| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/23/2009 | CN100574565C Reference position determining method, printing method and device, mounting method |
| 12/23/2009 | CN100574564C Screen printer |
| 12/23/2009 | CN100574563C Metal pattern and process for producing the same |
| 12/23/2009 | CN100574562C Manufacturing method of hollowed-out PCB |
| 12/23/2009 | CN100574561C Multilayer printed wiring board |
| 12/23/2009 | CN100574560C Printed circuit boards |
| 12/23/2009 | CN100574558C Printed wiring board connection device |
| 12/23/2009 | CN100574557C Jafani effect improving method |
| 12/23/2009 | CN100574554C Flexible circuit board, processing method of said flexible circuit board and electronic device |
| 12/23/2009 | CN100574552C 印刷电路板 A printed circuit board |
| 12/23/2009 | CN100573847C Method of manufacturing a composite of copper and resin |
| 12/23/2009 | CN100573845C Capping of metal interconnects in integrated circuit electronic devices |
| 12/23/2009 | CN100573837C Method for preparing printed circuit board and light emitting diode |
| 12/23/2009 | CN100573159C Systems and methods for connecting electrical components |
| 12/23/2009 | CN100573112C Appearance detector and appearance detection method |
| 12/23/2009 | CN100572608C Surface coarsening method and surface coarsening liquid for copper foil |
| 12/23/2009 | CN100572449C Release film for printed wiring board production |
| 12/23/2009 | CN100572058C Character screen printing plate and method for manufacturing circuit board employing the same |
| 12/23/2009 | CN100571965C Welding agent for braze, braze method and printing substrate |
| 12/23/2009 | CN100571961C Method of producing laser-processed product and adhesive sheet for laser processing used therefor |
| 12/22/2009 | USRE41051 Package substrate |
| 12/22/2009 | US7636244 Computer enclosure |
| 12/22/2009 | US7635815 Lightweight circuit board with conductive constraining cores |
| 12/22/2009 | US7635612 Method and use of a device for applying coatings to band-like structures during the production of semiconductor components |
| 12/22/2009 | US7635516 Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet |
| 12/22/2009 | US7635497 Provides method for producing a system having a substrate and a component applied to a predetermined location on a surface of the substrate, which is independent of the speed of a gripper; for example, applying microchips to integrated circuits |
| 12/22/2009 | US7635178 Nozzle apparatus for an inkjet printhead with a solenoid piston |
| 12/22/2009 | US7635079 System for locating conductive sphere utilizing screen and hopper of solder balls |
| 12/22/2009 | US7635016 Board cleaning method, board cleaning apparatus, and component mounting method |
| 12/22/2009 | CA2460853C Printed circuit techniques for polyethylene surfaces |
| 12/22/2009 | CA2420119C Method and device for testing the operatives of printed circuit boards |
| 12/22/2009 | CA2398270C Package for microwave components |
| 12/17/2009 | WO2009151806A2 Elastic-cushioned capacitively-coupled connector |
| 12/17/2009 | WO2009151804A1 Input/output connector with capacitive coupling mating interface |
| 12/17/2009 | WO2009151803A1 Capacitively coupled connector for flexible printed circuit applications |
| 12/17/2009 | WO2009151492A2 Metal and electronic device coating process for marine use and other environments |
| 12/17/2009 | WO2009151123A1 Method for joining substrate and object to be mounted using solder paste |
| 12/17/2009 | WO2009151108A1 Mounting substrate, substrate and methods for manufacturing mounting substrate and substrate |
| 12/17/2009 | WO2009151107A1 Entry sheet for drilling |
| 12/17/2009 | WO2009151006A1 Method for producing ceramic molded body |
| 12/17/2009 | WO2009150936A1 Metal pattern forming method and metal pattern |
| 12/17/2009 | WO2009150759A1 Solder bonding method and solder joint |
| 12/17/2009 | WO2009150570A1 Electronic textile |
| 12/17/2009 | WO2009150133A1 Circuit board with a flexible region and method for production thereof |
| 12/17/2009 | US20090311429 Plating method and apparatus |
| 12/17/2009 | US20090311427 Mask Dimensional Adjustment and Positioning System and Method |
| 12/17/2009 | US20090310909 Suspension board with circuit and producing method thereof |
| 12/17/2009 | US20090310850 Screen printing apparatus |
| 12/17/2009 | US20090310323 Printed circuit board including electronic component embedded therein and method of manufacturing the same |
| 12/17/2009 | US20090310320 Low profile solder grid array technology for printed circuit board surface mount components |
| 12/17/2009 | US20090308651 Wiring substrate including conductive core substrate, and manufacturing method thereof |
| 12/17/2009 | US20090308650 Printed circuit board and method of manufacturing the same |
| 12/17/2009 | US20090308649 Printed Circuit Board With Reduced Signal Distortion |
| 12/17/2009 | US20090308640 Wafer level package and method of manufacturing the same |
| 12/17/2009 | US20090308639 Flexible printed circuit board |
| 12/17/2009 | US20090308638 Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board |
| 12/17/2009 | US20090308120 Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained |
| 12/17/2009 | US20090307902 Apparatus and method for applying conductive paste onto electronic component |
| 12/17/2009 | US20090307899 Method and apparatus for mounting conductive balls |
| 12/17/2009 | DE202008017450U1 Folienanschluss Film connection |
| 12/17/2009 | DE112005000374B4 Schnellmaterialwechselmodul, Verfahren zum Wechseln einer Materialrolle, sowie Schablonendrucker Quick material change module, method for changing a roll of material and stencil printer |
| 12/17/2009 | DE102008033225B3 Device for thermal treatment of workpieces, comprises printed circuit boards equipped with electric and electronic component, and a process chamber in which a heating/cooling device is formed and/or arranged on heating and/or cooling zone |
| 12/17/2009 | DE102008025833A1 Verfahren und Vorrichtung zum stoffschlüssigen Fügen metallischer Anschlussstrukturen Method and apparatus for securely joining metallic connection structures |
| 12/17/2009 | DE102008024885A1 Printed circuit board manufacturing method, involves applying additional layer on base layer, and merging connection layer with base layer and with metallic powder layer to form double layer |
| 12/17/2009 | DE10013255B4 Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen Resin-encapsulated electronic device for use in internal combustion engines |
| 12/17/2009 | CA2724602A1 Metal and electronic device coating process for marine use and other environments |
| 12/16/2009 | EP2134147A2 Method of soldering and positioning an integrated circuit on a substrate and assembly manufactured by this method |
| 12/16/2009 | EP2134146A1 Printed circuit board assembly and a method of assembling thereof |
| 12/16/2009 | EP2133398A1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 12/16/2009 | EP2133200A1 Conductive-substance-adsorbing resin film, process for producing conductive-substance-adsorbing resin film, metal-layer-coated resin film made from the same, and process for producing metal-layer-coated resin film |
| 12/16/2009 | EP2132968A1 Method for producing an electrically conductive path on a plastic component |
| 12/16/2009 | EP2132832A1 Electronic assembly for attachment to a fabric substrate, electronic textile, and method of manufacturing such an electronic textile |
| 12/16/2009 | EP2132272A1 Conformal coating comprising binder and non-conductive particulate |
| 12/16/2009 | EP2132254A1 Polymer substrate for electronic components |
| 12/16/2009 | EP1628363B1 Circuit member connecting structure and method of producing the same |
| 12/16/2009 | EP1320881B1 Method of securing solder balls and any components fixed to one and the same side of a substrate |
| 12/16/2009 | CN201365378Y Material box for electronic packing production |
| 12/16/2009 | CN201365377Y Circuit board cut edge marking structure |
| 12/16/2009 | CN201365376Y Support tool of printed circuit board |
| 12/16/2009 | CN201365375Y Circuit board structure |
| 12/16/2009 | CN201365372Y Multi-layer circuit board |
| 12/16/2009 | CN201364593Y Disposable RFID (radio frequency identification) electronic tag made of paper-based composite metallic membrane antenna |
| 12/16/2009 | CN101606446A Multilayer circuit board and motor drive circuit board |
| 12/16/2009 | CN101606445A Method for manufacturing printed wiring board |
| 12/16/2009 | CN101606444A Print circuit board and electronic device using the same |
| 12/16/2009 | CN101605855A Optical element, electronic module, and method for production of electronic module |
| 12/16/2009 | CN101605434A Method for molding via hole of printed circuit board |
| 12/16/2009 | CN101605433A Method for processing buried resistor in printed circuit board |
| 12/16/2009 | CN101605432A Automatic wet process lamination method of rigid printed circuit boards |
| 12/16/2009 | CN101605431A Manufacture method of molding interconnection device |
| 12/16/2009 | CN101605430A Method for pressing layer gasket of rigid-flexible product |
| 12/16/2009 | CN101605429A Method for machining rigid-flexible combination plate needing to be stamped and special die |
| 12/16/2009 | CN101605428A Circuit board with optical waveguide layer and manufacture method thereof |
| 12/16/2009 | CN101605427A One-way separation type extensible interconnection mother board |
| 12/16/2009 | CN101605426A Integrated structure of flexible circuit board |
| 12/16/2009 | CN101605425A Flexible printed circuit board |
| 12/16/2009 | CN101604675A Circuit board and method of manufacturing the same, and circuit device and method of manufacturing the same |
| 12/16/2009 | CN101604668A Pb-free solder-connected structure and electronic device |
| 12/16/2009 | CN101604641A Carrying method and carrying device of conductive ball |
| 12/16/2009 | CN101604636A Method for manufacturng multi-layer ceramic substrate and electronic device using the same |