| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/18/2005 | US20050181597 Method of forming wiring |
| 08/18/2005 | US20050181543 Semiconductor package module and manufacturing method thereof |
| 08/18/2005 | US20050181541 Method of producing a COF flexible printed wiring board |
| 08/18/2005 | US20050181223 Adhesive layer being obtained by imidization of a polyamic acid mixture, a reaction product of 3,4,3',4'-biphenyltetracarboxylic anhydride with p-phenylenediamine, reaction product of 3,4,3',4'-biphenyltetracarboxylic anhydride with 4,4'-diaminodiphenyl ether; heat/curling resistance, high peel strength |
| 08/18/2005 | US20050181215 Epoxy resin, setting agents containing a novolak-type phenol resin and a benzooxazine compound, and a siloxane-modified polyamide-imide resin; low dielectric constant; excellent peel strength |
| 08/18/2005 | US20050181191 Protective ceramic metal hydride coatings on copper circuits for soldering without fluxing; bond wires to copper circuits; electronic package; metal hydride layer was formed by reducing with hydrogen |
| 08/18/2005 | US20050180832 Spindle with axially acting collet-opening device |
| 08/18/2005 | US20050180609 Method of producing a digital fingerprint sensor and the corresponding sensor |
| 08/18/2005 | US20050180120 Compact navigation device assembly |
| 08/18/2005 | US20050180116 Heatsink |
| 08/18/2005 | US20050180111 Low thermal stress composite heat sink assembly |
| 08/18/2005 | US20050179851 Display device and manufacturing method therefor |
| 08/18/2005 | US20050179729 Method of making an inkjet printhead |
| 08/18/2005 | US20050179456 High density cantilevered probe for electronic devices |
| 08/18/2005 | US20050179171 Method and apparatus for processing electronic parts |
| 08/18/2005 | US20050179129 High-frequency wiring structure and method for producing the same |
| 08/18/2005 | US20050179121 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless |
| 08/18/2005 | US20050178669 Method of electroplating aluminum |
| 08/18/2005 | US20050178585 Printed circuit board having axially parallel via holes |
| 08/18/2005 | US20050178574 Electronic part mounting substrate, electronic part, and semiconductor device |
| 08/18/2005 | US20050178569 Electromagnetic-shielding transparent window member and method for producing the same |
| 08/18/2005 | US20050178502 Adhesive, method of connecting wiring terminals and wiring structure |
| 08/18/2005 | US20050178501 Process for producing a multi-layer printer wiring board |
| 08/18/2005 | US20050178496 Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials |
| 08/18/2005 | US20050178002 Surface mounting structure for surface mounting an electronic component |
| 08/18/2005 | DE202005007549U1 Printing template, especially for use in production of circuit support on ceramic or printed circuit boards and/o for component mounting in circuit boards |
| 08/18/2005 | DE10228400B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards |
| 08/18/2005 | DE102005005524A1 Ohm resistance structure for thick-film technology/cermetology has strip conductors set apart and linked electrically to an active resistance surface adjusted by movement in the surface/conductors |
| 08/18/2005 | DE102004027774A1 Soldered connection forming method, e.g. between circuit substrates, involves holding together two electrically conducting contact regions, and applying energy locally to melt solder ball which flows through opening in upper substrate |
| 08/18/2005 | DE102004005255A1 Verfahren zum Anordnen einer Leitungsstruktur auf einem Substrat und Substrat mit der Leitungsstruktur A method of disposing a line structure on a substrate and substrate with the conduit structure |
| 08/18/2005 | DE102004005030A1 Elektronisches Bauelement auf einem Trägerelement The electronic component on a support element |
| 08/18/2005 | DE102004004739A1 Contact arrangement for connecting an electronic component to a substrate having a defined plug device which can be removed and connected to the substrate |
| 08/18/2005 | DE102004002421A1 Düsenanordnung Nozzle assembly |
| 08/18/2005 | DE10020761B4 Folienleiter sowie Verfahren zur Herstellung eines Folienleiters Foil conductor as well as method for producing a foil conductor |
| 08/18/2005 | CA2549314A1 Method of manufacturing a circuit carrier and the use of the method |
| 08/17/2005 | EP1565047A1 Circuit board surface mount package |
| 08/17/2005 | EP1565046A1 Surface mounting structure for surface mounting an electronic component |
| 08/17/2005 | EP1565045A1 Discrete electronic component and related assembling method |
| 08/17/2005 | EP1564265A1 Ink jet printable thick film ink compositions and processes |
| 08/17/2005 | EP1563720A1 Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits |
| 08/17/2005 | EP1563085A1 Cooling stations for use in a web printing process for the manufacture of electrochemical sensors |
| 08/17/2005 | EP1562755A1 Method for producing a partially metallised film-type element |
| 08/17/2005 | EP1458794B1 Heat-curable resin composition |
| 08/17/2005 | EP1388186A4 Electrically conductive patterns, antennas and methods of manufacture |
| 08/17/2005 | EP1137683B1 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates |
| 08/17/2005 | EP0859686B1 Fabricating interconnects and tips using sacrificial substrates |
| 08/17/2005 | CN2718952Y Electronic element |
| 08/17/2005 | CN2718951Y Material returning device during printed circuit formation manufacturing |
| 08/17/2005 | CN2718782Y Semiconductor packaging and lead wire frame thereof |
| 08/17/2005 | CN2717603Y Tin furnace spray nozzle structure |
| 08/17/2005 | CN1656862A Nanoparticle filled underfill |
| 08/17/2005 | CN1656861A Improved structure of stacked vias in multiple layer electronic device carriers |
| 08/17/2005 | CN1656860A Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 08/17/2005 | CN1656612A Glass material for use at high frequencies |
| 08/17/2005 | CN1656573A Conductive paste, multilayer board including the conductive paste and process for producing the same |
| 08/17/2005 | CN1656401A Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly |
| 08/17/2005 | CN1656397A Method of determining a minimum pulse width for a short pulse laser system |
| 08/17/2005 | CN1655664A Ultrasonic manufacturing apparatus, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| 08/17/2005 | CN1655663A Ultrasonic manufacturing apparatus |
| 08/17/2005 | CN1655662A Printed circuit board having axially parallel via holes |
| 08/17/2005 | CN1655661A Mounting structure, electro-optical device, electronic apparatus, and method of manufacturing electro-optical device |
| 08/17/2005 | CN1655412A Discrete electronic component and related assembling method |
| 08/17/2005 | CN1655405A 大密度电连接器 Large density electrical connector |
| 08/17/2005 | CN1655348A Electronic part mounting substrate, electronic part, and semiconductor device |
| 08/17/2005 | CN1655182A Circuit printing process for resistance type touch control panel |
| 08/17/2005 | CN1655058A Photosensitive transfer sheet |
| 08/17/2005 | CN1655027A Panel display and electronic means thereof |
| 08/17/2005 | CN1654947A Component mounting board inspecting apparatus |
| 08/17/2005 | CN1654709A Surface treatment agents for metal films of printed circuit boards |
| 08/17/2005 | CN1654539A Thermosetting resin compositions and film articles |
| 08/17/2005 | CN1654203A Device for forming coating layer on printing product from printing machine |
| 08/17/2005 | CN1654191A Laminating method and laminating apparatus using the same |
| 08/17/2005 | CN1215747C Method for plating via hole with copper |
| 08/17/2005 | CN1215746C Permanganate dirt-removing method for printed-circuit board |
| 08/17/2005 | CN1215745C Wiring board and making method thereof |
| 08/17/2005 | CN1215744C Hydrogen and scaling-powder-free welding conducted through electronic adsorption |
| 08/17/2005 | CN1215743C Technology for making strengthened glass circuit board and its product and application |
| 08/17/2005 | CN1215742C Welding pad for printed circuit board and forming method thereof |
| 08/17/2005 | CN1215648C 电路器件 Circuit devices |
| 08/17/2005 | CN1215612C Terminal structure for high frequency signal transmitting parts |
| 08/17/2005 | CN1215607C Contactor with welding flux and producing method and application in flux ball grid array connector |
| 08/17/2005 | CN1215537C Elements with resin shell capsulation |
| 08/17/2005 | CN1215198C Etching method and etching appts. |
| 08/17/2005 | CN1215109C Flame retardant epoxy molding compositions |
| 08/17/2005 | CN1215049C Polybenzoxazole resin and precursor thereof |
| 08/17/2005 | CN1214961C Transmission and fixed device for chip |
| 08/17/2005 | CN1214872C Printed circuit board recycle method and apparatus thereof |
| 08/16/2005 | US6930885 Densely packed electronic assemblage with heat removing element |
| 08/16/2005 | US6930395 conductor contains a resin composition, and a glass transition temperature of the resin composition is set lower than a glass transition temperature of a resin composition contained in base; high connection reliability |
| 08/16/2005 | US6930392 Electronic parts packaging structure and method of manufacturing the same |
| 08/16/2005 | US6930390 resin coating is removed at portion located at a top face of metal bump and top face of bump is exposed from surface of resin coating; resin coating has first coating made of rigid resin and second coating has adhesive contact with first |
| 08/16/2005 | US6930384 Tape carrier package |
| 08/16/2005 | US6930258 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 08/16/2005 | US6930257 Integrated circuit substrate having laminated laser-embedded circuit layers |
| 08/16/2005 | US6930256 Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
| 08/16/2005 | US6930255 In which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit; crack resistance |
| 08/16/2005 | US6930240 Flex-circuit shielded connection |
| 08/16/2005 | US6930184 Functional fluorescent dyes |
| 08/16/2005 | US6930044 Method for fabricating a packaging substrate |
| 08/16/2005 | US6930020 Method for fabricating large area flexible electronics |