Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2005
08/24/2005CN1659720A Hermetic encapsulation of organic electro-optical elements
08/24/2005CN1659702A Electrical contacts for flexible displays
08/24/2005CN1659701A Voltage variable material for direct application and devices employing same
08/24/2005CN1659480A Cleaning compositions for microelectronic substation
08/24/2005CN1659417A A system and method for manufacturing printed circuit boards employing non-uniformly modified images
08/24/2005CN1659317A Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
08/24/2005CN1659312A Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
08/24/2005CN1659310A Method for electroless metalisation of polymer substrate
08/24/2005CN1659188A Resin particle, conductive particle and anisotropic conductive adhesive containing the same
08/24/2005CN1658998A Solder and packaging therefrom
08/24/2005CN1658997A System and method of laser drilling using a continuously optimized depth of focus
08/24/2005CN1658743A Circuit forming board and method of manufacturing circuit forming board
08/24/2005CN1658742A Reflux welding device
08/24/2005CN1658741A Production device
08/24/2005CN1658740A Method for assembling component on flexible circuit board
08/24/2005CN1658739A Production method of suspension board with circuit
08/24/2005CN1658738A Wet filming method of flexible printed circuit
08/24/2005CN1658737A Surface processing device of substrate material
08/24/2005CN1658735A Pressure welding structure and manufacturing method of flexible printed circuit board
08/24/2005CN1658734A Printed circuit board substrate and method for constructing same
08/24/2005CN1658439A Connection member and mount assembly and production method of the same
08/24/2005CN1658384A High-frequency wiring structure and method for producing the same
08/24/2005CN1658377A Method and apparatus for filling vias
08/24/2005CN1658334A Lead of flexible distribution and bonding pad for connection
08/24/2005CN1658279A Display device
08/24/2005CN1658011A Optical scanner control method, optical scanner and laser machining apparatus
08/24/2005CN1657289A Method for coating material, color filter substrate and method of manufacturing device
08/24/2005CN1657279A Treated copper foil and circuit board
08/24/2005CN1216516C Method for increasing adhesion property of macromolecular material and metal surface
08/24/2005CN1216515C Electronic loop device
08/24/2005CN1216514C Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element
08/24/2005CN1216505C Photoelectric device and electronic apparatus
08/24/2005CN1216422C Manufacturing method and structure of electroplated nickel/gold for electric contact pad of chip package substrate
08/24/2005CN1216419C Wiring baseboard, semiconductor device with wiring baseboard, and mfg. and installing method thereof
08/24/2005CN1216295C Apparatus and method for inspection
08/24/2005CN1216161C Method and apparatus for separating oxide of solder produced by jet solder groove
08/24/2005CN1216115C Resin composition, film with adhesive for semiconductor device laminated film with metal foil and semiconductor device using same
08/24/2005CN1215939C Jet image data generating method, forming device, and its used and method
08/24/2005CN1215938C Screen plate printing method, screen printer and container for storage for paste agent thereof
08/23/2005US6934163 Capacitor for dram connector
08/23/2005US6934160 Printed circuit board arrangement
08/23/2005US6933892 Method for forming radio frequency antenna
08/23/2005US6933813 Interconnection structure with etch stop
08/23/2005US6933615 Electronic component device and manufacturing method therefor
08/23/2005US6933601 Semiconductor connection substrate
08/23/2005US6933593 Power module having a heat sink
08/23/2005US6933587 Electronic circuit unit suitable for miniaturization
08/23/2005US6933449 Selective area solder placement
08/23/2005US6933448 Printed circuit board having permanent solder mask
08/23/2005US6933443 Method for bonding ceramic to copper, without creating a bow in the copper
08/23/2005US6933208 Method of forming wiring, and method of arranging devices and method of manufacturing image display system by using the same
08/23/2005US6933099 Method of forming a patterned metal layer
08/23/2005US6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
08/23/2005US6932892 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
08/23/2005US6932637 Component carrier
08/23/2005US6932621 Connector interface pad for structurally integrated wiring
08/23/2005US6932518 Circuit board having traces with distinct transmission impedances
08/23/2005US6932077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
08/23/2005US6931726 Method of making and interconnect structure
08/23/2005US6931724 Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon
08/23/2005US6931723 Organic dielectric electronic interconnect structures and method for making
08/23/2005US6931722 Method of fabricating printed circuit board with mixed metallurgy pads
08/23/2005US6931712 Method of forming a dielectric substrate having a multiturn inductor
08/18/2005WO2005076683A1 Multilayer printed wiring board
08/18/2005WO2005076682A1 Multilayer printed wiring board
08/18/2005WO2005076681A1 Method of manufacturing a circuit carrier and the use of the method
08/18/2005WO2005076680A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate
08/18/2005WO2005076679A2 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
08/18/2005WO2005076678A1 Method for the partial removal of a conductive layer
08/18/2005WO2005076677A1 Method for increasing a routing density for a circuit board and such a circuit board
08/18/2005WO2005076676A1 Circuit constituting body
08/18/2005WO2005076675A1 Method for bonding ceramic to copper, without creating a bow in the copper
08/18/2005WO2005076411A1 A system for detachably connecting a large number of signal lines of two components
08/18/2005WO2005076335A1 Composite shape electro-forming member, its electro-forming master and method for manufacturing the same
08/18/2005WO2005076334A1 Electro-forming master and the same-master-manufacturing method, and metal minute pattern made by the master
08/18/2005WO2005076319A2 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
08/18/2005WO2005076206A1 Method and device for continuously producing electronic film components, and an electronic film component
08/18/2005WO2005076202A1 Electronic device
08/18/2005WO2005076164A1 Printed circuit board return route check method and printed circuit board pattern design cad device
08/18/2005WO2005076163A1 Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and cad system
08/18/2005WO2005076080A1 Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed wiring board
08/18/2005WO2005075706A1 Surface-treating agent for metal
08/18/2005WO2005075586A1 Overcoat lacquer
08/18/2005WO2005075214A1 Printing
08/18/2005WO2005075118A1 Cleaning device of board and cleaning method, flat display panel, mounting equipment of electronic parts and mounting method
08/18/2005WO2005060401A9 Direct contact power transfer pad and method of making same
08/18/2005WO2005048666B1 Partially flexible circuit board
08/18/2005WO2005013189A3 Method for producing rfid labels
08/18/2005WO2004085550A3 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards
08/18/2005WO2003095710A3 Methods of and apparatus for electrochemically fabricating structures
08/18/2005WO2003095707A3 Method of and apparatus for forming three-dimensional structures
08/18/2005WO2003095706A3 Electrochemically fabricated hermetically sealed microstructures
08/18/2005US20050183101 Flexible printed circuit for optical disk drive
08/18/2005US20050183044 Design aid apparatus, design aid method, and computer-executable program
08/18/2005US20050182203 2,6-bis(4-cyanate-3,5-dimethylphenylmethyl) naphthalene; giving a cured product excellent flame retardancy, a low dielectric constant, a low dielectric loss tangent, high heat resistance
08/18/2005US20050182161 Irregular shaped copper particles and methods of use
08/18/2005US20050181684 Electronic component
08/18/2005US20050181646 Circuit board mounting bracket
08/18/2005US20050181641 Electrical contacts for flexible displays
08/18/2005US20050181637 System and method for electrically interconnecting boards