Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2005
08/11/2005DE102004045719A1 Gedruckte-Schaltungsplatine-Testzugangspunktstrukturen und Verfahren zum Herstellen derselben Printed circuit board test access point structures and method of making same
08/11/2005DE102004003891A1 Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung Oriented, can be structured by means of electromagnetic radiation sheet of thermoplastic polyester, processes for their preparation and their use
08/11/2005DE102004003890A1 Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung By means of electromagnetic radiation single- or multilayer, oriented film of thermoplastic structurable polymer, processes for their preparation and their use
08/11/2005DE102004002132A1 Einrichtung zur Erzeugung einer Beschichtung von Druckprodukten einer Druckmaschine Means for generating a coating of printed products of a printing press
08/11/2005DE102004002075A1 Presse zum Herstellen von Laminaten Press for producing laminates
08/11/2005DE102004001661A1 Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und Vorrichtung A method for electrically connecting an electrical conductor to an electronic component device and
08/11/2005CA2554750A1 Partially etched dielectric film with conductive features
08/11/2005CA2552397A1 Improved populated printed wiring board and method of manufacture
08/10/2005EP1562413A2 Treated copper foil and circuit board
08/10/2005EP1562412A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
08/10/2005EP1562411A1 Metal/ceramic bonding member and method for producing same
08/10/2005EP1562410A2 Ink jet printable thick film ink compositions and processes
08/10/2005EP1562409A2 Hydrophilic treatment and wiring pattern formation including It
08/10/2005EP1561789A1 Ink jet printable thick film ink compositions and processes
08/10/2005EP1561775A2 With electrogmagnetic radiation obtained mono- and multilayered, oriented structurable thermoplastic film, method for its manufacture and its use
08/10/2005EP1561368A1 Multi-layer circuit assembly and process for preparing the same
08/10/2005EP1561237A2 Method and apparatus for reducing electromagnetic emissions from electronic circuits
08/10/2005EP1561099A1 Method of manufacture of electrochemical sensors
08/10/2005EP1560664A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same
08/10/2005EP1366511B1 Metal pattern formation
08/10/2005EP1358291B1 Method for adhering substrates using light activatable adhesive film
08/10/2005EP1228401B1 Step and flash imprint lithography
08/10/2005EP0839322B1 Microelectronic contact structure and method of making same
08/10/2005CN2717171Y Positioning construction for piezo-electric sheets
08/10/2005CN2717170Y Printed circuit board with bonded IC
08/10/2005CN2715991Y Ink-ejecting head
08/10/2005CN2715987Y Wiring board carving machine
08/10/2005CN1653878A Electromagnetically shielded circuit device and shielding method therefor
08/10/2005CN1653874A Multi-layer integrated circuit package
08/10/2005CN1653873A Method for forming multilayer circuit structure and base having multilayer circuit structure
08/10/2005CN1653871A 印刷布线板 A printed circuit board
08/10/2005CN1653595A Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter
08/10/2005CN1653556A Conductive particle and adhesive agent
08/10/2005CN1653016A Method for producing a ceramic-copper composite substrate
08/10/2005CN1652667A Hydrophilic treatment method and wiring pattern forming method
08/10/2005CN1652666A Method for mfg wired substrate and method for mfg electronic apparatus
08/10/2005CN1652665A Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials
08/10/2005CN1652664A Substrate duster
08/10/2005CN1652663A Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/10/2005CN1652662A Multilayer printed wiring board and method of producing multilayer printed wiring board
08/10/2005CN1652405A Connecting structure, liquid crystal device, electronic equipment, and anisotropic conductive adhesive agent and a manufacturing method thereof
08/10/2005CN1652395A Microstrip line
08/10/2005CN1652333A High frequency circuit module
08/10/2005CN1652317A Sn ball flatening method
08/10/2005CN1652316A Method for mfg multi-layer package
08/10/2005CN1651991A System and method of manufacturing liquid crystal display
08/10/2005CN1651169A Silver powder and method for producing same
08/10/2005CN1214699C Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same
08/10/2005CN1214492C System comprising at least two printed circuit boards
08/10/2005CN1214459C Electrode structure on carrier bottom of semiconductor device
08/10/2005CN1214458C RF module member including surface elastic wave element and its manufacture method
08/10/2005CN1214455C Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
08/10/2005CN1214346C Contactless chip card, contactless chip body and making method thereof
08/10/2005CN1214286C Method of forming optical images, mask for use in this method, method of manufacturing device using this method, and apparatus for carrying out this method
08/10/2005CN1214271C Liquid crystal display device land mfg. method thereof
08/10/2005CN1214250C Apparatus and method for testing non-componented printed circuit boards
08/10/2005CN1214134C Conditioning composition for improving adhesion and covering rate of conductive coating on surface with through hole and method for making welding surface non-air hole
08/09/2005US6928627 Method for recognizing and avoiding etch-critical regions
08/09/2005US6927982 Method of connecting a device to a support, and pad for establishing a connection between a device and a support
08/09/2005US6927663 Flyback transformer wire attach method to printed circuit board
08/09/2005US6927655 Optical transmission module
08/09/2005US6927589 Apparatus for testing bumped die
08/09/2005US6927492 Solder pads and method of making a solder pad
08/09/2005US6927491 Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
08/09/2005US6927490 Buried solder bumps for AC-coupled microelectronic interconnects
08/09/2005US6927487 Protective device with spacer for subassemblies
08/09/2005US6927486 Photo-interrupter and semiconductor device using the same
08/09/2005US6927485 Substrate for semiconductor package
08/09/2005US6927471 Electronic system modules and method of fabrication
08/09/2005US6927424 Light emitting diode and method for producing it
08/09/2005US6927347 Printed circuit board having through-hole protected by barrier and method of manufacturing the same
08/09/2005US6927346 Surface mount technology to via-in-pad interconnections
08/09/2005US6927344 Flexible circuit board assembly
08/09/2005US6927339 Cover for electronic components and method of using same during component assembly
08/09/2005US6927274 Resin compositions, processes for preparing the resin compositions and processes for forming resin films
08/09/2005US6927272 Electronic component-use material and electronic component using it
08/09/2005US6927097 Package with pre-applied underfill and associated methods
08/09/2005US6927008 Supports having thermoplastic resins and ligtht sensitive recording multilayers, used for forming images, production of color filters used in liquid crystal displays and/or production of printed circuits
08/09/2005US6926922 PWB manufacture
08/09/2005US6926860 Method and apparatus for manufacturing minute metallic sphere
08/09/2005US6926840 Flexible frame for mounting a deposition mask
08/09/2005US6926816 computer simulation in the pattern plating
08/09/2005US6926813 Electrical contacting element made of an elastic material
08/09/2005US6926796 Electronic parts mounting method and device therefor
08/09/2005US6926789 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
08/09/2005US6926751 Overcoating metal particles with high electroconductive paste; high density integrated circuits
08/09/2005US6926191 Polymer for exterior contactors; bonding semiconductor contact pads
08/09/2005US6926188 Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip
08/09/2005US6926187 Ultrasonic manufacturing apparatus
08/09/2005US6926057 Thin film forming apparatus and thin film forming method
08/09/2005US6925710 Method for manufacturing microelectromechanical combdrive device
08/09/2005US6925709 Method and apparatus for assembling electronics
08/09/2005US6925708 Method of shielding a printed circuit electronics card mounted on a metal substrate
08/04/2005WO2005072037A1 Method for producing circuit-forming board and material for producing circuit-forming board
08/04/2005WO2005072036A1 Molded abrasive brush and methods of using for manufacture of printed circuit boards
08/04/2005WO2005072035A1 Method for the production of a circuit board element and circuit board element
08/04/2005WO2005072034A1 Screen printer
08/04/2005WO2005072033A1 Circuit board and method for mounting chip component
08/04/2005WO2005072032A1 Circuit board, mounting structure of circuit board, and mounting method for circuit board
08/04/2005WO2005072031A2 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
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