| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/27/2005 | CN1645590A Fabrication method of semiconductor integrated circuit device |
| 07/27/2005 | CN1645582A Method of forming a semiconductor package and leadframe therefor |
| 07/27/2005 | CN1645579A Method of manufacturing hybrid integrated circuit device |
| 07/27/2005 | CN1645560A A suspension for filling via holes in silicon and method for making the same |
| 07/27/2005 | CN1644297A Multiple beam micro-machining system and method |
| 07/27/2005 | CN1212755C Patterning process of circuit base board |
| 07/27/2005 | CN1212754C Circuit board and its manufacturing method |
| 07/27/2005 | CN1212753C Method for forming high density super fine circuit fibrous substrate |
| 07/27/2005 | CN1212657C Adhesive for electronic element device |
| 07/27/2005 | CN1212545C Photosensitive insulated glue composition and photosensitive film of the glue |
| 07/27/2005 | CN1212431C Method for enhancing the solderability of a surface |
| 07/26/2005 | US6922344 Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device |
| 07/26/2005 | US6922339 Heat dissipating structure of printed circuit board and fabricating method thereof |
| 07/26/2005 | US6922225 Display device substrate, method for manufacturing the display device substrate, liquid-crystal device, and electronic equipment |
| 07/26/2005 | US6922020 Electroluminescent lamp module and processing method |
| 07/26/2005 | US6921977 Semiconductor package, method of production of same, and semiconductor device |
| 07/26/2005 | US6921973 Electronic module having compliant spacer |
| 07/26/2005 | US6921922 Optical communication module |
| 07/26/2005 | US6921869 Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof |
| 07/26/2005 | US6921860 Packages for electrical and electronic apparatus such as flip chips comprising a layout of spaced dams associated with and enclosing terminals, and dielectric coverings; miniaturization |
| 07/26/2005 | US6921626 Processing inorganic nanoparticles and a carrier to form an electroconductive pattern area that adheres to the surface of a substrate |
| 07/26/2005 | US6921550 Etch resist using printer technology |
| 07/26/2005 | US6921505 Hole filling using an etched hole-fill stand-off |
| 07/26/2005 | US6921451 Wear resistance; reducing deposit residues; masking, pretreatment with release agents, lamination; removal by stripping |
| 07/26/2005 | US6921015 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
| 07/26/2005 | US6920815 Integrated circuit package separators |
| 07/26/2005 | CA2288817C Lead free solder alloy |
| 07/26/2005 | CA2233329C Method for electrolytic deposition of metal coatings |
| 07/26/2005 | CA2162882C Electrically conductive adhesive compositions |
| 07/21/2005 | WO2005067362A1 Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter |
| 07/21/2005 | WO2005067359A1 Ceramic multilayer substrate |
| 07/21/2005 | WO2005067358A1 Method and apparatus for soldering modules to substrates |
| 07/21/2005 | WO2005067357A1 Transmission line with a transforming impedance and solder lands |
| 07/21/2005 | WO2005067356A1 Printed circuits on shrink film |
| 07/21/2005 | WO2005067355A2 Patterned circuits and method for making same |
| 07/21/2005 | WO2005067354A1 Printed wiring board, method for manufacturing same, and circuit device |
| 07/21/2005 | WO2005067102A1 Electrical connector |
| 07/21/2005 | WO2005067092A1 Triangular conforming transmission structure |
| 07/21/2005 | WO2005067042A1 Method for electrically connecting an electrical conductor to an electronic component, and device |
| 07/21/2005 | WO2005066992A1 Connecting structure and connecting method of circuit |
| 07/21/2005 | WO2005066955A1 Base material for hdd suspension |
| 07/21/2005 | WO2005066621A1 Surface acoustic wave sensor assemblies |
| 07/21/2005 | WO2005066616A2 Biosensor and method of making |
| 07/21/2005 | WO2005066392A2 Surface structuring by means of a film |
| 07/21/2005 | WO2005066298A1 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| 07/21/2005 | WO2005066252A2 Inorganic powder, resin composition filled with the powder and use thereof |
| 07/21/2005 | WO2005066246A1 Mold release film |
| 07/21/2005 | WO2005065936A1 Hot pressing ceramic distortion control |
| 07/21/2005 | WO2005065868A1 Method for producing metal powder |
| 07/21/2005 | WO2005065274A2 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit |
| 07/21/2005 | WO2005065238A2 Micro pin grid array with pin motion isolation |
| 07/21/2005 | WO2005038986A3 Electrical circuit apparatus and methods for assembling same |
| 07/21/2005 | WO2005023523A3 Method and device for the production of a three-dimensional multi-material component by means of ink-jet-type printing |
| 07/21/2005 | WO2005011341A3 Electronic module with dual connectvity |
| 07/21/2005 | WO2005007919A3 Coating metal particles |
| 07/21/2005 | WO2004093504A3 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 07/21/2005 | WO2004093252B1 Electrical connector and method for making |
| 07/21/2005 | WO2003073357A8 Methods and apparatus for fabricating chip-on-board modules |
| 07/21/2005 | US20050159509 Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish |
| 07/21/2005 | US20050159032 Cover for ball-grid array connector |
| 07/21/2005 | US20050159024 Relay arrangement structure |
| 07/21/2005 | US20050159002 Sputtered spring films with low stress anisotropy |
| 07/21/2005 | US20050158989 Method of forming wiring and method of manufacturing image display system by using the same |
| 07/21/2005 | US20050158916 Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein |
| 07/21/2005 | US20050158911 Process for producing circuit board having built-in electronic part |
| 07/21/2005 | US20050158668 Method of forming a mask pattern on a substrate |
| 07/21/2005 | US20050158661 Resins curable with actinic energy ray, process for the production thereof, and photocurable and thermosetting resin composition |
| 07/21/2005 | US20050158574 A printed circuit board having high-density wiring of ultra-fine width and line/spacing of <15 mu m or less where a carrier foil, a peeling layer, an ultra-thin copper foil are electroplated in this order, use of electrolytic copper foil having a specific roughness profile specific; antipeeling agents |
| 07/21/2005 | US20050158556 Nanoporous laminates |
| 07/21/2005 | US20050158553 Printed wiring board and manufacturing method of printed wiring board |
| 07/21/2005 | US20050158528 Wiring substrate |
| 07/21/2005 | US20050158527 Epoxy resins containing fine metal particle selected from platinum (Pt), palladium (Pd), copper (Cu), gold (Au), nickel (Ni), and silver (Ag).; rate of moisture absorption from 500 to 14500 ppm; electrostatic latent image is formed, by electrostatically attaching metal-containing resin particles |
| 07/21/2005 | US20050158502 Release process film |
| 07/21/2005 | US20050158456 Method and apparatus for making devices |
| 07/21/2005 | US20050158455 Method of producing multilayer interconnection board |
| 07/21/2005 | US20050158009 Structure and method for temporarily holding integrated circuit chips in accurate alignment |
| 07/21/2005 | US20050157478 Printed circuit board and method for manufacturing printed circuit board |
| 07/21/2005 | US20050157477 Electronic device and production method thereof |
| 07/21/2005 | US20050157476 Populated printed wiring board and method of manufacture |
| 07/21/2005 | US20050157475 Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| 07/21/2005 | US20050157286 Method and system for detecting sensitivity of photosensitive materials and exposure correcting method |
| 07/21/2005 | US20050157241 Structure of liquid crystal display device for easy assembly and disassembly |
| 07/21/2005 | US20050157084 Printhead nozzle arrangement with a micro-electromechanical shape memory alloy based actuator |
| 07/21/2005 | US20050156705 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 07/21/2005 | US20050156692 Double density quasi-coax transmission lines |
| 07/21/2005 | US20050156690 Electromagnetically shielded slot transmission line |
| 07/21/2005 | US20050156331 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same |
| 07/21/2005 | US20050156327 Colored conductive wires for a semiconductor package |
| 07/21/2005 | US20050156326 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device |
| 07/21/2005 | US20050156319 Structure of stacked vias in multiple layer electronic device carriers |
| 07/21/2005 | US20050156314 Support ring for use with a contact pad and semiconductor device components including the same |
| 07/21/2005 | US20050156306 Circuit board device for information apparatus, multilayered module board and navigation system |
| 07/21/2005 | US20050156295 Routing element for use in semiconductor device assemblies |
| 07/21/2005 | US20050156293 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods |
| 07/21/2005 | US20050156165 Test assembly including a test die for testing a semiconductor product die |
| 07/21/2005 | US20050156015 Method and apparatus to create electrical junctions for information routing in textile structures |
| 07/21/2005 | US20050156012 Method of soldering electrical connection |
| 07/21/2005 | US20050155958 Laser machining method and laser machining apparatus |
| 07/21/2005 | US20050155957 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/21/2005 | US20050155948 Method and apparatus for surface processing of printed wiring board |