| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/06/2005 | US6940175 Semiconductor device in which a plurality of electronic components are combined with each other |
| 09/06/2005 | US6940168 Enhanced pad design for substrate |
| 09/06/2005 | US6940167 Variable cross-section plated mushroom with stud for bumping |
| 09/06/2005 | US6940159 Method and apparatus for molding, module electronic devices and a module electronic device molded thereby |
| 09/06/2005 | US6940038 Laser trimming of resistors |
| 09/06/2005 | US6940024 Printed wiring board having wiring patterns and connection terminals |
| 09/06/2005 | US6940023 Printed-wiring board and electronic device |
| 09/06/2005 | US6940022 Protective coating for an electronic device |
| 09/06/2005 | US6940013 Surface mounting a power converter |
| 09/06/2005 | US6939913 Radically polymerizable phosphoric ester of ethyl methacrylic compounds, silicone partides, a curing agent capable of generating a free radical upon heating; improve adhesive bonding strength to electronics, electrodes |
| 09/06/2005 | US6939744 Use of palladium in IC manufacturing with conductive polymer bump |
| 09/06/2005 | US6939738 Component built-in module and method for producing the same |
| 09/06/2005 | US6939737 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 09/06/2005 | US6939660 Laser thermal transfer donor including a separate dopant layer |
| 09/06/2005 | US6939622 Chip-on-film use copper foil |
| 09/06/2005 | US6939621 Plated copper alloy material and process for production thereof |
| 09/06/2005 | US6939620 improving adhesion by producing a three-layer printed wiring board by bonding the polyimide resin film and the copper foil with an adhesive containing an epoxy resin, to form a laminate, that has a low surface roughness, and high conductivity |
| 09/06/2005 | US6939474 Method for forming microelectronic spring structures on a substrate |
| 09/06/2005 | US6939455 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 09/06/2005 | US6939447 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 09/06/2005 | US6939431 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors |
| 09/06/2005 | US6939147 Junction box and soldering method for printed circuit board of the junction box |
| 09/06/2005 | US6939146 Board-to-board power connector for a projection device |
| 09/06/2005 | US6939144 Electrical connector with elastomeric element and restrainer member to offset relaxation of the elastomer |
| 09/06/2005 | US6939143 Flexible compliant interconnect assembly |
| 09/06/2005 | US6939142 Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece |
| 09/06/2005 | US6938992 Nozzle arrangement with an electrically heated actuator |
| 09/06/2005 | US6938815 reinforced bonding composite; reinforcers are uniformily distributed in a matrix |
| 09/06/2005 | US6938653 Filling equipment and method for filling fluidized material |
| 09/06/2005 | US6938338 Method of making an electronic contact |
| 09/06/2005 | US6938336 forming roughened surfaces on a conductive layer in a throughhole before filling with a resin, smoothing surfaces on conductive layers on top and bottom of the board, printing the resin using a mask with an opening , filling the resin, and curing |
| 09/06/2005 | US6938335 Electronic component mounting method |
| 09/06/2005 | US6938333 Method of manufacturing a metal-ceramic circuit board |
| 09/06/2005 | US6938332 Method for manufacturing multilayer ceramic substrates |
| 09/01/2005 | WO2005081609A1 Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them |
| 09/01/2005 | WO2005081603A1 Method for producing substrates |
| 09/01/2005 | WO2005081602A1 Electronic component mounting method, and circuit board and circuit board unit used therein |
| 09/01/2005 | WO2005081600A1 Printed circuit board and process for producing the same |
| 09/01/2005 | WO2005081599A1 Method and apparatus for simultaneous inspection and cleaning of a stencil |
| 09/01/2005 | WO2005081598A1 Screen printing apparatus and screen printing method |
| 09/01/2005 | WO2005081597A1 Methods of forming tracks and track arrangements |
| 09/01/2005 | WO2005081596A2 Preferential ground and via exit structures for printed circuit boards |
| 09/01/2005 | WO2005081595A2 Preferential assymmetrical via positioning for printed circuit boards |
| 09/01/2005 | WO2005081594A2 Electronic module and method for the production thereof |
| 09/01/2005 | WO2005081312A1 Substrate for mounting semiconductor |
| 09/01/2005 | WO2005081311A1 Circuit device and manufacturing method thereof |
| 09/01/2005 | WO2005081268A1 Wiring board employing arranged conductors |
| 09/01/2005 | WO2005081064A1 Bilayer laminated film for bump formation and method of bump formation |
| 09/01/2005 | WO2005080638A1 Stabilised 1,2-dichloroethylene compositions |
| 09/01/2005 | WO2005080633A2 Method for zinc coating aluminum |
| 09/01/2005 | WO2005080505A1 Polyimidesiloxane solution composition |
| 09/01/2005 | WO2005080074A1 Thin film composite material, method for producing same, and multilayer wiring board and electronic component using such thin film composite material |
| 09/01/2005 | WO2005079353A2 Nanoscale metal paste for interconnect and method of use |
| 09/01/2005 | WO2005079249A2 Circuit board mounting bracket |
| 09/01/2005 | WO2005069734A3 A liquid thermosetting ink |
| 09/01/2005 | WO2005022576A3 Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp |
| 09/01/2005 | WO2004110113A3 Electrical devices embedded in printed circuit boards |
| 09/01/2005 | WO2003071008A3 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 09/01/2005 | US20050191906 Electrical contact |
| 09/01/2005 | US20050191880 Electronic card connector |
| 09/01/2005 | US20050191838 Apparatus and method for forming bump |
| 09/01/2005 | US20050191788 Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials |
| 09/01/2005 | US20050191781 Method of forming thin film pattern, method of manufacturing device, electro-optical apparatus and electronic apparatus |
| 09/01/2005 | US20050191511 For forming conductor patterns; thermosetting resins; electroless plating; electrostatic latent imaging |
| 09/01/2005 | US20050191473 Wired circuit board |
| 09/01/2005 | US20050191412 encapsulation of conductors dielectrics, then forming a shield layer by precoating with organometallic layer and depositing a thick film over the precoat layer; forming resistors by screen printing |
| 09/01/2005 | US20050190959 Drill hole inspection method for printed circuit board fabrication |
| 09/01/2005 | US20050190824 Method and apparatus for mounting a modem to a carrier assembly |
| 09/01/2005 | US20050190808 Optoelectric composite substrate and method of manufacturing the same |
| 09/01/2005 | US20050190614 Novel radio frequency (RF) circuit board topology |
| 09/01/2005 | US20050190587 Microstrip line dielectric overlay |
| 09/01/2005 | US20050190543 Circuit board sub-assemblies, methods for manufacturing same, electronic signal filters including same, and methods, for manufacturing electronic signal filters including same |
| 09/01/2005 | US20050190539 Electronic control device |
| 09/01/2005 | US20050190537 Multilayer expansion card for electronic apparatus and relative production method |
| 09/01/2005 | US20050190531 Flexible circuit board assembly |
| 09/01/2005 | US20050190489 Recording disk drive capable of suppressing vibration of flexible printed circuit board |
| 09/01/2005 | US20050190361 Apparatus for surface inspection and method and apparatus for inspecting substrate |
| 09/01/2005 | US20050190333 Planar display module |
| 09/01/2005 | US20050190175 Display panel with signal transmission patterns |
| 09/01/2005 | US20050190174 Liquid crystal display panel with signal transmission patterns |
| 09/01/2005 | US20050190021 Waveguide coupler |
| 09/01/2005 | US20050190017 Filter circuit device and method of manufacturing the same |
| 09/01/2005 | US20050189956 Electronic components with plurality of contoured microelectronic spring contacts |
| 09/01/2005 | US20050189650 Low fabrication cost, high performance, high reliability chip scale package |
| 09/01/2005 | US20050189645 Flexible printed circuit board |
| 09/01/2005 | US20050189640 Interconnect system without through-holes |
| 09/01/2005 | US20050189636 Packaging substrates for integrated circuits and soldering methods |
| 09/01/2005 | US20050189630 Bonding arrangement and method for LTCC circuitry |
| 09/01/2005 | US20050189628 Resin composition, process for producing the same and electrophotographic fixing member |
| 09/01/2005 | US20050189627 Method of surface mounting a semiconductor device |
| 09/01/2005 | US20050189566 Switching power-supply module |
| 09/01/2005 | US20050189520 Metallic colloidal solution and inkjet-use metallic ink |
| 09/01/2005 | US20050189402 Area array and leaded SMT component stenciling apparatus and area array reballing method |
| 09/01/2005 | US20050189400 Methods for manufacturing optical modules using lead frame connectors |
| 09/01/2005 | US20050189226 Contacting negatively charged electrode and pattern during immersion and movement of substrate in electrolytic bath; industrial scale, continuous process, economical |
| 09/01/2005 | US20050189138 Electronic assembly and method of manufacture thereof |
| 09/01/2005 | US20050189137 Multilayer ceramic substrate and its production method |
| 09/01/2005 | US20050189136 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 09/01/2005 | US20050188535 Methods for manufacturing lead frame connectors for optical transceiver modules |
| 09/01/2005 | US20050188531 Assembly method for actuator head suspension assembly |