Method of forming patterns |
| 07/14/2005 | US20050153558 Molded abrasive brush and methods of using for manufacture of printed circuit boards |
| 07/14/2005 | US20050153523 Method for compensating for CTE mismatch using phase change lead-free super plastic solders |
| 07/14/2005 | US20050153483 Carrier, method of manufacturing a carrier and an electronic device |
| 07/14/2005 | US20050153249 spraying metal particles over substrate having insulating pattern formed of thermosetting resin, then heating to dissolve the resin pattern and fix the metal particles on the resin pattern, and curing the resins |
| 07/14/2005 | US20050153220 Method of producing electronic circuit, and electronic circuit substrate |
| 07/14/2005 | US20050153195 Secondary battery |
| 07/14/2005 | US20050153078 Formation of solid layers on substrates |
| 07/14/2005 | US20050153061 formed at relatively low temperatures; have a relatively high capability to withstand expansion and contraction caused by heating and cooling of components; dipping dielectric material in solution of catalytic metal particles with slight electrostatic dipole |
| 07/14/2005 | US20050153060 Structure and method of embedding components in multi-layer substrates |
| 07/14/2005 | US20050153059 forming very narrow metal conductor lines on a surface of a resin substrate; oxidization resin surface (patterned); treatment with metal coordinating compound; electroless plating |
| 07/14/2005 | US20050152138 Small portable flashlight |
| 07/14/2005 | US20050152098 Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
| 07/14/2005 | US20050152097 Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
| 07/14/2005 | US20050151700 Method and system for forming electrically conductive pathways |
| 07/14/2005 | US20050151604 Triangular conforming transmission structure |
| 07/14/2005 | US20050151599 Module for radio-frequency applications |
| 07/14/2005 | US20050151597 Transmission line with a transforming impedance and solder lands |
| 07/14/2005 | US20050151303 Method for producing ceramic substrate and electronic component module using ceramic substrate |
| 07/14/2005 | US20050151271 comprising: curing agent to generate free radicals with heating; a radically polymerizable substance; and film-forming polymer, wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m |
| 07/14/2005 | US20050151269 UBM for fine pitch solder balland flip-chip packaging method using the same |
| 07/14/2005 | US20050151267 Semiconductor device and manufacturing method for the same |
| 07/14/2005 | US20050151247 Electronic device and intermediate product of electronic device |
| 07/14/2005 | US20050151246 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
| 07/14/2005 | US20050151233 Conductive material compositions, apparatus, systems, and methods |
| 07/14/2005 | US20050151197 Production method of flexible electronic device |
| 07/14/2005 | US20050150936 Bumping electronic components using transfer substrates |
| 07/14/2005 | US20050150880 Laser-based method and system for memory link processing with picosecond lasers |
| 07/14/2005 | US20050150879 Laser-based method and system for memory link processing with picosecond lasers |
| 07/14/2005 | US20050150770 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
| 07/14/2005 | US20050150686 Organic dielectric electronic interconnect structures and method for making |
| 07/14/2005 | US20050150685 Configuration having an electronic device electrically connected to a printed circuit board |
| 07/14/2005 | US20050150684 Electronic device and method for producing the same |
| 07/14/2005 | US20050150683 Methods of fabricating substrates and substrate precursor structures resulting therefrom |
| 07/14/2005 | US20050150682 Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material |
| 07/14/2005 | US20050150595 Process for producing substrate for flexible circuit board |
| 07/14/2005 | US20050150402 Printing device, production unit, and production method of electronic parts |
| 07/14/2005 | US20050150106 Embedded inductor and method of making |
| 07/14/2005 | DE10361344A1 Schaltermodul Switch module |
| 07/14/2005 | DE10356658A1 Verfahren zum Betrieb eines Lasersystems und Lasersystem für die Bearbeitung von Substraden A method of operating a laser system and laser system for processing Substraden |
| 07/14/2005 | DE10219427B4 Verfahren zur Herstellung einer mechanischen und einer elektrischen Verbindung zwischen einer Leiterplatte und einem auf dieser anzuordnenden Kontaktstift A method for manufacturing a mechanical and an electrical connection between a circuit board and a contact pin to be arranged on this |
| 07/14/2005 | DE102004061527A1 Stromschienenträger für eine Innenleuchte eines Fahrzeugs Busbar support for an interior light of a vehicle |
| 07/14/2005 | DE102004061526A1 Verbindungsstruktur zwischen einer Stromschienenbasis und einer gedruckten Schaltungsplatte Connection structure between a power rail base and a printed circuit board |
| 07/14/2005 | DE102004056466A1 Wärmeisolierungselement für Schaltungsanordnung Thermal insulation element for circuitry |
| 07/14/2005 | DE102004042056A1 Scanner-System Scanner system |
| 07/14/2005 | DE102004019343A1 An integrated control unit for water using domestic appliances has the water control solenoid valves mounted on the printed circuit board for the electronic control |
| 07/13/2005 | EP1553630A1 Modular board device and high frequency module and method for producing them |
| 07/13/2005 | EP1553629A2 Electrically conductive adhesive sheet, method of manufacturing the same, and electric power conversion equipment |
| 07/13/2005 | EP1553626A1 Multilayer printed wiring board |
| 07/13/2005 | EP1553450A1 Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
| 07/13/2005 | EP1553211A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 07/13/2005 | EP1553142A2 Polyimide based compositions comprising doped polyaniline and methods relating thereto |
| 07/13/2005 | EP1553131A1 Compositions with polymers for advanced materials |
| 07/13/2005 | EP1552732A1 Method and device for joining at least two parts |
| 07/13/2005 | EP1552731A1 Jetting device and method at a jetting device |
| 07/13/2005 | EP1552730A1 Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
| 07/13/2005 | EP1552729A2 Method for the manufacture of printed circuit boards with integral plated resistors |
| 07/13/2005 | EP1478607B1 Method for metallizing titanate-based ceramics |
| 07/13/2005 | EP1329141B1 Fine featured moldings of liquid crystalline polymers |
| 07/13/2005 | EP1115915B1 Electrochemical treatment assembly and process of feeding current to a printed board material |
| 07/13/2005 | EP0998756B1 Device and method for producing a chip-substrate connection |
| 07/13/2005 | EP0932500B1 Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 07/13/2005 | CN2710315Y Circuit substrate |
| 07/13/2005 | CN2710314Y Hooked pin of fibre-optical driver |
| 07/13/2005 | CN2710313Y Improved structure of circuit board cleaning machine |
| 07/13/2005 | CN2710312Y Organic film electroluminescent device |
| 07/13/2005 | CN2710311Y Automatic board pushing mechanism of printed circuit board puncher |
| 07/13/2005 | CN2710309Y Bridging element for mounting electronic element on circuit board |
| 07/13/2005 | CN2710308Y Wiring substrate |
| 07/13/2005 | CN2710160Y Circuit substrate |
| 07/13/2005 | CN1640216A Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method |