| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/21/2005 | US20050155866 additive consumption inhibiting alcohol and brightener degradation inhibitor compound in copper plating bath; increases the life of the plating bath and improves the efficiency of the plating |
| 07/21/2005 | US20050155792 Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method |
| 07/21/2005 | US20050155791 Multilayer wiring board including stacked via structure |
| 07/21/2005 | US20050155790 Mounting board and electronic device using same |
| 07/21/2005 | US20050155789 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 07/21/2005 | US20050155788 Flexible circuit with cover layer |
| 07/21/2005 | US20050155706 Electronic component mounting method and apparatus |
| 07/21/2005 | US20050155501 Screen printer |
| 07/21/2005 | US20050155223 Methods of making microelectronic assemblies |
| 07/21/2005 | US20050155222 Circuit substrate manufacturing method |
| 07/21/2005 | DE19844730B4 Steckverbindung Connector |
| 07/21/2005 | DE19717611B4 Struktur zum Anbringen von elektronischen Komponenten Structure for mounting of electronic components |
| 07/21/2005 | DE10361094A1 Holder for fixing an electric component to a circuit board and having two parts which can be locked to each other |
| 07/21/2005 | DE10360128A1 Circuit board has flexible connecting contacts that facilitates the formation of soldered joints to electronic components |
| 07/21/2005 | DE10360127A1 Electronic circuit board has embedded contacts that are flexibility provided by surface cuts |
| 07/21/2005 | DE10359088A1 Electrical apparatus consists of at least two electronic components, at least one connection for the components, and a cover layer |
| 07/21/2005 | DE102004003880B3 Cladding panels for outer walls of buildings and other constructions comprise electronic circuit boards |
| 07/21/2005 | CA2638973A1 Biosensor and method of making |
| 07/21/2005 | CA2551836A1 Surface acoustic wave sensor assemblies |
| 07/20/2005 | EP1555863A1 Method of forming a mask pattern on a substrate |
| 07/20/2005 | EP1555862A2 Process for producing circuit board having built-in electronic part |
| 07/20/2005 | EP1555133A1 Equipment of a printing machine for coating a printed product |
| 07/20/2005 | EP1555121A1 Method for manufacturing a laminated board |
| 07/20/2005 | EP1554915A1 Land grid array fabrication using elastomer core and conducting metal shell or mesh |
| 07/20/2005 | EP1554688A2 Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
| 07/20/2005 | EP1097617B1 Interconnect assembly for printed circuit boards and method of fabrication |
| 07/20/2005 | EP0970480A4 Vertically interconnected electronic assemblies and compositions useful therefor |
| 07/20/2005 | CN2712047Y Foldable multi-layer flexible board |
| 07/20/2005 | CN2712046Y Multi-layer wire distribution board and based board material for same |
| 07/20/2005 | CN2711899Y Electronic package unit with passive component |
| 07/20/2005 | CN1644006A Holding/convey jig and holding/convey method |
| 07/20/2005 | CN1644000A Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board |
| 07/20/2005 | CN1643999A Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 07/20/2005 | CN1643863A Symbol-based signaling device for an elctromagnetically-coupled bus system |
| 07/20/2005 | CN1643743A Plug for connection strips and method for the production thereof |
| 07/20/2005 | CN1643737A Flexible good conductive layer and anisotropic conductive sheet comprising same |
| 07/20/2005 | CN1643656A Method for deviding substrate |
| 07/20/2005 | CN1643624A Self-leaded surface mount component holder |
| 07/20/2005 | CN1643186A Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 07/20/2005 | CN1643071A Resin composition |
| 07/20/2005 | CN1643070A Resin composition |
| 07/20/2005 | CN1643023A No flow underfill composition |
| 07/20/2005 | CN1643007A Polymerisable composition |
| 07/20/2005 | CN1642739A Device and method for positioning a substrate to be printed |
| 07/20/2005 | CN1642701A Punching machine |
| 07/20/2005 | CN1642690A Automatic machine tool |
| 07/20/2005 | CN1642407A Release process film |
| 07/20/2005 | CN1642406A Electronic device and intermediate product of electronic device |
| 07/20/2005 | CN1642405A 空气清洁装置 The air cleaning device |
| 07/20/2005 | CN1642394A Electronic device and method for producing the same |
| 07/20/2005 | CN1642393A Electronic devices and methods of forming electronic devices |
| 07/20/2005 | CN1642392A Methods of forming solder areas on electronic components and electronic components having solder areas |
| 07/20/2005 | CN1642391A Wire soldering method for circuit board package |
| 07/20/2005 | CN1642390A Positioning assembling device for contact pin tinning process and contact pin tinning method |
| 07/20/2005 | CN1642389A Method for temporary fixing flexible circuit board on working platform |
| 07/20/2005 | CN1642388A Method and device for conducting PCB ink plugging using scraper |
| 07/20/2005 | CN1642386A Method for replacing and resetting imperfect multi-piece printed circuit board |
| 07/20/2005 | CN1642385A Method for manufacturing stacked circuit board using adhesive |
| 07/20/2005 | CN1641910A Secondary battery |
| 07/20/2005 | CN1641874A 多芯片封装 Multi-chip package |
| 07/20/2005 | CN1641849A Method for manufacturing carrying-plate for packaging flat plastic-sealed ball grid array and its carrying plate |
| 07/20/2005 | CN1641842A Method for forming conductive bolt |
| 07/20/2005 | CN1641837A Method for manufacturing air bridge by composite glue electric-plating |
| 07/20/2005 | CN1641483A Method for forming metal pattern with low resistivity |
| 07/20/2005 | CN1641481A Light-sensitive transfer sheet, light-sensitive layers, method for forming image pattern and method for distribution pattern |
| 07/20/2005 | CN1641423A Flat-board display device and method and device for making same |
| 07/20/2005 | CN1641367A Printed circuit board maintenance and measurement memory device |
| 07/20/2005 | CN1641315A Printed circuit board blind hole quality analysing method |
| 07/20/2005 | CN1640609A Laser machining method and laser machining apparatus |
| 07/20/2005 | CN1640601A Method and apparatus for conductive ball bonding of components |
| 07/20/2005 | CN1212049C Circuit forming board and method of manufacturing circuit forming board |
| 07/20/2005 | CN1212048C Adhesion enhancement for metal foil |
| 07/20/2005 | CN1211921C Electronic device, semiconductor device comprising such device and method of mfg. such device |
| 07/20/2005 | CN1211895C Electric connector with stress release |
| 07/20/2005 | CN1211871C Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 07/20/2005 | CN1211848C Circuit device mfg. method |
| 07/20/2005 | CN1211835C Method for forming buffer pad, semiconductor device and making method |
| 07/20/2005 | CN1211767C Display module |
| 07/20/2005 | CN1211709C Photoreactive resin composition and circuit board and method for making multilayer ceramic base material |
| 07/20/2005 | CN1211664C Probe unit for inspection of base board for assemblying semiconductor chip |
| 07/20/2005 | CN1211450C Connection material |
| 07/20/2005 | CN1211197C Method for producing three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/20/2005 | CN1211183C Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method |
| 07/19/2005 | US6920052 Dynamic isolating mount for processor packages |
| 07/19/2005 | US6920046 Dissipating heat in an array of circuit components |
| 07/19/2005 | US6919772 Wiring board comprising granular magnetic film |
| 07/19/2005 | US6919646 Semiconductor device with contacting electrodes |
| 07/19/2005 | US6919642 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed |
| 07/19/2005 | US6919635 High density microvia substrate with high wireability |
| 07/19/2005 | US6919634 Solder ball assembly, a method for its manufacture, and a method of forming solder bumps |
| 07/19/2005 | US6919624 Semiconductor device with exposed electrodes |
| 07/19/2005 | US6919622 For improved signal transduction/reduced electrical noises; for packaging |
| 07/19/2005 | US6919529 Method of laser welding a flexible circuit board with a metal contact |
| 07/19/2005 | US6919515 Stress accommodation in electronic device interconnect technology for millimeter contact locations |
| 07/19/2005 | US6919514 Structure having laser ablated features and method of fabricating |
| 07/19/2005 | US6919513 For decreasing deformation/damage from contact with sprocket teeth during assembly |
| 07/19/2005 | US6919507 Comprises circuit situated in a housing, partially covered with a protective layer with varying hardnesses for optimized mechanical/thermal loading capacity |
| 07/19/2005 | US6919227 Semiconductor part of component mounting, mounting structure and mounting method |
| 07/19/2005 | US6919226 Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure |
| 07/19/2005 | US6919221 Electronic module having a plastic housing with conductive tracks and method of its production |