| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/08/2005 | US20050195527 Mounting method of magnetic head component, magnetic head device and manufacturing method of magnetic head device |
| 09/08/2005 | US20050195052 Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics |
| 09/08/2005 | US20050194851 Electric machine with a circuit board for wiring lines of a winding system |
| 09/08/2005 | US20050194697 Anisotropic conductive sheet and manufacture thereof |
| 09/08/2005 | US20050194696 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/08/2005 | US20050194693 Semiconductor device manufacturing method and manufacturing apparatus |
| 09/08/2005 | US20050194686 Semiconductor device and manufacturing method for the same |
| 09/08/2005 | US20050194680 Electrical connection materials and electrical connection methods |
| 09/08/2005 | US20050194678 Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof |
| 09/08/2005 | US20050194663 Optical semiconductor device |
| 09/08/2005 | US20050194588 Fluorine compound, liquid repellent membrane using the same and product using the same |
| 09/08/2005 | US20050194575 Electrical conductivity can be formed by preventing the formation of a Cu Ni alloy due to the reaction of the Cu powder and the Ni powder |
| 09/08/2005 | US20050194356 Removing photoresist from a workpiece using water and ozone and a photoresist penetrating additive |
| 09/08/2005 | US20050194353 Laser micromachining and electrical structures formed thereby |
| 09/08/2005 | US20050194349 Method of fabricating film carrier |
| 09/08/2005 | US20050194348 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
| 09/08/2005 | US20050194180 Compliant contact pin assembly, card system and methods thereof |
| 09/08/2005 | US20050194174 Electrical feedthrough assembly for a sealed housing |
| 09/08/2005 | US20050194085 Method for producing ceramic multilayer substrate |
| 09/08/2005 | US20050194084 Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| 09/08/2005 | US20050193911 Device for producing a coating on printed products from a printing press |
| 09/08/2005 | US20050193555 Multilayer printed wiring board and method of manufacturing the same |
| 09/08/2005 | US20050193553 Method and device for joining at least two parts |
| 09/08/2005 | DE4242843B4 Verfahren zur Herstellung von aus mehreren Keramikschichten aufgebauten Elektronikkomponenten A process for the production of ceramic layers composed of several electronic components |
| 09/08/2005 | DE202005010364U1 Flexible printed circuit board used in electronic devices comprises a copper and/or copper alloy layer arranged between an non electrically conducting flexible base layer and a tin-containing layer which contains a further metal |
| 09/08/2005 | DE202005009785U1 Cover template for use with a printed circuit board is used to block lacquer from contact surfaces during coating |
| 09/08/2005 | DE202005008231U1 Connecting element for an electric connection with an electrode on a piezoelectric board (PB) acts as an element to link the PB to a printed circuit board underneath the PB |
| 09/08/2005 | DE202004020549U1 Flat cable comprises conductor layer positioned between support layer and cover layer, layers being bound together by adhesive which is fixed in its final shape during formation of laminate using heat, radiation or pressure |
| 09/08/2005 | DE10393284T5 Flüssigkristallpolymerverbundstoffe, Verfahren zu ihrer Herstellung und daraus hergestellte Gegenstände Liquid crystal polymer composites, processes for their preparation, and articles made therefrom |
| 09/08/2005 | DE10206356B4 Verfahren zur Verbindung eines bedrahteten elektrischen oder elektronischen Bauteils mit einem elektrisch leitenden Körper A method for connecting a wired electrical or electronic component with an electrically conductive body |
| 09/08/2005 | DE102005004845A1 Wafer-Unterteilungsverfahren Wafer dividing method |
| 09/08/2005 | DE102004042031A1 Steuerverfahren für optischen Scanner, optischer Scanner und Laserbearbeitungsvorrichtung A control method for optical scanners, optical scanners and laser machining apparatus |
| 09/08/2005 | DE102004014749B3 Heating device for surface mount electronic components for making and/or breaking solder or adhesive connections has independently controllable radiating segments associated with at least one defined sub-pattern |
| 09/08/2005 | DE102004008738A1 Elektronische Baugruppe und Verfahren zur Herstellung dieser Electronic assembly and method for producing these |
| 09/08/2005 | DE102004008028A1 Manufacturing electronic assembly involves triggering chemical reaction in which supporting polymer is cross-linked and converted into duromer |
| 09/08/2005 | DE102004007701A1 Electric insulator/insulating material for insulating an electric conductor has a layer/surface structure with a nano-structure over a micro-structure |
| 09/08/2005 | DE102004007009A1 Verfahren zur Herstellung eines Leistungsmoduls und Leistungsmodul A process for producing a power module and the power module |
| 09/08/2005 | DE102004005300A1 Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens A method for treating the carrier material for the preparation of and use of the method Schltungsträgern |
| 09/08/2005 | DE10039558B4 Vorrichtung zur Sprühbehandlung von Leiterplatten Apparatus for spraying of printed circuit boards |
| 09/07/2005 | EP1571894A1 Holding/convey jig and holding/convey method |
| 09/07/2005 | EP1571707A2 Semiconductor device temperature detection method and power conversion apparatus |
| 09/07/2005 | EP1571706A1 Electronic device |
| 09/07/2005 | EP1571704A1 Method for depositing a solder material on a substrate in the form of a predetermined pattern |
| 09/07/2005 | EP1571186A1 Metallic colloidal solution and ink jet ink using it |
| 09/07/2005 | EP1570713A1 Printed wiring boards having low inductance embedded capacitors and methods of making same |
| 09/07/2005 | EP1569757A2 Apparatus for microdeposition of multiple fluid materials |
| 09/07/2005 | EP1250727B1 Rfid foil or film antennas |
| 09/07/2005 | CN2724380Y Detector for printed circuit board |
| 09/07/2005 | CN2724378Y Electromagnetic interference shield cover |
| 09/07/2005 | CN2724364Y Structure of DC to AC converter circuit board |
| 09/07/2005 | CN2724363Y Spray device |
| 09/07/2005 | CN2724362Y Material taking arm for circuit board |
| 09/07/2005 | CN2724361Y 印刷电路板 A printed circuit board |
| 09/07/2005 | CN2723087Y Broken drill real time detector for printing plate digital control machine tool |
| 09/07/2005 | CN1666583A Metallised parts made from plastic material |
| 09/07/2005 | CN1666582A Ball grid array jumper |
| 09/07/2005 | CN1666581A Carriers for printed circuit board marking |
| 09/07/2005 | CN1666397A Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 09/07/2005 | CN1666384A Connector, method for manufacturing the same, and wiring board structure employing it |
| 09/07/2005 | CN1666349A Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof |
| 09/07/2005 | CN1666337A Forming contact array on substrate |
| 09/07/2005 | CN1666327A Flexible wiring base material and process for producing the same |
| 09/07/2005 | CN1666149A Heat stable photocurable resin composition for dry film resist |
| 09/07/2005 | CN1665966A Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and |
| 09/07/2005 | CN1665964A Multi-step release method for electrochemically fabricated structures |
| 09/07/2005 | CN1665899A Conductive adhesive and circuit comprising same |
| 09/07/2005 | CN1665859A Biaxially oriented polyester film and laminates thereof with copper |
| 09/07/2005 | CN1665385A Inspection method and system and production method of mounted substrate |
| 09/07/2005 | CN1665377A Method for producing ceramic multilayer substrate |
| 09/07/2005 | CN1665376A Production process of high precision silver slurry perforated multilayer carbon membrane surface mounting board |
| 09/07/2005 | CN1665375A Anisotropic conductive sheet and manufacture thereof |
| 09/07/2005 | CN1665374A A method for assembling module and mainboard |
| 09/07/2005 | CN1665373A Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board |
| 09/07/2005 | CN1665372A Method for manufacturing heat conductive substrate |
| 09/07/2005 | CN1665371A Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics |
| 09/07/2005 | CN1665370A 布线结构 Wiring structure |
| 09/07/2005 | CN1664856A Method for making smart cards capable of operating with and without contact |
| 09/07/2005 | CN1664522A Temperature detection method of semiconductor device and power conversion apparatus |
| 09/07/2005 | CN1664174A Method for copperizing continuously |
| 09/07/2005 | CN1664000A Thermosetting resin compositions, resin films and film articles |
| 09/07/2005 | CN1663794A Printing apparatus and method for bonding material |
| 09/07/2005 | CN1218616C Method of flexible printed circuit board on electroplated ink cartridge |
| 09/07/2005 | CN1218615C Electrical component, arrangement for said component and method for producing said arrangement |
| 09/07/2005 | CN1218439C Connecting structure, liquid crystal device, electronic equipment, anisotropic conductive adhesive and method for manufacturing the adhesive |
| 09/07/2005 | CN1218394C Multichip installation structure, electrooptical device and electronic machine |
| 09/07/2005 | CN1218333C Laminated circuit board and preproduction method for electronic part, and laminated electronic part |
| 09/07/2005 | CN1218298C Magnetic head assembly and mfg. method and lead-connection method for said magnetic head assembly |
| 09/07/2005 | CN1218220C Production of photoresist coatings |
| 09/07/2005 | CN1218219C Photosensitive resin composition |
| 09/07/2005 | CN1218015C Liquid crystal polymers for flexible circuits |
| 09/07/2005 | CN1218005C Adhesive and circuit material using adhesive |
| 09/06/2005 | WO2005052691A1 Method for forming thick film pattern, method for manufacturing electronic component, and photosensitive paste for photolithography |
| 09/06/2005 | US6941537 Standoff devices and methods of using same |
| 09/06/2005 | US6940729 Integrated circuit stacking system and method |
| 09/06/2005 | US6940708 Electronic component |
| 09/06/2005 | US6940537 Inspecting apparatus of printed state or the like in flexible printed circuit board |
| 09/06/2005 | US6940468 Transformers or inductors (“transductors”) and antennas manufactured from conductive loaded resin-based materials |
| 09/06/2005 | US6940361 Self-aligned transition between a transmission line and a module |
| 09/06/2005 | US6940179 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 09/06/2005 | US6940176 Solder pads for improving reliability of a package |