Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/03/2005 | CN1649145A Module with a built-in component, and electronic device with the same |
08/03/2005 | CN1649140A Hybrid integrated circuit device and method of manufacturing the same |
08/03/2005 | CN1649114A Method for producing wiring base board |
08/03/2005 | CN1649060A Control unit with thermal protection and an electrical heating device comprising the control unit |
08/03/2005 | CN1649051A Chip type battery |
08/03/2005 | CN1649043A Electronic component |
08/03/2005 | CN1649038A Conductor for flat cabal and its producing method and flat cabal |
08/03/2005 | CN1648640A Ingredient analysis method and ingredient analysis apparatus |
08/03/2005 | CN1648160A Compositions with polymers for advanced materials |
08/03/2005 | CN1213651C Electronic module and its producing method |
08/03/2005 | CN1213650C Method of manufacturing a printed circuit board shielded against interfering radiation |
08/03/2005 | CN1213646C Multi-layered printed circuit board and its making process |
08/03/2005 | CN1213645C Method for producing surface treated copper foil |
08/03/2005 | CN1213642C Interlayer connecting method and apparatus |
08/03/2005 | CN1213491C Fixing device of plate-type magnetic-resistance sensing element |
08/03/2005 | CN1213479C Electronic packaged component with high density interconnection layer |
08/03/2005 | CN1213468C Joint head and parts installation equipment |
08/03/2005 | CN1213442C Anisotropically conductive paste |
08/03/2005 | CN1212996C Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate |
08/02/2005 | US6925413 Method and system for detecting a spatial movement state of moving objects |
08/02/2005 | US6925255 Camera |
08/02/2005 | US6924987 Wiring board and process for producing the same |
08/02/2005 | US6924971 High dielectric constant composite material and multilayer wiring board using the same |
08/02/2005 | US6924964 Relay device and relay device mounting structure |
08/02/2005 | US6924883 Exposure device |
08/02/2005 | US6924882 Balanced positioning system for use in lithographic apparatus |
08/02/2005 | US6924867 Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment |
08/02/2005 | US6924712 Semi-suspended coplanar waveguide on a printed circuit board |
08/02/2005 | US6924655 Probe card for use with microelectronic components, and methods for making same |
08/02/2005 | US6924559 Electronic device with heat conductive encasing device |
08/02/2005 | US6924553 Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same |
08/02/2005 | US6924440 a terminal is proximate an electrode, a conductive paste is deposited on the terminal and has an oxidation reduced region which is covered with an oxidation prevention layer |
08/02/2005 | US6924439 Signal conducting applique and method for use with printed circuit board |
08/02/2005 | US6924437 Techniques for coupling an object to a circuit board using a surface mount coupling device |
08/02/2005 | US6924245 Comprising titanium oxide crystals and oxide crystals of calcium-titanium-silicon; fired at low temperature and high dielectric constant, small thermal expansion coefficient |
08/02/2005 | US6924224 Method of forming filled blind vias |
08/02/2005 | US6924043 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
08/02/2005 | US6924024 Copper-clad laminate |
08/02/2005 | US6923919 Preethching liquid crystalline polymer; depositing metal |
08/02/2005 | US6923875 Tin, silver, copper alloy |
08/02/2005 | US6923703 Method of manufacturing plasma display device |
08/02/2005 | US6923691 Circuit board standoff |
08/02/2005 | US6923678 Device for temporarily fastening electronic component to circuit board |
08/02/2005 | US6923658 Support for an integrated circuit package having a column grid array interconnect |
08/02/2005 | US6923651 Sheet material having metal points and method for the production thereof |
08/02/2005 | US6923406 Fixing member for fixing an object to be attached to a plate and clamp with the fixing member |
08/02/2005 | US6923117 Solder paste printing apparatus and printing method |
08/02/2005 | US6923057 Liquid level sending unit with flexible sensor board |
07/28/2005 | WO2005069714A1 Method for gluing a circuit component to a circuit board |
07/28/2005 | WO2005069708A1 Circuits, multilayer circuits, and method of manufacture thereof |
07/28/2005 | WO2005069707A1 Multilayer printed wiring board and test body for printed wiring board |
07/28/2005 | WO2005069706A1 Circuit board and method for producing the same |
07/28/2005 | WO2005069705A1 Metal pattern and process for producing the same |
07/28/2005 | WO2005069704A1 Nozzle arrangement and method for processing a material for processing with a processing medium |
07/28/2005 | WO2005069462A1 Electric device for junction and its manufacturing method |
07/28/2005 | WO2005069428A1 Transmission line having a transforming impedance |
07/28/2005 | WO2005069364A1 Mounted board, electronic component mounting method, electronic component, and wiring board |
07/28/2005 | WO2005069354A2 Advanced packaging shell for pocketable consumer electronic devices |
07/28/2005 | WO2005069320A1 Thin film capacitor, manufacturing method of the thin film capacitor, electronic device manufacturing method, and electronic device |
07/28/2005 | WO2005069318A1 Magnetic element |
07/28/2005 | WO2005069313A1 Insulation film and method of forming insulation film |
07/28/2005 | WO2005069068A1 Method for gravure printing transparent electrodes, and ink composition therefor |
07/28/2005 | WO2005068857A1 Heating press roll |
07/28/2005 | WO2005068725A1 Plug-in fixing type light emitting device |
07/28/2005 | WO2005068573A1 Adhesive film and method for producing the same |
07/28/2005 | WO2005068510A1 Uv led control loop and controller for uv curing |
07/28/2005 | WO2005068508A1 Uv for ink jet printer |
07/28/2005 | WO2005068197A1 Method and device for printing a fabric |
07/28/2005 | WO2005068185A1 Polyimide-metal laminated body and polyimide circuit board |
07/28/2005 | WO2005068183A1 Continuous production method for both-sided conductor polyimide laminate |
07/28/2005 | WO2005068182A1 Continuous production method for both-sided conductor polyimide laminate |
07/28/2005 | WO2005068171A1 Press for the production of laminates |
07/28/2005 | WO2005068134A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components |
07/28/2005 | WO2005068123A1 Reflow furnace |
07/28/2005 | WO2005067693A2 Method and apparatus to create electrical junctions for information routing in textile structures |
07/28/2005 | WO2005034153A3 Method of producing a composite multilayer |
07/28/2005 | WO2005010930A3 Method for forming high resolution electronic circuits |
07/28/2005 | WO2004067664A8 Thermo-activated adhesive material for fpcb agglutinations |
07/28/2005 | WO2003096775A3 Thermal dissipating printed circuit board and methods |
07/28/2005 | US20050165152 applying a repelling barrier selectively to a substrate; applying a radiant energy sensitive material to the substrate in spaces formed by the repelling barrier composition; and removing the repelling barrier composition to form a pattern on the substrate |
07/28/2005 | US20050165151 Resin composition |
07/28/2005 | US20050165135 Liquid thermosetting ink |
07/28/2005 | US20050164534 Interconnection device and system |
07/28/2005 | US20050164531 Connector coupled to board module |
07/28/2005 | US20050164527 Method and system for batch forming spring elements in three dimensions |
07/28/2005 | US20050164526 High performance interposer for a chip package using deformable button contacts |
07/28/2005 | US20050164495 Method to improve planarity of electroplated copper |
07/28/2005 | US20050164492 Method of manufacturing flexible wiring board |
07/28/2005 | US20050164416 Method for processing an integrated circuit |
07/28/2005 | US20050164022 Polyamide, polyesters, or copolymer thereof; axial stretching; printed circuits |
07/28/2005 | US20050164020 use of a hot-press method where ion exchange groups are introduced in a resin, metal ions are bound to said groups, and then chemically reduced to form metal at the surface of the resin in order to increase bonding strength between the metal and resin base |
07/28/2005 | US20050164006 Made without using an adhesive, base material and a high molecular plate of liquid crystal polymer or polyimide are press bonded after applying an activating treatment of electric discharge in an inert gas atmosphere and a sputter etching treatment to their surfaces; printed wiring boards |
07/28/2005 | US20050163987 metal oxide or spinel capable of activation by electromagnetic radiation forms metal nuclei; graphite, carbon black, inorganic or organic black pigment absorb radiation; printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits |
07/28/2005 | US20050163982 Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same |
07/28/2005 | US20050163981 Method for bonding ceramic to copper, without creating a bow in the copper |
07/28/2005 | US20050163966 Surface mounting of components |
07/28/2005 | US20050163932 Fabrication of organic electronic circuits by contact printing techniques |
07/28/2005 | US20050163919 Fast production method for printed board |
07/28/2005 | US20050163917 Direct writeTM system |
07/28/2005 | US20050163415 Methods of forming electronic and optical components using laser ablation |