Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2010
01/13/2010CN101626663A Method for preparing second-order laser blind hole by UV, acid etching and CO2
01/13/2010CN101626662A Process for removing flash of half PTH hole by dry film etching method
01/13/2010CN101626661A Method for manufacturing double-side hollowed-out plates
01/13/2010CN101626660A Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures
01/13/2010CN101626659A Preferential via system for differential signal circuit of circuit board
01/13/2010CN100581326C Multilayer printed wiring board and method for manufacturing same
01/13/2010CN100581325C Laminated circuit substrate
01/13/2010CN100581324C Circuit board and welding method thereof
01/13/2010CN100581323C Station transplantation device of multi-gang circuit board
01/13/2010CN100581322C Method of welding varnished wire and plated circuit soft plate in electronic component
01/13/2010CN100581321C Manufacture of digitizer surface
01/13/2010CN100581320C Method for making PCB panel
01/13/2010CN100581319C Printed circuit board assembly and method of producing the same
01/13/2010CN100581314C Stereo graphic pattern structure of circuit board and technique thereof
01/13/2010CN100580896C Bonding sheet sticking equipment and method
01/13/2010CN100580825C Ultra-thin flexible inductor
01/13/2010CN100580559C Method for maximizing output capacity in scanning system
01/13/2010CN100580555C Alkaline developable resin composition
01/13/2010CN100579891C Method for forming microelectronic spring structures on substrate
01/12/2010US7646595 Computing device
01/12/2010US7645940 Substrate with via and pad structures
01/12/2010US7644853 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
01/12/2010US7644497 Component built-in wiring board and manufacturing method of component built-in wiring board
01/12/2010US7644496 Manufacturing method for imprinting stamper
01/12/2010CA2297447C Method for roughening copper surfaces for bonding to substrates
01/07/2010WO2010002519A1 Method of forming a patterned substrate
01/07/2010WO2010002252A1 Method of providing conductive structures in a multi-foil system and multifoil system comprising same
01/07/2010WO2010001715A1 Wiring forming method
01/07/2010WO2010001597A1 Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device
01/07/2010WO2010001554A1 Electronic circuit component and method for manufacturing same
01/07/2010WO2010001448A1 Flexible circuit board module and its manufacturing method
01/07/2010WO2010001300A1 A support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device
01/07/2010WO2010001208A2 Plated member and method of forming plating layer
01/07/2010WO2009055116A3 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
01/07/2010WO2009047641A3 Method and apparatus for pcb finishing processes
01/07/2010WO2005122731A3 Method to form a conductive structure
01/07/2010US20100003539 Plated article having metal thin film formed by electroless plating, and manufacturing method thereof
01/07/2010US20100002986 Suspension board with circuit and producing method thereof
01/07/2010US20100002985 Suspension board with circuit and producing method thereof
01/07/2010US20100002404 Display device and method of manufacturing the same
01/07/2010US20100002401 Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same
01/07/2010US20100001081 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
01/07/2010US20100000774 Suspension board with circuit and producing method thereof
01/07/2010US20100000772 Electronic package having down-set leads and method
01/07/2010US20100000768 Lead-embedded metallized ceramics substrate and package
01/07/2010US20100000766 Printed circuit board assembly
01/07/2010US20100000765 Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
01/07/2010US20100000324 Acceleration sensor and method of fabricating it
01/07/2010US20100000322 Angular velocity sensor and method of manufacturing the same
01/07/2010US20100000087 Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board
01/07/2010US20100000086 Method of making a molded interconnect device
01/07/2010US20100000085 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
01/07/2010US20100000084 Chip mounter and method for recognizing bga package through chip mounter
01/07/2010US20100000083 Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
01/07/2010US20100000076 Manufacturing method for a wireless communication device and manufacturing apparatus
01/07/2010DE112007002911T5 Gedruckte elektronische Vorrichtung und Verfahren zum Bestimmen ihrer elektrischen Größe Printed electronic device and method for determining their electrical size
01/07/2010DE102009031015A1 Klebstoffschicht bildende Flüssigkeit Adhesive layer forming liquid
01/07/2010DE102009025267A1 Elektronische Schaltkreiskarte mit Bauelementen für Oberflächenbestückung Electronic circuit board with components for surface mounting
01/07/2010DE102008038302A1 System-in-Package Modul und dieses umfassendes mobiles Endgerät System-in-Package module and this comprehensive mobile device
01/07/2010DE102008031788A1 Operating device i.e. ballast, for LED lamp, has auxiliary body arranged on interconnect device and made of electrically insulating material, where connection terminals are arranged on auxiliary body
01/07/2010DE102006044369B4 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity
01/06/2010EP2141973A1 Method of providing conductive structures in a multi-foil system and multi-foil system comprising same
01/06/2010EP2141972A1 Component-incorporating module and its manufacturing method
01/06/2010EP2141971A1 Multilayer printed wiring board and method for manufacturing the same
01/06/2010EP2141808A2 Electronic device having touch sensor film
01/06/2010EP2140963A1 Pb-free solder-connected electronic article
01/06/2010EP2140744A1 Method and device for applying media to flat substrates
01/06/2010EP2140743A1 Electrically conductive composition for via-holes
01/06/2010EP2139686A1 Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production
01/06/2010EP1707037B1 Method for the production of a circuit board element and circuit board element
01/06/2010EP1413178B1 Card manufacturing technique and resulting card
01/06/2010CN201378909Y Shielding clamp of shielding box for printed circuit board
01/06/2010CN201378872Y Condenser microphone device
01/06/2010CN201376130Y Solder machine nozzle
01/06/2010CN101622916A Film for metal film transfer, method for transferring metal film and method for manufacturing circuit board
01/06/2010CN101622915A Method for fabricating electrical circuitry on ultra-thin plastic films
01/06/2010CN101621896A Printed wiring board and method for manufacturing the same
01/06/2010CN101621895A Manufacture method of soft circuit board
01/06/2010CN101621894A Printed circuit board (PCB) assembly method and printed circuit board preformed product
01/06/2010CN101621893A Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board
01/06/2010CN100579354C Positioning method and device for flexble printed circuit wiring plate relative cramping means
01/06/2010CN100579353C High speed full-automatic paster machine array type mounting head
01/06/2010CN100579339C Making method for circuit board and method for reducing electrode joint thickness of circuit board embedded element
01/06/2010CN100579338C Circuitized substrate assembly and method of making same
01/06/2010CN100579337C Mounting structure
01/06/2010CN100579336C Method of forming metal wiring and method of manufacturing active matrix substrate
01/06/2010CN100579335C Printing device and use method thereof
01/06/2010CN100579334C Making process of the circuit board for preventing etchant etching aluminum base board
01/06/2010CN100579333C Member for circuit board, method for manufacturing circuit board, and apparatus for manufacturing circuit board
01/06/2010CN100579332C Circuit board, member for circuit board and production method therefor and method of laminating fexible film
01/06/2010CN100579330C Technique for accommodating electronic components on a multilayer signal routing device
01/06/2010CN100578778C Electronic device
01/06/2010CN100578774C Interconnect module with reduced power distribution impedance and manufacturing method thereof
01/06/2010CN100578762C Circuit device and mixing integrated circuit device
01/06/2010CN100578685C Conductive paste and multilayer printed wiring board using same
01/06/2010CN100578299C Module for manufacturing display device, method of manufacturing the same, and method of manufacturing display device
01/06/2010CN100577890C Method for improving uniformity of electrochemical plating films
01/06/2010CN100577853C Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus
01/06/2010CN100577810C Cooling stations for use in a web printing process for the manufacture of electrochemical sensors
01/06/2010CN100577542C Super long film conveying device and method