Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2005
06/30/2005US20050139382 Printed circuit board for preventing increase of thermal expansion
06/30/2005US20050139371 Wiring circuit board
06/30/2005US20050139315 Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head
06/30/2005US20050139118 Brightener degradation inhibitor compound in copper plating bath
06/30/2005US20050139055 Wired circuit board holding sheet and production method thereof
06/30/2005US20050138802 Component alignment apparatus and methods
06/30/2005US20050138799 Method of manufacturing a metal-ceramic circuit board
06/30/2005US20050138794 Suspension assembly method and the manufacture process
06/30/2005DE29924723U1 Method of detecting and preventing regions critical for etching, e.g. for screen printing plate manufacture - involves accessing data structures of layout and configuration elements in plane of layout, detecting critical regions between configuration elements, altering, displaying regions
06/30/2005DE19503178B4 Verfahren und Vorrichtung zur Herstellung einer lötbaren Metallisierungsschicht auf einer nichtlötbaren Oberfläche Method and apparatus for producing a solderable metallization layer on a surface nichtlötbaren
06/30/2005DE10392524T5 Spannungsvariables Material zur direkten Anwendung und Vorrichtung zu dessen Anwendung Voltage variable material for direct application and device for its application
06/30/2005DE10355990A1 Differential etching technique for plate shaped components e.g. electronic circuit board, comprises using an etching unit with a horizontal or vertical transport system
06/30/2005DE10355921A1 Elektrische Schaltungsanordnung Electrical circuitry
06/30/2005DE10354694A1 Inductive sensor with conductive path(s) on circuit board, forming at least part of coil to which is allocated coil core, with circuit board of multilayer type, with outer layer carrying contacted conductive path sections
06/30/2005DE10353994A1 Radio frequency identification chip for e.g. identification of packed goods, has electrical contacting introduced between antenna and electronic circuit unit by electrophotographic printing process, and toner for application on antenna
06/30/2005DE10353677A1 Außenstromlose Kontaktierung Electroless contact
06/30/2005DE10353676A1 Raue Kontakte Rough Contacts
06/30/2005DE10350699B3 Verfahren und Vorrichtung zum Aufschmelzlöten mit Volumenstromsteuerung Method and apparatus for reflow soldering with volume flow control
06/30/2005DE102004025827B3 Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge
06/30/2005DE10133250B4 Verfahren zur Herstellung eines elektrischen oder elektronischen Kabelbaumes in Form eines flexiblen Laminates A process for producing an electric or electronic cable harness in the form of a flexible laminate
06/29/2005EP1549121A2 Inductor element containing circuit board and power amplifier module
06/29/2005EP1549120A2 Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same
06/29/2005EP1549119A2 Electronic circuit unit and method of fabricating the same
06/29/2005EP1549118A2 Printed circuit board with low cross-talk noise
06/29/2005EP1548828A2 Semiconductor device and electronic equipment using the same
06/29/2005EP1548826A1 Chip pad layout
06/29/2005EP1548824A2 System and method for improving solder joint reliability in an integrated circuit package
06/29/2005EP1548450A2 Probe card and method of testing wafer having a plurality of semiconductor devices
06/29/2005EP1547780A1 Method and device for positioning electronic components
06/29/2005EP1547453A1 Device and method for reshaping the interconnection elements of an electronic module using the stress reflow method and, in particular, for restoring the flatness thereof
06/29/2005EP1547158A1 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
06/29/2005EP1547142A1 Selective connection in ic packaging
06/29/2005EP1547126A2 System and method for manufacturing embedded conformal electronics
06/29/2005EP1546275A1 Method of adhesion of conductive materials, laminate, and adhesive composition
06/29/2005EP1545891A1 Screen printing method
06/29/2005EP1545872A1 Method of producing laminates, and laminates
06/29/2005EP1545826A2 Solder hierarchy for lead free solder joint
06/29/2005EP1419681B1 Horizontal component retention socket
06/29/2005EP1317801B1 Thick film millimeter wave transceiver module
06/29/2005EP1060647A4 Method of making microwave, multifunction modules using fluoropolymer composite substrates
06/29/2005CN2706994Y Pin pulling device structure of drill for PCB
06/29/2005CN2706444Y Conveying wheel for transferring flexible circuit board
06/29/2005CN1633790A 电磁总线耦合 Electromagnetic coupling bus
06/29/2005CN1633525A Conveyorized horizontal processing line and method of wet-processing a workpiece
06/29/2005CN1633521A Precious metal recovery
06/29/2005CN1633513A Lead-free tin-silver-copper alloy solder composition
06/29/2005CN1633346A Method of laser welding
06/29/2005CN1633228A An electromagnetic interference suppressive ground wiring method
06/29/2005CN1632934A Multi-diameter solder ball automatic releasing device
06/29/2005CN1632033A Wiring-connecting material and wiring-connected board production process using the same
06/29/2005CN1631665A Laminar composition and method for preparing the same
06/29/2005CN1209002C Aligning apparatus for image sensor
06/29/2005CN1208998C Printed circuit board and its production process
06/29/2005CN1208835C Plane mounted electronic circuit unit
06/29/2005CN1208830C Semiconductor chip and wiring base plate and manufacturing method, semiconductor chip, semiconductor device
06/29/2005CN1208792C Electronic element and making method thereof
06/29/2005CN1208782C Aqueous carbon composition and method for coating a non-conductive substrate
06/29/2005CN1208626C Electrical test of interconnection of conductors on substrate
06/28/2005US6912134 Fan control circuit and package
06/28/2005US6911941 Forming patterns of apertures in multilayers of ceramic tapes, then adjusting the apertures, laminating and firing to form radio frequency circuits having adjustable electrical properties
06/28/2005US6911738 Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies
06/28/2005US6911735 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
06/28/2005US6911734 Semiconductor device and electronic device
06/28/2005US6911733 Semiconductor device and electronic device
06/28/2005US6911729 Tape carrier semiconductor device
06/28/2005US6911728 Member for electronic circuit, method for manufacturing the member, and electronic part
06/28/2005US6911726 Heat resistance substrates comprising pads and dies, pins coupled to the pads with electroconductive connectors and layers of curable coverings
06/28/2005US6911725 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device
06/28/2005US6911623 Carbon dioxide gas laser machining method of multilayer material
06/28/2005US6911620 System and method for unveiling targets embedded in a multi-layered electrical circuit
06/28/2005US6911606 Electronic component for adhesion of a plurality of electrodes and method of mounting the same
06/28/2005US6911605 Flexible printed circuit
06/28/2005US6911604 Bonding pads of printed circuit board capable of holding solder balls securely
06/28/2005US6911388 Individual selective rework of defective BGA solder balls
06/28/2005US6911292 Novolak resin with 3-27 mol % of the hydroxyl group hydrogens are substituted with 1,2-naphthoquinonediazidosulfonyl ester groups, a methyl vinyl ether-monoalkyl maleate copolymer and optionally, an alkali-soluble cellulose
06/28/2005US6911269 Lead-free chemical nickel alloy
06/28/2005US6911265 Laminate
06/28/2005US6911249 Surface for use on implantable device
06/28/2005US6911230 Improving the adhesion of gold deposited layer on nickel metal substrate or layer, by electroless depositing a pre-seeding layer of palladium in small amount
06/28/2005US6911156 Methods for fabricating MRAM device structures
06/28/2005US6911107 Piezoelectric film type actuator, liquid discharge head, and method of manufacturing the same
06/28/2005US6911101 ACF tape feeder machine, and method for feeding ACF tape
06/28/2005US6911068 Plating bath and method for depositing a metal layer on a substrate
06/28/2005US6910897 Interconnection system
06/28/2005US6910637 Stacked small memory card
06/28/2005US6910636 IC card and manufacturing method thereof
06/28/2005US6910615 Solder reflow type electrical apparatus packaging having integrated circuit and discrete components
06/28/2005US6910613 Device and method for forming bump
06/28/2005US6910266 Printed circuit board with embedded capacitors therein, and process for manufacturing the same
06/28/2005US6910264 Method for making a multilayer circuit board having embedded passive components
06/23/2005WO2005057997A1 Method of manufacturing circuit board
06/23/2005WO2005057735A1 Small array contact with precision working range
06/23/2005WO2005057652A2 Connector for making electrical contact at semiconductor scales and method for forming same
06/23/2005WO2005056881A1 Method of manufacturing thin foils on a carrier web and the product manufactured with this method
06/23/2005WO2005056875A2 Formation of solid layers on substrates
06/23/2005WO2005056871A1 Method of preparing a metal-silicone rubber composite
06/23/2005WO2005056868A1 Method of metallizing a silicone rubber substrate
06/23/2005WO2005056734A2 Electronic component
06/23/2005WO2005056274A2 Method and apparatus for producing a detail
06/23/2005WO2005056202A2 Apparatus and method for cleaning surfaces