Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2005
07/13/2005CN1640215A Liquid crystal polymers for flexible circuits
07/13/2005CN1640213A Method for making conductive circuits using powdered metals
07/13/2005CN1640212A Digital application of protective soldermask to printed circuit boards
07/13/2005CN1639918A Anisotropic conductive film and method for producing the same
07/13/2005CN1639853A Electronic circuit device and porduction method therefor
07/13/2005CN1639641A Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards
07/13/2005CN1639385A Immersion plating of silver
07/13/2005CN1639384A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board
07/13/2005CN1639294A 各向异性导电薄膜 Anisotropic conductive film
07/13/2005CN1639290A Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
07/13/2005CN1639246A Printing of organic conductive polymers containing additives
07/13/2005CN1639085A Method for metallizing titanate-based ceramics
07/13/2005CN1638957A Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
07/13/2005CN1638913A Laser machining method
07/13/2005CN1638912A Operating method and trolley for a laser machining system
07/13/2005CN1638618A Electromagnetic masking flexible circuit substrate
07/13/2005CN1638612A Multilayer printed wiring board and producing method thereof
07/13/2005CN1638611A Printed circuit board and package having oblique vias
07/13/2005CN1638610A Method for producing circuit substrate, and circuit substrate and electronic machine
07/13/2005CN1638609A Connecting structure for connecting an image pick-up unit to a wiring plate
07/13/2005CN1638608A 印刷电路板 A printed circuit board
07/13/2005CN1638607A Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device
07/13/2005CN1638606A Method for producing electronic circuit and electronic circuit substrate
07/13/2005CN1638605A Method for forming a circuit, apparatus for forming circuit board and circuit and ink set
07/13/2005CN1638604A Method and device for contactless treatment of flat objects in through type treatment equipment
07/13/2005CN1638603A Method and device for treating flat objects in through type treating apparatus
07/13/2005CN1638602A Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
07/13/2005CN1638600A Wiring circuit board and production method thereof
07/13/2005CN1638194A Adhesive film for circuit connection, and circuit connection structure
07/13/2005CN1638169A Preparation of flexible metal foil/polyimide laminate
07/13/2005CN1638117A High frequency module
07/13/2005CN1638114A Power converter package with enhanced thermal management
07/13/2005CN1638104A Hybrid integrated circuit device and manufacturing method of the same
07/13/2005CN1638103A Tape circuit substrate with reduced size of base film
07/13/2005CN1638101A Inductor element containing circuit board and power amplifier module
07/13/2005CN1638074A Semiconductor device and electronic equipment using the same
07/13/2005CN1638072A Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
07/13/2005CN1638002A Manufacturing method of plasma display device
07/13/2005CN1637963A Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same
07/13/2005CN1637450A Opto-electronic module comprising flexible electric connection cable and method of making the same
07/13/2005CN1637168A Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method
07/13/2005CN1637105A Adhesive for circuit components connection circuit board and producing method thereof
07/13/2005CN1636797A Bus bar substrate for vehicle interior light
07/13/2005CN1636796A Connecting structure between busbar base and printed circuit board
07/13/2005CN1636713A Scraper for screen process press
07/13/2005CN1636664A Soldering tin connecting device
07/13/2005CN1636663A Jet type welding apparatus
07/13/2005CN1211004C Electronic element installing method
07/13/2005CN1211002C Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
07/13/2005CN1211000C Rigidity flexible base board and camera using the same
07/13/2005CN1210796C Power transistor module, power amplifier and method in fabrication thereof
07/13/2005CN1210795C Electronic device and its manufacturing method
07/13/2005CN1210620C Ultraviolet-curable resin composition and photosolder resist ink containing the composition
07/13/2005CN1210612C Motor connecting structure for camera
07/13/2005CN1210439C Method for mfg. electronic parts and said electronic parts
07/12/2005US6917848 Production system for printed wiring board
07/12/2005US6917525 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
07/12/2005US6917524 Extension mechanism and method for assembling overhanging components
07/12/2005US6917510 Extended terminal ceramic SMD
07/12/2005US6917509 Single layer capacitor with dissimilar metallizations
07/12/2005US6917482 Optical module mounted body and securing method of optical module
07/12/2005US6917259 High-frequency module substrate device
07/12/2005US6917120 Microchip controller board
07/12/2005US6917119 Low fabrication cost, high performance, high reliability chip scale package
07/12/2005US6917118 Semiconductor device
07/12/2005US6917113 Useful for the assembly of passive components and organic substrates with conventional ceramic packages
07/12/2005US6917104 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
07/12/2005US6916995 Optimization of routing layers and board space requirements for ball grid array package implementations including single and multi-layer routing
07/12/2005US6916994 Conformal sealing film
07/12/2005US6916987 Built-in unit for a transmission control of a motor vehicle
07/12/2005US6916873 Mixture of epoxy resin, curing agent and filler
07/12/2005US6916865 Esterification of acids and salts by heating and mixing with silicon and nitrogen compounds, to from reaction products used as adjuvants, curing agents or adhesion intensifiers, having storage stability
07/12/2005US6916856 Thermosetting resin compositions containing maleimide and/or vinyl compounds
07/12/2005US6916741 Capture compounds for electronic plating compositions and electronic packaging device manufacture
07/12/2005US6916734 Contact-forming method
07/12/2005US6916731 Ball transferring method and apparatus
07/12/2005US6916706 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
07/12/2005US6916685 Method of plating metal layer over isolated pads on semiconductor package substrate
07/12/2005US6916670 Electronic package repair process
07/12/2005US6916539 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof
07/12/2005US6916527 Resin moldings
07/12/2005US6916433 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
07/12/2005US6916378 Rotary dispenser and method for use
07/12/2005US6916185 Connection of integrated circuit to a substrate
07/12/2005US6916181 Remountable connector for land grid array packages
07/12/2005US6916121 Optical sub-assembly for optoelectronic modules
07/12/2005US6915945 Method for contact-connecting an electrical component to a substrate having a conductor structure
07/12/2005US6915944 A thermosetting adhesive mixtures comprising a hardening agent, including two carboxylic acids having different melting points; for soldering semiconductor chip onto circuit board
07/12/2005US6915942 Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy
07/12/2005US6915941 Method for local application of solder to preselected areas on a printed circuit board
07/12/2005US6915940 Device for applying solder globules
07/12/2005US6915828 Punch die for punching and laminating simultaneously
07/12/2005US6915566 Method of fabricating flexible circuits for integrated circuit interconnections
07/12/2005CA2310765C Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member
07/12/2005CA2162254C Printing screen and method for printing a variable thickness pattern
07/07/2005WO2005062686A1 Surface treating method for wiring board and method for manufacturing electrical device
07/07/2005WO2005062685A1 Wiring forming method, wiring forming apparatus, and wiring board
07/07/2005WO2005062464A1 Surface-mounted passive electronic components, and structure and method for mounting them
07/07/2005WO2005062317A1 Wound capacitor with ball-and-lead configuration
07/07/2005WO2005062028A1 Substrate inspection device