Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2005
09/01/2005DE4341598B4 Kompositteilchen, diese enthaltende Zusammensetzungen, Verfahren zum Herstellen derselben und Verwendungen Composite particles, compositions containing them, processes for making the same and uses
09/01/2005DE10356981B3 Mounting semiconductor chip on substrate, especially circuit board, involves arranging solder filling with solder bead, underfill materials on chip, applying to chip with adhesive band, mounting on substrate, melting by heat treatment
09/01/2005DE10329143B4 Elektronisches Modul und Verfahren zur Herstellung desselben An electronic module and method for manufacturing the same
09/01/2005DE102005001264A1 Ingredienzanalyseverfahren und Ingredienzanalysevorrichtung Ingredienzanalyseverfahren and Ingredienzanalysevorrichtung
09/01/2005DE102004008554A1 Punched grid arrangement for automobile, has printed circuit board with conductor unit having rest medium and widened conductor path for dissipation of heat from electrical and/or electronic units
09/01/2005DE102004007458A1 Verfahren zur Herstellung von RFID Etiketten A process for producing RFID labels
09/01/2005DE102004007457A1 In-line printing of intelligent packaging films has an initial station to print a conductive circuit, as an antenna, followed by four-color printing stations and a chip application station as a radio frequency identity tag
09/01/2005DE102004006575A1 Leistungsverteiler für ein Kraftfahrzeug Power divider for a motor vehicle
09/01/2005DE102004006533A1 Elektrisch leitfähiger Kontaktstift zum Einpressen in eine Öffnung einer Leiterplatte sowie elektrische Baugruppe mit einem solchen Kontaktstift Electrically conductive contact pin for pressing into an opening of a circuit board and electrical assembly with such a contact pin
09/01/2005DE102004006239A1 Überzugslack Top coat
09/01/2005DE102004005361A1 Verfahren zur Herstellung von metallischen Leitbahnen und Kontaktflächen auf elektronischen Bauelementen A process for the production of metallic interconnects and contact surfaces on electronic components
09/01/2005CA2556298A1 Methods of forming tracks and track arrangements
08/2005
08/31/2005EP1569504A1 Electrical housing with integrated connector
08/31/2005EP1569503A1 Method for supplying solder
08/31/2005EP1569501A1 Multilayer expansion card for electronic apparatus and relative production method
08/31/2005EP1569037A2 Scanner system
08/31/2005EP1568985A2 Apparatus for surface inspection and method and apparatus for inspecting substrate
08/31/2005EP1568748A1 Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
08/31/2005EP1568723A1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same
08/31/2005EP1568471A1 Heat-resistant flexible laminated board manufacturing method
08/31/2005EP1568258A1 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method
08/31/2005EP1568079A1 Metal core substrate packaging
08/31/2005EP1568070A2 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
08/31/2005EP1567979A1 Chipcard and method for production of a chipcard
08/31/2005EP1567302A2 Laser trimming of resistors
08/31/2005EP1567300A1 Method for soldering miniaturised components to a base plate
08/31/2005CN2722563Y Noise inhibiting structure of cold light sheet for backlight
08/31/2005CN1663330A Socketless package to circuit board assemblies and methods of using same
08/31/2005CN1663329A Production of via hole in flexible circuit printable board
08/31/2005CN1663328A Circuit board device and method for board-to-board connection
08/31/2005CN1663327A Ball grid array package
08/31/2005CN1663038A Laser processing
08/31/2005CN1663037A COF film carrier tape and its manufacturing method
08/31/2005CN1662929A Method for the production of electrically-conducting connections on chipcards
08/31/2005CN1662846A Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit
08/31/2005CN1662820A Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
08/31/2005CN1662679A Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/31/2005CN1662545A Dicopper(I)oxalate complexes for use as precursor substancesin metallic copper deposition
08/31/2005CN1662377A Printing screens, frames therefor and printing screen units
08/31/2005CN1662130A Flexible printed circuit board
08/31/2005CN1662122A Multi-layer circuit board with thermal diffusion and method of fabricating the same
08/31/2005CN1662121A Circuit boards of electronic equipment and fabricating method
08/31/2005CN1662120A Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
08/31/2005CN1662118A Wiring substrate, forming method of same, and organic el panel
08/31/2005CN1662117A Wired circuit substate
08/31/2005CN1662116A Multilayer ceramic substrate and its production method
08/31/2005CN1662115A Structure of soldering pad for improving stray effect
08/31/2005CN1661860A Method for interconnecting multiple printed circuit boards
08/31/2005CN1661854A Signal line circuit device
08/31/2005CN1661793A Mfg. method for conductor fig.
08/31/2005CN1661790A Particle removing member of substrate processing equipment
08/31/2005CN1661740A Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same
08/31/2005CN1661475A Photocuring resinoid compsn. and printed circuit board using same
08/31/2005CN1661362A Print solder checker
08/31/2005CN1661323A Apparatus for surface inspection and method and apparatus for inspecting substrate
08/31/2005CN1660953A Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
08/31/2005CN1660598A Ink jet printable thick film ink compositions and processes
08/31/2005CN1660597A Ink jet printable thick film ink compositions and processes
08/31/2005CN1217568C Hand mounting equipment and method for electronic part
08/31/2005CN1217566C Method for making multi-layer circuit assembly
08/31/2005CN1217565C Multilayer printed wiring board and producting method thereof
08/31/2005CN1217564C Roughened copper foil and making method thereof
08/31/2005CN1217563C Method for high reliable packaged electronic element, packing structure and metal mask
08/31/2005CN1217562C Method and arrangement for mounting component on carrier
08/31/2005CN1217358C Silk-screen printing board, ceramic laminated electronic equipment and its producing method
08/31/2005CN1217030C Method for plating polymer molding material, circuit forming component and method for producing circuit forming component
08/31/2005CN1216715C Solder material and electric or electronic device using same
08/30/2005US6938227 System and method for modifying electronic design data
08/30/2005US6937845 High-frequency module and radio device using the same
08/30/2005US6937824 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device
08/30/2005US6937454 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface
08/30/2005US6937120 Conductor-within-a-via microwave launch
08/30/2005US6937037 Probe card assembly for contacting a device with raised contact elements
08/30/2005US6937035 Method and apparatus for inspecting printed circuit boards
08/30/2005US6937004 Test mark and electronic device incorporating the same
08/30/2005US6936930 Thermal enhance MCM package
08/30/2005US6936927 Circuit device having a multi-layer conductive path
08/30/2005US6936922 Semiconductor package structure reducing warpage and manufacturing method thereof
08/30/2005US6936921 High-frequency package
08/30/2005US6936916 Microelectronic assemblies and electronic devices including connection structures with multiple elongated members
08/30/2005US6936774 Wiring substrate produced by transfer material method
08/30/2005US6936769 Electronic part mounting substrate, electronic part, and semiconductor device
08/30/2005US6936644 Uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that
08/30/2005US6936532 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
08/30/2005US6936502 Package modification for channel-routed circuit boards
08/30/2005US6936498 Package structure with increased capacitance and method
08/30/2005US6936337 Metal/ceramic circuit board
08/30/2005US6936336 Transfer sheet and production method of the same and wiring board and production method of the same
08/30/2005US6936311 Using a source of laser energy, a receiving substrate, and a target substrate
08/30/2005US6936115 Soldering flux vehicle additive and fine pitch printing method
08/30/2005US6935867 Connection unit between substrated and component and method for fabricating connection unit
08/30/2005US6935598 Wire retainer
08/30/2005US6935554 Metal/ceramic bonding article and method for producing same
08/30/2005US6935553 Reflow soldering method
08/30/2005US6935232 Solder paste printing apparatus and printing method
08/30/2005US6935018 Copper plated invar with acid preclean
08/25/2005WO2005079130A1 Copper foil having blackened surface or layer
08/25/2005WO2005079128A1 Micro-electromechanical sub-assembly having an on-chip transfer mechanism
08/25/2005WO2005079127A1 Electric sub-assembly comprising an electrically conductive contact pin for pressing into an opening of a printed circuit board
08/25/2005WO2005079126A2 Metal deposition
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