Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2005
08/03/2005CN1649145A Module with a built-in component, and electronic device with the same
08/03/2005CN1649140A Hybrid integrated circuit device and method of manufacturing the same
08/03/2005CN1649114A Method for producing wiring base board
08/03/2005CN1649060A Control unit with thermal protection and an electrical heating device comprising the control unit
08/03/2005CN1649051A Chip type battery
08/03/2005CN1649043A Electronic component
08/03/2005CN1649038A Conductor for flat cabal and its producing method and flat cabal
08/03/2005CN1648640A Ingredient analysis method and ingredient analysis apparatus
08/03/2005CN1648160A Compositions with polymers for advanced materials
08/03/2005CN1213651C Electronic module and its producing method
08/03/2005CN1213650C Method of manufacturing a printed circuit board shielded against interfering radiation
08/03/2005CN1213646C Multi-layered printed circuit board and its making process
08/03/2005CN1213645C Method for producing surface treated copper foil
08/03/2005CN1213642C Interlayer connecting method and apparatus
08/03/2005CN1213491C Fixing device of plate-type magnetic-resistance sensing element
08/03/2005CN1213479C Electronic packaged component with high density interconnection layer
08/03/2005CN1213468C Joint head and parts installation equipment
08/03/2005CN1213442C Anisotropically conductive paste
08/03/2005CN1212996C Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate
08/02/2005US6925413 Method and system for detecting a spatial movement state of moving objects
08/02/2005US6925255 Camera
08/02/2005US6924987 Wiring board and process for producing the same
08/02/2005US6924971 High dielectric constant composite material and multilayer wiring board using the same
08/02/2005US6924964 Relay device and relay device mounting structure
08/02/2005US6924883 Exposure device
08/02/2005US6924882 Balanced positioning system for use in lithographic apparatus
08/02/2005US6924867 Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment
08/02/2005US6924712 Semi-suspended coplanar waveguide on a printed circuit board
08/02/2005US6924655 Probe card for use with microelectronic components, and methods for making same
08/02/2005US6924559 Electronic device with heat conductive encasing device
08/02/2005US6924553 Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same
08/02/2005US6924440 a terminal is proximate an electrode, a conductive paste is deposited on the terminal and has an oxidation reduced region which is covered with an oxidation prevention layer
08/02/2005US6924439 Signal conducting applique and method for use with printed circuit board
08/02/2005US6924437 Techniques for coupling an object to a circuit board using a surface mount coupling device
08/02/2005US6924245 Comprising titanium oxide crystals and oxide crystals of calcium-titanium-silicon; fired at low temperature and high dielectric constant, small thermal expansion coefficient
08/02/2005US6924224 Method of forming filled blind vias
08/02/2005US6924043 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
08/02/2005US6924024 Copper-clad laminate
08/02/2005US6923919 Preethching liquid crystalline polymer; depositing metal
08/02/2005US6923875 Tin, silver, copper alloy
08/02/2005US6923703 Method of manufacturing plasma display device
08/02/2005US6923691 Circuit board standoff
08/02/2005US6923678 Device for temporarily fastening electronic component to circuit board
08/02/2005US6923658 Support for an integrated circuit package having a column grid array interconnect
08/02/2005US6923651 Sheet material having metal points and method for the production thereof
08/02/2005US6923406 Fixing member for fixing an object to be attached to a plate and clamp with the fixing member
08/02/2005US6923117 Solder paste printing apparatus and printing method
08/02/2005US6923057 Liquid level sending unit with flexible sensor board
07/2005
07/28/2005WO2005069714A1 Method for gluing a circuit component to a circuit board
07/28/2005WO2005069708A1 Circuits, multilayer circuits, and method of manufacture thereof
07/28/2005WO2005069707A1 Multilayer printed wiring board and test body for printed wiring board
07/28/2005WO2005069706A1 Circuit board and method for producing the same
07/28/2005WO2005069705A1 Metal pattern and process for producing the same
07/28/2005WO2005069704A1 Nozzle arrangement and method for processing a material for processing with a processing medium
07/28/2005WO2005069462A1 Electric device for junction and its manufacturing method
07/28/2005WO2005069428A1 Transmission line having a transforming impedance
07/28/2005WO2005069364A1 Mounted board, electronic component mounting method, electronic component, and wiring board
07/28/2005WO2005069354A2 Advanced packaging shell for pocketable consumer electronic devices
07/28/2005WO2005069320A1 Thin film capacitor, manufacturing method of the thin film capacitor, electronic device manufacturing method, and electronic device
07/28/2005WO2005069318A1 Magnetic element
07/28/2005WO2005069313A1 Insulation film and method of forming insulation film
07/28/2005WO2005069068A1 Method for gravure printing transparent electrodes, and ink composition therefor
07/28/2005WO2005068857A1 Heating press roll
07/28/2005WO2005068725A1 Plug-in fixing type light emitting device
07/28/2005WO2005068573A1 Adhesive film and method for producing the same
07/28/2005WO2005068510A1 Uv led control loop and controller for uv curing
07/28/2005WO2005068508A1 Uv for ink jet printer
07/28/2005WO2005068197A1 Method and device for printing a fabric
07/28/2005WO2005068185A1 Polyimide-metal laminated body and polyimide circuit board
07/28/2005WO2005068183A1 Continuous production method for both-sided conductor polyimide laminate
07/28/2005WO2005068182A1 Continuous production method for both-sided conductor polyimide laminate
07/28/2005WO2005068171A1 Press for the production of laminates
07/28/2005WO2005068134A1 Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components
07/28/2005WO2005068123A1 Reflow furnace
07/28/2005WO2005067693A2 Method and apparatus to create electrical junctions for information routing in textile structures
07/28/2005WO2005034153A3 Method of producing a composite multilayer
07/28/2005WO2005010930A3 Method for forming high resolution electronic circuits
07/28/2005WO2004067664A8 Thermo-activated adhesive material for fpcb agglutinations
07/28/2005WO2003096775A3 Thermal dissipating printed circuit board and methods
07/28/2005US20050165152 applying a repelling barrier selectively to a substrate; applying a radiant energy sensitive material to the substrate in spaces formed by the repelling barrier composition; and removing the repelling barrier composition to form a pattern on the substrate
07/28/2005US20050165151 Resin composition
07/28/2005US20050165135 Liquid thermosetting ink
07/28/2005US20050164534 Interconnection device and system
07/28/2005US20050164531 Connector coupled to board module
07/28/2005US20050164527 Method and system for batch forming spring elements in three dimensions
07/28/2005US20050164526 High performance interposer for a chip package using deformable button contacts
07/28/2005US20050164495 Method to improve planarity of electroplated copper
07/28/2005US20050164492 Method of manufacturing flexible wiring board
07/28/2005US20050164416 Method for processing an integrated circuit
07/28/2005US20050164022 Polyamide, polyesters, or copolymer thereof; axial stretching; printed circuits
07/28/2005US20050164020 use of a hot-press method where ion exchange groups are introduced in a resin, metal ions are bound to said groups, and then chemically reduced to form metal at the surface of the resin in order to increase bonding strength between the metal and resin base
07/28/2005US20050164006 Made without using an adhesive, base material and a high molecular plate of liquid crystal polymer or polyimide are press bonded after applying an activating treatment of electric discharge in an inert gas atmosphere and a sputter etching treatment to their surfaces; printed wiring boards
07/28/2005US20050163987 metal oxide or spinel capable of activation by electromagnetic radiation forms metal nuclei; graphite, carbon black, inorganic or organic black pigment absorb radiation; printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits
07/28/2005US20050163982 Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
07/28/2005US20050163981 Method for bonding ceramic to copper, without creating a bow in the copper
07/28/2005US20050163966 Surface mounting of components
07/28/2005US20050163932 Fabrication of organic electronic circuits by contact printing techniques
07/28/2005US20050163919 Fast production method for printed board
07/28/2005US20050163917 Direct writeTM system
07/28/2005US20050163415 Methods of forming electronic and optical components using laser ablation