| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/16/2005 | US6929978 Method of fabricating an integrated circuit package utilizing a conductive structure for improving the bond strength between an IC package and a printed circuit board |
| 08/16/2005 | US6929976 Multi-die module and method thereof |
| 08/16/2005 | US6929975 Method for the production of an electronic component |
| 08/16/2005 | US6929973 Method of packaging electronic components with high reliability |
| 08/16/2005 | US6929971 Semiconductor device and its manufacturing method |
| 08/16/2005 | US6929967 Method of forming pattern |
| 08/16/2005 | US6929849 Embedded electrical traces |
| 08/16/2005 | US6929437 Spindle with axially acting collet-opening device |
| 08/16/2005 | US6929170 Solder deposition method |
| 08/16/2005 | US6929169 Solder joint structure and method for soldering electronic components |
| 08/16/2005 | US6928727 Apparatus and method for making electrical connectors |
| 08/16/2005 | US6928726 Circuit board with embedded components and method of manufacture |
| 08/11/2005 | WO2005074344A1 Device for the vibration-proof mounting of electric special components and/or electric circuits |
| 08/11/2005 | WO2005074340A1 Multilayer printed wiring board and method for manufacturing same |
| 08/11/2005 | WO2005074339A1 Partially etched dielectric film with conductive features |
| 08/11/2005 | WO2005074338A1 Circuit substrate |
| 08/11/2005 | WO2005074337A1 Electronic component on a supporting element |
| 08/11/2005 | WO2005074336A2 Multilayered circuit board for high-speed, differential signals |
| 08/11/2005 | WO2005074026A2 Tin-based coating of electronic component |
| 08/11/2005 | WO2005073985A1 Conductive particle and anisotropic conductive material |
| 08/11/2005 | WO2005073764A1 Methods for imaging regular patterns |
| 08/11/2005 | WO2005073435A1 Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| 08/11/2005 | WO2005073264A1 Curable resin composition |
| 08/11/2005 | WO2005072906A1 Soldering flux and soldering method |
| 08/11/2005 | WO2005072111A2 Improved populated printed wiring board and method of manufacture |
| 08/11/2005 | WO2005065000B1 Electromagnetically shielded slot transmission line |
| 08/11/2005 | WO2005043758A3 Method and device for reflow soldering with volume flow control |
| 08/11/2005 | WO2004114374A3 Method of using pre-applied underfill encapsulant |
| 08/11/2005 | WO2004095897A3 Electrical contact |
| 08/11/2005 | WO2004065843A3 Seat buckle sensor |
| 08/11/2005 | WO2004039897A8 Process for making an electrochemical sensor |
| 08/11/2005 | WO2004034434A3 Components, methods and assemblies for multi-chip packages |
| 08/11/2005 | US20050177319 Optical communications module |
| 08/11/2005 | US20050176909 Curable polyvinyl benzyl compound and process for producing the same |
| 08/11/2005 | US20050176882 wires connected using a mixture of curing agents capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, having high bonding strength and connection reliability |
| 08/11/2005 | US20050176849 Ink jet printable thick film compositions and processes |
| 08/11/2005 | US20050176602 Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k di-electrics and copper or aluminum metallizations contain a polar organic solvent selected from amides, sulfones, sulfolenes, selenones and saturated alcohols and a strong alkaline base. |
| 08/11/2005 | US20050176380 Radio frequency circuit module |
| 08/11/2005 | US20050176328 Backup board for machining process |
| 08/11/2005 | US20050176310 Connection structure of rigid printed circuit board and flexible circuit, the connection process and the circuit module using it |
| 08/11/2005 | US20050176272 Interconnect structure and method for connecting buried signal lines to electrical devices |
| 08/11/2005 | US20050176271 Electrical connection and component assembly for constitution of a hard disk drive |
| 08/11/2005 | US20050176270 Methods and structures for the production of electrically treated items and electrical connections |
| 08/11/2005 | US20050176268 Grouped element transmission channel link with pedestal aspects |
| 08/11/2005 | US20050176267 Press-fit terminal |
| 08/11/2005 | US20050176255 Electronic package repair process |
| 08/11/2005 | US20050176246 Ink jet printable thick film ink compositions and processes |
| 08/11/2005 | US20050176242 Patterning method |
| 08/11/2005 | US20050176209 Embedded passive components |
| 08/11/2005 | US20050176177 Digital application of protective soldermask to printed circuit boards |
| 08/11/2005 | US20050176176 Ball transferring method and apparatus |
| 08/11/2005 | US20050176175 Method of manufacturing hybrid integrated circuit device |
| 08/11/2005 | US20050176173 Chip-on-board module, and method of manufacturing the same |
| 08/11/2005 | US20050176161 Circuit board integrated optical coupling elements |
| 08/11/2005 | US20050175925 Photocurable compositions containing reactive particles |
| 08/11/2005 | US20050175909 Methods for imaging regular patterns |
| 08/11/2005 | US20050175849 Molded article, injection molding method and apparatus |
| 08/11/2005 | US20050175846 Electron beam evaporation deposition of glass; hermetic sealing; simple; accurately structured on substrates having varied dimensions |
| 08/11/2005 | US20050175826 Treated copper foil and circuit board |
| 08/11/2005 | US20050175824 Forming curable containing insulating polymer and curing agent; curing to dielectric layer; hydrophilicating surface; forming a metal thin film layer of an ethylenediaminetetraacetate-copper complex |
| 08/11/2005 | US20050175780 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 08/11/2005 | US20050175773 Metal/ceramic bonding member and method for producing same |
| 08/11/2005 | US20050175385 Method of producing printed circuit board with embedded resistor |
| 08/11/2005 | US20050175352 Optical module having small stray capacitance and stray inductance |
| 08/11/2005 | US20050175312 Optical transmitter |
| 08/11/2005 | US20050175297 Optical sub-assembly for opto-electronic modules |
| 08/11/2005 | US20050174781 Led burning prevention |
| 08/11/2005 | US20050174745 Electronic assembly |
| 08/11/2005 | US20050174722 Flexible printed circuit board and process for producing the same |
| 08/11/2005 | US20050174526 System and method of manufacturing liquid crystal display |
| 08/11/2005 | US20050174407 Depositing solid materials |
| 08/11/2005 | US20050174209 Wiring structure, and fabrication method of the same |
| 08/11/2005 | US20050174191 Transmission line having a transforming impedance |
| 08/11/2005 | US20050174134 Method and apparatus for testing bumped die |
| 08/11/2005 | US20050173805 Micro pin grid array with pin motion isolation |
| 08/11/2005 | US20050173795 Socket grid array |
| 08/11/2005 | US20050173785 Anisotropic conductive film and bump, and packaging structure of semiconductor having the same |
| 08/11/2005 | US20050173783 Semiconductor package with passive device integration |
| 08/11/2005 | US20050173780 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 08/11/2005 | US20050173680 electronic circuits comprising dielectrics and polyvinylpyrrolidone dispersed in organic solvents, water and/or mixtures |
| 08/11/2005 | US20050173678 rust prevention film-forming aqueous solutions comprising organic acids and imidazole or benzimidazole based compounds; oxidation resistance |
| 08/11/2005 | US20050173499 Temperature-controlled rework system |
| 08/11/2005 | US20050173394 Control unit with thermal protection and an electrical heating device comprising the control unit |
| 08/11/2005 | US20050173372 Method of fabricating inkjet nozzle chambers |
| 08/11/2005 | US20050173252 electroplating the copper ions from the plating solution directly onto the barrier layer of a microelectronic workpiece; microstructure vias can be filled, forming a uniform layer; annealing at low temperatures |
| 08/11/2005 | US20050173251 Hydrophilic treatment method and wiring pattern forming method |
| 08/11/2005 | US20050173250 Preventing voids during metal electrodeposition on integrated circuits; simultaneously regulating voltage between anode and cathode to reference electrode |
| 08/11/2005 | US20050173152 Circuit board surface mount package |
| 08/11/2005 | US20050173151 Substrate with via and pad structures |
| 08/11/2005 | US20050173150 Multi-layer printed board |
| 08/11/2005 | US20050173063 Laminating method and laminating apparatus using the same |
| 08/11/2005 | US20050172950 Low cost heated clothing manufactured from conductive loaded resin-based materials |
| 08/11/2005 | US20050172778 Linear via punch |
| 08/11/2005 | US20050172483 Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same |
| 08/11/2005 | DE4117004B4 Verfahren zur Herstellung einer Schaltungsplatte A process for producing a circuit board |
| 08/11/2005 | DE202005008936U1 Screen e.g. for technical screen print, has rigid framework under tension fastened to strip and made from electrically non conductive material with fine mesh made from electrically conducting material |
| 08/11/2005 | DE112004000007T5 Mehrschicht-Leiterplatte mit Metallkern Multi-layer printed circuit board with a metal core |
| 08/11/2005 | DE10215963B4 Vorrichtung für selektives Löten Apparatus for selective soldering |
| 08/11/2005 | DE102004053595A1 Doppeltdichte quasi-koaxiale Übertragungsleitungen Double density quasi-coaxial transmission lines |
| 08/11/2005 | DE102004049660A1 Printed-board assembly for making up a T5/T8/T12 power-saving lamp has a magnetic choke device with a T5 fluorescent long-field lamp |