| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/30/2009 | CN100575401C Brown oxide pretreatment composition, and method for improving adhesion of polyimide surface |
| 12/30/2009 | CN100575085C Methods and apparatus for changing web material in a stencil printer |
| 12/29/2009 | US7639860 Substrate inspection device |
| 12/29/2009 | US7639338 LCD device having external terminals |
| 12/29/2009 | US7639184 Method for forming radio frequency antenna |
| 12/29/2009 | US7639160 Railway beacon and related production method |
| 12/29/2009 | US7638715 Printed circuit board and manufacturing method therefor |
| 12/29/2009 | US7638419 Method of fabricating a via attached to a bond pad utilizing a tapered interconnect |
| 12/29/2009 | US7637415 Methods and apparatus for assembling a printed circuit board |
| 12/29/2009 | US7637412 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 12/29/2009 | US7637008 Methods for manufacturing imprinted substrates |
| 12/29/2009 | US7637006 Beam assembly method for large area array multi-beam DUT probe cards |
| 12/29/2009 | US7637004 Electronic device manufacturing method and supporter |
| 12/29/2009 | CA2316750C Oligomer for media to entrap microorganism, oligomer-polymerized hydrous gel, and oligomer-polymerized hydrous gel entrapping microorganism |
| 12/24/2009 | US20090318710 Process for the purification of thiophenes |
| 12/24/2009 | US20090318323 Solvent compositions containing chlorofloroolefins or fluoroolefins |
| 12/24/2009 | US20090316408 Methods and Apparatus for LED Lighting with Heat Spreading in Illumintion Gaps |
| 12/24/2009 | US20090316378 Wafer level edge stacking |
| 12/24/2009 | US20090316375 Electronic circuit board including surface mount device |
| 12/24/2009 | US20090316373 PCB having chips embedded therein and method of manfacturing the same |
| 12/24/2009 | US20090316370 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods |
| 12/24/2009 | US20090316357 Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method |
| 12/24/2009 | US20090316300 Printed circuit board and method of manufacturing the same |
| 12/24/2009 | US20090315859 Capacitive touch panel and fabricating method thereof |
| 12/24/2009 | US20090314634 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function and their manufacturing methods |
| 12/24/2009 | US20090314539 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods |
| 12/24/2009 | US20090314538 Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
| 12/24/2009 | US20090314537 Conductive connecting pin and package substrate |
| 12/24/2009 | US20090314533 Adhesive for bonding circuit members, circuit board and process for its production |
| 12/24/2009 | US20090314525 Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation |
| 12/24/2009 | US20090314521 Method for Producing Parts for Passive Electronic Components and Parts Produced |
| 12/24/2009 | US20090314519 Direct layer laser lamination for electrical bump substrates, and processes of making same |
| 12/24/2009 | US20090314411 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods |
| 12/24/2009 | US20090313819 Methods for Manufacturing a Panel of Electronic Component Protection Devices |
| 12/24/2009 | DE10297451B4 Laser-Materialverarbeitungsvorrichtung Laser material processing apparatus |
| 12/24/2009 | DE10230117B4 Piezoelektrisches Mehrschichtbauelement und Verfahren zum Herstellen desselben und Verwendung desselben in einem piezoelektrischen Betätigungsglied A multilayer piezoelectric device and method for producing the same and use thereof in a piezoelectric actuator |
| 12/24/2009 | DE102008028300A1 Leiterplatte mit flexiblem Bereich und Verfahren zur Herstellung Printed circuit board with a flexible area and methods of making |
| 12/24/2009 | DE102008002532A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
| 12/23/2009 | WO2009154335A1 Printed circuit board electrically connected to the ground of electronic device |
| 12/23/2009 | WO2009154295A1 Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate |
| 12/23/2009 | WO2009154225A1 Automatic soldering equipment |
| 12/23/2009 | WO2009154066A1 Copper foil for printed circuit board and copper clad laminate plate for printed circuit board |
| 12/23/2009 | WO2009153835A1 Circuit board, semiconductor device, and their manufacturing method |
| 12/23/2009 | WO2009153647A1 Wire harness and production method therefor |
| 12/23/2009 | WO2009134009A3 Electroplating substrate containing metal catalyst layer and metal seed layer, and method for producing printed circuit board using the same |
| 12/23/2009 | WO2009113797A9 Production method for a circuit board using a gas column |
| 12/23/2009 | WO2008133369A9 The manufacturing method of the thin film ceramic multi layer substrate |
| 12/23/2009 | EP2136610A1 Multilayer wiring board and its manufacturing method |
| 12/23/2009 | EP2136609A1 Device for assembling components with metal welding studs |
| 12/23/2009 | EP2136401A1 Process and apparatus for tri-dimensional interconnection of electronic devices |
| 12/23/2009 | EP2135987A1 Process for the deposition of sensors on a porous substrate |
| 12/23/2009 | EP2135494A1 Panel devices comprising electric circuit boards and method for the production thereof |
| 12/23/2009 | EP2135273A2 Sealed light emitting diode assemblies and methods of making same |
| 12/23/2009 | EP1980143B1 Printed circuit board with additional functional elements, method of production and use |
| 12/23/2009 | EP1913801B1 Method of manufacturing pattern-forming metal structures on a carrier substrate |
| 12/23/2009 | CN201369894Y PCB clamp |
| 12/23/2009 | CN201369882Y Vacuum hole and bubble breakage device |
| 12/23/2009 | CN201369881Y Solder mask exposure device for printed circuit board |
| 12/23/2009 | CN201369880Y Pad pasting device for resisting solder and shielding circuit board partially and solder resisting transfer film |
| 12/23/2009 | CN201369879Y Manufacturing frock of arc-shaped circuit board |
| 12/23/2009 | CN201369878Y Bearing plate device |
| 12/23/2009 | CN201369877Y Installing structure of common mode inductors on embedded type PCB |
| 12/23/2009 | CN201369875Y Complete distribution structure of printed circuit board |
| 12/23/2009 | CN201369874Y Complete typesetting structure of printed circuit board |
| 12/23/2009 | CN201366726Y PCB bevel edge manufacture device |
| 12/23/2009 | CN201366725Y PCB bevel edge manufacture device |
| 12/23/2009 | CN201366530Y Panel positioning device for printed circuit board drilling machine |
| 12/23/2009 | CN101611660A Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film |
| 12/23/2009 | CN101611659A Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
| 12/23/2009 | CN101611657A Production process of printed circuits on which electronic components without leading wire are soldered. |
| 12/23/2009 | CN101611490A Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
| 12/23/2009 | CN101611066A Improved epoxy compositions |
| 12/23/2009 | CN101610895A Method and apparatus for making partially coated products |
| 12/23/2009 | CN101610646A Electrical connection structure as well as technology and circuit board structure thereof |
| 12/23/2009 | CN101610645A Method for manufacturing flexible-rigid plate |
| 12/23/2009 | CN101610644A Surface plating technology of circuit base plate |
| 12/23/2009 | CN101610643A Method for processing blind hole by laser |
| 12/23/2009 | CN101610642A Cutting method of copper-clad substrate |
| 12/23/2009 | CN101610641A Wet process system and wet processing method |
| 12/23/2009 | CN101610640A Method for transplanting and maintaining finished printed circuit board product with multiple types |
| 12/23/2009 | CN101610639A Multidirectional separated scalable interconnected mother board |
| 12/23/2009 | CN101610635A Circuit board structure and technology thereof |
| 12/23/2009 | CN101609926A Ultrahigh frequency electronic tags adopting separated antennae and manufacturing method thereof |
| 12/23/2009 | CN101609925A Paper antenna |
| 12/23/2009 | CN101609923A Design method for precisely realizing electric property of high frequency antenna |
| 12/23/2009 | CN101609920A Method for manufacturing radio-frequency identification antenna |
| 12/23/2009 | CN101608053A Thermosetting resin composition |
| 12/23/2009 | CN101607334A Tin wave generator and tin furnace device |
| 12/23/2009 | CN101607150A Device and method for reducing foam |
| 12/23/2009 | CN100574581C A socket for a microelectronic component having reduced electrical resistance and inductance |
| 12/23/2009 | CN100574575C Presetting positioning fusion process for inner central layer of printed circuit board |
| 12/23/2009 | CN100574574C A production technology for double-side lamp belt circuit board |
| 12/23/2009 | CN100574573C Multi-layer printed circuit board and method for manufacturing same |
| 12/23/2009 | CN100574572C Printed circuit board manufacturing method, printed circuit board, and electronic apparatus |
| 12/23/2009 | CN100574571C Circuit board with conductive structures and manufacturing method thereof |
| 12/23/2009 | CN100574570C Method for providing non-standard wideth range for improved circuit card wiring |
| 12/23/2009 | CN100574569C Production method of circuit board having long and short golden finger |
| 12/23/2009 | CN100574568C Ultra-roughening treating agent for cuprum surface |
| 12/23/2009 | CN100574567C Method of soldering wiring members by laser beam irradiation |
| 12/23/2009 | CN100574566C Soldering method and solder joint member |