| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/28/2005 | US20050162841 Electromagnetically shielded circuit device and shielding method therefor |
| 07/28/2005 | US20050162840 Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board |
| 07/28/2005 | US20050162835 Production of via hole in flexible circuit printable board |
| 07/28/2005 | US20050162808 Surface-mount base for electronic element |
| 07/28/2005 | US20050162745 Vehicle rearview mirror system with compass sensor and method of making same |
| 07/28/2005 | US20050162647 Ingredient analysis method and ingredient analysis apparatus |
| 07/28/2005 | US20050162644 Fabrication method of semiconductor integrated circuit device |
| 07/28/2005 | US20050162604 Display device |
| 07/28/2005 | US20050162603 Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film |
| 07/28/2005 | US20050162180 Semiconductor testing device |
| 07/28/2005 | US20050162133 Low cost charger connections manufactured from conductive loaded resin-based material |
| 07/28/2005 | US20050161829 Method and structure to reduce risk of gold embritlement in solder joints |
| 07/28/2005 | US20050161826 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| 07/28/2005 | US20050161815 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 07/28/2005 | US20050161807 I/C package/thermal-solution retention mechanism with spring effect |
| 07/28/2005 | US20050161804 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
| 07/28/2005 | US20050161802 Semiconductor device |
| 07/28/2005 | US20050161783 Method for manufacturing circuit board, circuit board, and electronic equipment |
| 07/28/2005 | US20050161782 Hybrid integrated circuit device and manufacturing method of the same |
| 07/28/2005 | US20050161781 Hybrid integrated circuit device and manufacturing method thereof |
| 07/28/2005 | US20050161776 Flexible board, connection method thereof, and connection structure thereof |
| 07/28/2005 | US20050161775 Wiring circuit board and production method thereof |
| 07/28/2005 | US20050161756 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 07/28/2005 | US20050161493 Ultra-fine contact alignment |
| 07/28/2005 | US20050161492 Method of manufacturing mounting boards |
| 07/28/2005 | US20050161490 Method and apparatus for forming metal contacts on a substrate |
| 07/28/2005 | US20050161489 Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale |
| 07/28/2005 | US20050161437 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process |
| 07/28/2005 | US20050161426 Image-recording apparatus and image-recording process |
| 07/28/2005 | US20050161255 Multi-layer wiring board |
| 07/28/2005 | US20050161254 Multilayered circuit board for high-speed, differential signals |
| 07/28/2005 | US20050161252 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 07/28/2005 | US20050161251 Hybrid integrated circuit device and method of manufacturing the same |
| 07/28/2005 | US20050161250 Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board |
| 07/28/2005 | US20050161157 Substrate treating apparatus and method |
| 07/28/2005 | US20050161149 Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 07/28/2005 | US20050161142 Low cost conductive brushes manufactured from conductive loaded resin-based materials |
| 07/28/2005 | US20050160679 Screening of a printed-circuit electronics card mounted on a metal substrate |
| 07/28/2005 | US20050160594 Apparatus and method for replacing defective PCB of PCB panel |
| 07/28/2005 | US20050160591 Method for dissociating metals from metal compounds |
| 07/28/2005 | US20050160568 Support clip |
| 07/28/2005 | US20050160547 Low cost conductive brushes manufactured from conductive loaded resin-based materials |
| 07/28/2005 | DE4438299B4 Bipolares elektronisches Bauelement zur Montage auf Flachleiterplatinen Bipolar electronic device for mounting on flat printed circuit boards |
| 07/28/2005 | DE10360423A1 Equipped subassembly e.g. for motor vehicle technology, has equipped subassembly at least partly enclosed in filler material |
| 07/28/2005 | DE10359371A1 Passivierte Endoberflächen Passivated end surfaces |
| 07/28/2005 | DE102004059623A1 Drahtlos-Transceiver für ein Automobil Wireless transceiver for an automobile |
| 07/28/2005 | DE102004022755A1 Mehrschichtige Substratanordnung zur Reduzierung der Layout-Fläche The multi-layer substrate assembly to reduce layout area |
| 07/28/2005 | DE102004012810A1 Gedruckte Leiterplatte und Aufbau mit schrägen Durchkontakten Printed circuit board and structure with sloping vias |
| 07/28/2005 | DE102004001107A1 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
| 07/28/2005 | DE10160710B4 Verfahren und Vorrichtung zum Löten A method and apparatus for soldering |
| 07/28/2005 | DE10157985B4 Fluoreszenzanzeigeeinrichtung Fluorescent display device |
| 07/28/2005 | CA2552816A1 Uv led control loop and controller for uv curing |
| 07/28/2005 | CA2552799A1 Uv for ink jet printer |
| 07/28/2005 | CA2551397A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
| 07/27/2005 | EP1558067A1 Electromagnetic wave shielding light transmitting window material and process for producin the same |
| 07/27/2005 | EP1558066A1 Providing differentiated levels of solder paste on a circuit board |
| 07/27/2005 | EP1558065A2 Surface mounting of components |
| 07/27/2005 | EP1558064A1 High-pressure discharge lamp operation device and illumination appliance having the same |
| 07/27/2005 | EP1557438A1 Capsule type hardener and composition |
| 07/27/2005 | EP1557235A1 Lead-free solder and soldered article |
| 07/27/2005 | EP1556449A1 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 07/27/2005 | EP1556226A2 Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 07/27/2005 | EP1410320B1 Method for production of a conductor cross-over on a data support card |
| 07/27/2005 | EP1102823B1 Electroconductive, thermoplastic and heat-activated adhesive film |
| 07/27/2005 | EP0963021B1 Bus bar wiring board and method of producing the same |
| 07/27/2005 | EP0870306B1 Method of securing an electric contact to a ceramic layer as well as a resistance element thus manufactured |
| 07/27/2005 | EP0857403B1 Method of forming raised metallic contacts on electrical circuits for permanent bonding |
| 07/27/2005 | EP0710062B1 Multilayer printed wiring board and its manufacture |
| 07/27/2005 | CN2713777Y Improved arrangement for quick-dismantling cover for screw bolts in automation assembly |
| 07/27/2005 | CN2713776Y Auxiliary fixture for plate shearing machine |
| 07/27/2005 | CN2713666Y Electric connector assembly |
| 07/27/2005 | CN1647601A Filtration of flux contaminants |
| 07/27/2005 | CN1647598A Method of manufacturing an electronic device |
| 07/27/2005 | CN1647597A Fast production method for printed board |
| 07/27/2005 | CN1647596A Circuit board and method for manufacturing the same |
| 07/27/2005 | CN1647595A Electrically insulating body, and electronic device |
| 07/27/2005 | CN1647276A Method for coating metal surfaces and substrate having a coated metal surface as protection for copying process and elements concerned |
| 07/27/2005 | CN1647271A Semiconductor device and method of manufacturing same |
| 07/27/2005 | CN1647268A Carrier, method of manufacturing a carrier and an electronic device |
| 07/27/2005 | CN1647267A Circuit board, process for producing the same and power module |
| 07/27/2005 | CN1647262A Mold release layer transferring film and laminate film |
| 07/27/2005 | CN1647261A Method for connecting substrates and composite element |
| 07/27/2005 | CN1647258A Method for the production of structured layers on substrates |
| 07/27/2005 | CN1646728A Method for electroless deposition of a metal layer on selected portions of a substrate |
| 07/27/2005 | CN1646722A Method for coating metal surfaces and substrate having a coated metal surface |
| 07/27/2005 | CN1646721A Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 07/27/2005 | CN1646658A Two-pack type adhesive |
| 07/27/2005 | CN1646657A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| 07/27/2005 | CN1646640A Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particle and varnish |
| 07/27/2005 | CN1646592A Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof |
| 07/27/2005 | CN1646418A Method for producing a product having a structured surface |
| 07/27/2005 | CN1646417A Method of manufacturing an electronic device |
| 07/27/2005 | CN1645990A Circuit substrate manufacturing method |
| 07/27/2005 | CN1645988A Methods of forming electronic and optical components using laser ablation |
| 07/27/2005 | CN1645987A Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board |
| 07/27/2005 | CN1645986A Production for printing circuit basilar plate |
| 07/27/2005 | CN1645985A Electronic module, device therwith and verifying method for press connection thereon |
| 07/27/2005 | CN1645669A Double density quasi-coax transmission lines |
| 07/27/2005 | CN1645602A Semiconductor device, semiconductor chip, method for manufacturing semiconductor device, and electronic apparatus |
| 07/27/2005 | CN1645600A 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof |