| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/07/2005 | WO2005061776A1 Electric interface for water-bearing household devices |
| 07/07/2005 | WO2005061598A1 Low temperature sintering nanoparticle compositions |
| 07/07/2005 | WO2005061205A1 Circuit insulation methods and systems for vehicle door latches |
| 07/07/2005 | WO2005060668A2 Methods of modifying surfaces |
| 07/07/2005 | WO2005060401A2 Direct contact power transfer pad and method of making same |
| 07/07/2005 | WO2005005088A3 Method and apparatus for flip chip attachment by post-collapse re-melt and re-solidification of bumps |
| 07/07/2005 | WO2004045016A3 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards |
| 07/07/2005 | WO2002099849A3 Apparatus for microdeposition of multiple fluid materials |
| 07/07/2005 | US20050148217 Memory card with chamfer |
| 07/07/2005 | US20050148214 Lithographic contact elements |
| 07/07/2005 | US20050148165 Conductive pattern producing method and its applications |
| 07/07/2005 | US20050148164 A suspension for filling via holes in silicon and method for making the same |
| 07/07/2005 | US20050148111 Method and system for producing resilient solder joints |
| 07/07/2005 | US20050147917 Superfine metal of defined particle size having organic coating on surface sintered with latent curing agent in stable dispersion medium; printed circuits; noncracking, peel resistance; transferring paste on substrate by relief, intaglio, offset, or screen printing |
| 07/07/2005 | US20050147839 metallic alloy foil for electroconductive, thermoconductive paths in a direction along the plane of the sheet; use in vehicle, convert direct current power supplied from a battery to alternate current power, then supply to the motor engine; lead-free |
| 07/07/2005 | US20050147801 Use of gold surface finish on a copper wire-bond substrate, method of making same, and method of testing same |
| 07/07/2005 | US20050147743 Fabrication of functional device mounting board making use of inkjet technique |
| 07/07/2005 | US20050147740 Method of applying a cover layer to a structured base layer |
| 07/07/2005 | US20050147737 By adjusting the relative positional relation between a supply surface onto which a wiring material is supplied and a wiring pattern forming surface using wiring pattern forming information, corresponding to the irregularities of the wiring pattern forming surface; ink jets |
| 07/07/2005 | US20050147638 Comprising by weight: 30-40 percent isophorone, 40-50 percent organo-clay absorber, 25-35 percent bisphenol A diglycidal ether polymer combined with 10-20 percent polyamide resin hardener |
| 07/07/2005 | US20050147522 Conductive material and method for filling via-hole |
| 07/07/2005 | US20050146859 Compact display assembly |
| 07/07/2005 | US20050146858 Card-type electronic device having multilayer printed wiring board and method for manufacturing card-type electronic device |
| 07/07/2005 | US20050146854 High frequency module |
| 07/07/2005 | US20050146839 Forming thin layer structures by ablation |
| 07/07/2005 | US20050146588 Pattern formation method and substrate manufacturing apparatus |
| 07/07/2005 | US20050146551 Droplet discharge device, and method for forming pattern, and method for manufacturing display device |
| 07/07/2005 | US20050146403 High-frequency module and its manufacturing method |
| 07/07/2005 | US20050146390 Multi-layer substrate having impedance-matching hole |
| 07/07/2005 | US20050146214 Connectorless FFC connection |
| 07/07/2005 | US20050146072 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials |
| 07/07/2005 | US20050146052 Semiconductor device and semiconductor module |
| 07/07/2005 | US20050146047 Method for fabricating a semiconductor interconnect having conductive spring contacts |
| 07/07/2005 | US20050146039 High reliability multilayer circuit substrates and methods for their formation |
| 07/07/2005 | US20050146038 Multilayer interconnection board and production method thereof |
| 07/07/2005 | US20050146031 Low profile stacking system and method |
| 07/07/2005 | US20050146030 Solder ball pad structure |
| 07/07/2005 | US20050146025 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/07/2005 | US20050146024 Electronics unit |
| 07/07/2005 | US20050146019 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board |
| 07/07/2005 | US20050146011 Pitch change and chip scale stacking system and method |
| 07/07/2005 | US20050145998 Surface mount package |
| 07/07/2005 | US20050145997 Layer sequence for producing a composite material for electromechanical components |
| 07/07/2005 | US20050145832 Polyimide based compositions comprising doped polyaniline and methods and compositions relating thereto |
| 07/07/2005 | US20050145609 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/07/2005 | US20050145608 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/07/2005 | US20050145600 Method of fabricating inkjet nozzles |
| 07/07/2005 | US20050145595 Process for Manufacturing Printed Circuit Boards with Protected Spaces Between Tracks |
| 07/07/2005 | US20050145506 Electrochemical etching of circuitry for high density interconnect electronic modules |
| 07/07/2005 | US20050145414 Metal core multilayer printed wiring board |
| 07/07/2005 | US20050145413 Method for fabricating a warpage-preventive circuit board |
| 07/07/2005 | US20050145412 Circuit carrier and package structure thereof |
| 07/07/2005 | US20050145411 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects |
| 07/07/2005 | US20050145408 Electronic component |
| 07/07/2005 | US20050145319 Adhesive coating on substrate film; applying a ceramic slip to the substrate film; drying the ceramic slip |
| 07/07/2005 | US20050145311 Hydrogen sulfide gas causes color change on unprotected copper; qualitative test to determine the presence of a corrosion inhibitor on exposed surface of a microelectronic device subjected multiple cleanings |
| 07/07/2005 | US20050145169 Apparatus for improving stencil/screen print quality |
| 07/07/2005 | US20050145166 Jet singulation |
| 07/07/2005 | US20050145123 Resin-coated metal plate for use in perforating printed-wiring board |
| 07/07/2005 | US20050144780 Circuit boards; heater-punches, pressuring holes, positioning stage for laminate board materials; mold releasing sheet, supply reel, take-up reel, guide rolls |
| 07/07/2005 | US20050144767 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board |
| 07/07/2005 | DE19935677B4 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten Paste for screen printing of electrical structures to support substrates |
| 07/07/2005 | DE19781160B4 Elektrooptische hybride Verdrahtungsplatine und Verfahren zur Herstellung derselben An electro-optic hybrid wiring board and method for producing same |
| 07/07/2005 | DE19637886B4 Substrat für gedruckte Schaltungen und Verfahren zum Anlöten eines ersten und eines zweiten Bauteils an einem gedruckten Leitungsmuster auf einem Substrat A substrate for printed circuits and methods for soldering a first and a second component on a printed wiring pattern on a substrate |
| 07/07/2005 | DE10392736T5 Leuchtmodul Light module |
| 07/07/2005 | DE10392441T5 Eine miniaturisierte Kontaktfeder A miniaturized contact spring |
| 07/07/2005 | DE10357837A1 Method for surface mounting of acoustic transducers, each containing at least one attenuation element, using application of surface mounted device-adhesive on base element, placing attenuation element on adhesive and hardening the adhesive |
| 07/07/2005 | DE10356498A1 Elektrisches Bauelement und Schaltungsanordnung Electrical component and circuit |
| 07/07/2005 | DE10351720A1 Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen und Verfahren zum Herstellen desselben Test standard for testing thereof used in the surface mounting optical recognition systems and methods for preparing |
| 07/07/2005 | DE10297731T5 Umkehrprägetechnik Reverse embossing technology |
| 07/06/2005 | EP1551211A1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 07/06/2005 | EP1551210A1 Circuit formation substrate manufacturing method and circuit formation substrate material |
| 07/06/2005 | EP1551037A1 Flexible carrier with electrically conducting structure |
| 07/06/2005 | EP1550889A2 Opto-electronic module comprising flexible electric connection cable and method of making the same |
| 07/06/2005 | EP1550888A1 Methods of forming electronic and optical components using laser ablation |
| 07/06/2005 | EP1550698A2 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
| 07/06/2005 | EP1550358A2 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards |
| 07/06/2005 | EP1550176A1 Electronic circuitry provided with an integrated antenna |
| 07/06/2005 | EP1550162A2 Multilayer substrate |
| 07/06/2005 | EP1550140A1 Techniques for fabricating a resistor on a flexible base material |
| 07/06/2005 | EP1549962A2 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| 07/06/2005 | EP1513621A4 Method for patterning carbon nanotube coating and carbon nanotube wiring |
| 07/06/2005 | EP1483419A4 Lead-free tin-silver-copper alloy solder composition |
| 07/06/2005 | EP1349696B1 Method of laser welding |
| 07/06/2005 | EP1171292A4 Process for direct digital printing of circuit boards |
| 07/06/2005 | EP1155445B1 Method for producing electrically conductive connections |
| 07/06/2005 | EP0977471B1 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 07/06/2005 | CN1636426A Method for drilling holes in a substrate, in particular in circuit substrate |
| 07/06/2005 | CN1636425A Fine featured moldings of liquid crystalline polymers |
| 07/06/2005 | CN1636167A Method and materials for printing particle-enhanced electrical contacts |
| 07/06/2005 | CN1636044A Process for producing electrical apparatus |
| 07/06/2005 | CN1635949A Apparatus for microdeposition of multiple fluid materials |
| 07/06/2005 | CN1635933A Ultrafine fluid jet apparatus |
| 07/06/2005 | CN1635830A Method and apparatus for predicting sporting success conditions |
| 07/06/2005 | CN1635825A A circuit board and manufacturing method thereof |
| 07/06/2005 | CN1635824A Highly radiating multi-layer circuit board and manufacturing method thereof |
| 07/06/2005 | CN1209951C Method for manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 07/06/2005 | CN1209950C Circuit card with multi-voltage plane and multi-signal plane |
| 07/06/2005 | CN1209949C Method of forming welding zone on circuit board |
| 07/06/2005 | CN1209948C Integrated module board with embedded IC chip and passive element and its production method |