| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/06/2010 | CN100577423C Method of manufacturing ink-jet head |
| 01/06/2010 | CN100577389C Multi-layer sheet |
| 01/05/2010 | US7643896 Operation-related information display method and operation-related information display system |
| 01/05/2010 | US7642998 Display apparatus and assembly of its driving circuit |
| 01/05/2010 | US7642704 Light-emitting diode with a base |
| 01/05/2010 | US7642660 Method and apparatus for reducing electrical interconnection fatigue |
| 01/05/2010 | US7642484 Multiple beam micro-machining system and method |
| 01/05/2010 | US7642325 Non-sticky water-based conformal coating material |
| 01/05/2010 | US7642213 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 01/05/2010 | US7642130 Manufacturing method of wiring substrate |
| 01/05/2010 | US7642126 Method of manufacturing circuits |
| 01/05/2010 | US7641817 Silver powder and method for producing same |
| 01/05/2010 | US7641099 Solder joint determination method, solder inspection method, and solder inspection device |
| 01/05/2010 | US7640660 Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers |
| 01/05/2010 | US7640659 Method for forming conductive pattern and wiring board |
| 01/05/2010 | US7640658 Methods for forming an anti-tamper pattern |
| 01/05/2010 | US7640657 Printed circuit component placement method |
| 01/05/2010 | US7640656 Method for manufacturing a pre-molding leadframe strip with compact components |
| 01/05/2010 | US7640655 Electronic component embedded board and its manufacturing method |
| 01/05/2010 | US7640654 Electronic component transporting method |
| 01/05/2010 | US7640641 Method for producing parts for passive electronic components and parts produced |
| 01/05/2010 | CA2360359C Non-contact or non-contact hybrid smart card for limiting risks of fraud |
| 01/04/2010 | CA2671251A1 A method for making a three-dimensional multi-layered interconnect device |
| 12/31/2009 | US20090325377 Procedure for Obtaining Nanotube Layers of Carbon with Conductor or Semiconductor Substrate |
| 12/31/2009 | US20090325105 Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| 12/31/2009 | US20090323299 Electronic device substrate, electronic device and methods for making same |
| 12/31/2009 | US20090323165 Method for packaging a display device and the device obtained thereof |
| 12/31/2009 | US20090322705 Capacitive sensor and method for manufacturing same |
| 12/31/2009 | US20090321953 Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire |
| 12/31/2009 | US20090321529 Radio frequency identification functionality coupled to electrically conductive signage |
| 12/31/2009 | US20090321527 Wireless ic device and manufacturing method thereof |
| 12/31/2009 | US20090321266 Method for manufacturing printed-circuit board |
| 12/31/2009 | US20090321257 Biosensor, method of producing the same and detection system comprising the same |
| 12/31/2009 | US20090321126 Concentric Vias In Electronic Substrate |
| 12/31/2009 | US20090321124 Semiconductor device and manufacturing process thereof |
| 12/31/2009 | US20090321122 Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate |
| 12/31/2009 | US20090321118 Printed circuit board embedded chip and manufacturing method thereof |
| 12/31/2009 | US20090321116 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
| 12/31/2009 | US20090321112 Rigid-flexible printed circuit board having a peelable mask and method of making |
| 12/31/2009 | US20090321109 Printed circuit board and manufacturing method thereof |
| 12/31/2009 | US20090320998 Articles and methods including patterned substrates formed from densified, adhered metal powders |
| 12/31/2009 | US20090320960 Solder composition |
| 12/31/2009 | DE112007002960T5 Mehrschichtverbindungsplatine Multilayer interconnect board |
| 12/31/2009 | DE102008029123A1 Folding fixture for fastening electronic unit on printed circuit board, has spacers fastened to edges of assembly element, where ends of spacers are not fastened to assembly element and connect fixture with printed circuit board |
| 12/31/2009 | DE102004047302B4 Montageanordnung für einen Kondensator sowie elektrisches Steuergerät mit einer solchen Montageanordnung A mounting arrangement for a capacitor as well as electrical control device having such a mounting arrangement |
| 12/30/2009 | WO2009158355A2 A method for packaging a display device and the device obtained thereof |
| 12/30/2009 | WO2009157334A1 Reduction-type electroless tin plating solution and tin coats formed by using the same |
| 12/30/2009 | WO2009157225A1 Process for production of siloxane-polyimide resin |
| 12/30/2009 | WO2009157160A1 Packaging structure and method for manufacturing packaging structure |
| 12/30/2009 | WO2009157143A1 Mold release film |
| 12/30/2009 | WO2009157130A1 Joint structure and electronic component |
| 12/30/2009 | WO2009156993A2 Method and system for non-contact materials deposition |
| 12/30/2009 | WO2009156505A1 Method and device for joining components by means of laser radiation |
| 12/30/2009 | WO2009155808A1 Printed circuit board, its making method and relative equipment |
| 12/30/2009 | WO2009155794A1 A multilayer circuit board and a manufacturing of the multilayer circuit board |
| 12/30/2009 | WO2009136414A9 Alternative means for conductor based short distance signal/data transfer |
| 12/30/2009 | EP2139305A1 Method for eliminating engraving defects of a metallic layer deposited on a flexible support |
| 12/30/2009 | EP2139009A1 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure |
| 12/30/2009 | EP2139007A1 Conductive ink for letterpress reverse printing |
| 12/30/2009 | EP2008021B1 Illuminator |
| 12/30/2009 | EP1719393B1 Printed circuit board |
| 12/30/2009 | EP1565789B1 Photosensitive resin composition comprising a halogen-free colorant |
| 12/30/2009 | EP1435020B1 Aqueous developable photoimageable thick film compositions |
| 12/30/2009 | EP1266923B1 Polyester film as support for dry film resist |
| 12/30/2009 | EP1030544B1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| 12/30/2009 | CN201374874Y Printed circuit board |
| 12/30/2009 | CN201374873Y Mould structure for ball mounting machine |
| 12/30/2009 | CN201374872Y Manufacturing device with automatic burnout circuit |
| 12/30/2009 | CN201374869Y Circuit board and system for forming a plurality of solid conductive columns on circuit substrate |
| 12/30/2009 | CN201371196Y Printed circuit board perforating machine |
| 12/30/2009 | CN101617575A Flexible multilayer wiring board |
| 12/30/2009 | CN101617574A Capacitively coupling layers of a multilayer device |
| 12/30/2009 | CN101616551A Circuit board and process thereof |
| 12/30/2009 | CN101616550A Repair apparatus and repair method |
| 12/30/2009 | CN101616549A Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
| 12/30/2009 | CN101616548A Miniature multifunctional plating-making machine |
| 12/30/2009 | CN101616547A Automatic board-launching system and baseplate-launching method |
| 12/30/2009 | CN101616546A Bearing platform |
| 12/30/2009 | CN101616545A Leveling device for circuit board and method for leveling and welding |
| 12/30/2009 | CN101612694A Solder, and mounted components using the same |
| 12/30/2009 | CN100576980C Method for forming wiring on insulating resin layer |
| 12/30/2009 | CN100576979C Printed circuit board and manufacturing method thereof |
| 12/30/2009 | CN100576978C Method for producing porous resin substrate having hole bored therethrough and porous resin substrate provided with hole having inner wall surface imparted with electroconductivity |
| 12/30/2009 | CN100576977C Bare chip embedded PCB and method of the same |
| 12/30/2009 | CN100576976C Production method for circuit board directly embedded in passive component |
| 12/30/2009 | CN100576975C Film pattern forming method and application of the same |
| 12/30/2009 | CN100576974C Multilayer body and its manufacture method, a circuit, linear polarizer, safety element and safety file |
| 12/30/2009 | CN100576973C Etching device and etching method |
| 12/30/2009 | CN100576972C Method for preparing location hole of flexible circuit board |
| 12/30/2009 | CN100576971C Non-conductor electroplating method for independent soldering pad |
| 12/30/2009 | CN100576970C Method for forming electric conductor pattern on receiving substrate |
| 12/30/2009 | CN100576969C Production method of flexible circuit board |
| 12/30/2009 | CN100576967C Circuit board and liquid discharging apparatus |
| 12/30/2009 | CN100576962C Warming apparatus with heater produced by PCB |
| 12/30/2009 | CN100576532C Structure of semiconductor element embedding in carrier plate and its manufacture method |
| 12/30/2009 | CN100576483C Unmolded package for a semiconductor device |
| 12/30/2009 | CN100576387C Accumulator unit for plane mounting |
| 12/30/2009 | CN100576380C Ceramic electronic part, coating method and device |
| 12/30/2009 | CN100576379C Method of forming sheet having foreign material portions used for forming multilayer wiring board and sheet having foreign portion |
| 12/30/2009 | CN100576074C Photosensitive resin composition, photosensitive elements using photosensitive resin composition, process for forming resist patterns with the same, and process for production of printed wiring boards |