Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/13/2010 | CN101626663A Method for preparing second-order laser blind hole by UV, acid etching and CO2 |
01/13/2010 | CN101626662A Process for removing flash of half PTH hole by dry film etching method |
01/13/2010 | CN101626661A Method for manufacturing double-side hollowed-out plates |
01/13/2010 | CN101626660A Process for attaching and pressing copper surfaces of multilayer plates with asymmetrical structures |
01/13/2010 | CN101626659A Preferential via system for differential signal circuit of circuit board |
01/13/2010 | CN100581326C Multilayer printed wiring board and method for manufacturing same |
01/13/2010 | CN100581325C Laminated circuit substrate |
01/13/2010 | CN100581324C Circuit board and welding method thereof |
01/13/2010 | CN100581323C Station transplantation device of multi-gang circuit board |
01/13/2010 | CN100581322C Method of welding varnished wire and plated circuit soft plate in electronic component |
01/13/2010 | CN100581321C Manufacture of digitizer surface |
01/13/2010 | CN100581320C Method for making PCB panel |
01/13/2010 | CN100581319C Printed circuit board assembly and method of producing the same |
01/13/2010 | CN100581314C Stereo graphic pattern structure of circuit board and technique thereof |
01/13/2010 | CN100580896C Bonding sheet sticking equipment and method |
01/13/2010 | CN100580825C Ultra-thin flexible inductor |
01/13/2010 | CN100580559C Method for maximizing output capacity in scanning system |
01/13/2010 | CN100580555C Alkaline developable resin composition |
01/13/2010 | CN100579891C Method for forming microelectronic spring structures on substrate |
01/12/2010 | US7646595 Computing device |
01/12/2010 | US7645940 Substrate with via and pad structures |
01/12/2010 | US7644853 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
01/12/2010 | US7644497 Component built-in wiring board and manufacturing method of component built-in wiring board |
01/12/2010 | US7644496 Manufacturing method for imprinting stamper |
01/12/2010 | CA2297447C Method for roughening copper surfaces for bonding to substrates |
01/07/2010 | WO2010002519A1 Method of forming a patterned substrate |
01/07/2010 | WO2010002252A1 Method of providing conductive structures in a multi-foil system and multifoil system comprising same |
01/07/2010 | WO2010001715A1 Wiring forming method |
01/07/2010 | WO2010001597A1 Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
01/07/2010 | WO2010001554A1 Electronic circuit component and method for manufacturing same |
01/07/2010 | WO2010001448A1 Flexible circuit board module and its manufacturing method |
01/07/2010 | WO2010001300A1 A support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device |
01/07/2010 | WO2010001208A2 Plated member and method of forming plating layer |
01/07/2010 | WO2009055116A3 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating |
01/07/2010 | WO2009047641A3 Method and apparatus for pcb finishing processes |
01/07/2010 | WO2005122731A3 Method to form a conductive structure |
01/07/2010 | US20100003539 Plated article having metal thin film formed by electroless plating, and manufacturing method thereof |
01/07/2010 | US20100002986 Suspension board with circuit and producing method thereof |
01/07/2010 | US20100002985 Suspension board with circuit and producing method thereof |
01/07/2010 | US20100002404 Display device and method of manufacturing the same |
01/07/2010 | US20100002401 Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same |
01/07/2010 | US20100001081 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
01/07/2010 | US20100000774 Suspension board with circuit and producing method thereof |
01/07/2010 | US20100000772 Electronic package having down-set leads and method |
01/07/2010 | US20100000768 Lead-embedded metallized ceramics substrate and package |
01/07/2010 | US20100000766 Printed circuit board assembly |
01/07/2010 | US20100000765 Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel |
01/07/2010 | US20100000324 Acceleration sensor and method of fabricating it |
01/07/2010 | US20100000322 Angular velocity sensor and method of manufacturing the same |
01/07/2010 | US20100000087 Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board |
01/07/2010 | US20100000086 Method of making a molded interconnect device |
01/07/2010 | US20100000085 Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries |
01/07/2010 | US20100000084 Chip mounter and method for recognizing bga package through chip mounter |
01/07/2010 | US20100000083 Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit |
01/07/2010 | US20100000076 Manufacturing method for a wireless communication device and manufacturing apparatus |
01/07/2010 | DE112007002911T5 Gedruckte elektronische Vorrichtung und Verfahren zum Bestimmen ihrer elektrischen Größe Printed electronic device and method for determining their electrical size |
01/07/2010 | DE102009031015A1 Klebstoffschicht bildende Flüssigkeit Adhesive layer forming liquid |
01/07/2010 | DE102009025267A1 Elektronische Schaltkreiskarte mit Bauelementen für Oberflächenbestückung Electronic circuit board with components for surface mounting |
01/07/2010 | DE102008038302A1 System-in-Package Modul und dieses umfassendes mobiles Endgerät System-in-Package module and this comprehensive mobile device |
01/07/2010 | DE102008031788A1 Operating device i.e. ballast, for LED lamp, has auxiliary body arranged on interconnect device and made of electrically insulating material, where connection terminals are arranged on auxiliary body |
01/07/2010 | DE102006044369B4 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity |
01/06/2010 | EP2141973A1 Method of providing conductive structures in a multi-foil system and multi-foil system comprising same |
01/06/2010 | EP2141972A1 Component-incorporating module and its manufacturing method |
01/06/2010 | EP2141971A1 Multilayer printed wiring board and method for manufacturing the same |
01/06/2010 | EP2141808A2 Electronic device having touch sensor film |
01/06/2010 | EP2140963A1 Pb-free solder-connected electronic article |
01/06/2010 | EP2140744A1 Method and device for applying media to flat substrates |
01/06/2010 | EP2140743A1 Electrically conductive composition for via-holes |
01/06/2010 | EP2139686A1 Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production |
01/06/2010 | EP1707037B1 Method for the production of a circuit board element and circuit board element |
01/06/2010 | EP1413178B1 Card manufacturing technique and resulting card |
01/06/2010 | CN201378909Y Shielding clamp of shielding box for printed circuit board |
01/06/2010 | CN201378872Y Condenser microphone device |
01/06/2010 | CN201376130Y Solder machine nozzle |
01/06/2010 | CN101622916A Film for metal film transfer, method for transferring metal film and method for manufacturing circuit board |
01/06/2010 | CN101622915A Method for fabricating electrical circuitry on ultra-thin plastic films |
01/06/2010 | CN101621896A Printed wiring board and method for manufacturing the same |
01/06/2010 | CN101621895A Manufacture method of soft circuit board |
01/06/2010 | CN101621894A Printed circuit board (PCB) assembly method and printed circuit board preformed product |
01/06/2010 | CN101621893A Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board |
01/06/2010 | CN100579354C Positioning method and device for flexble printed circuit wiring plate relative cramping means |
01/06/2010 | CN100579353C High speed full-automatic paster machine array type mounting head |
01/06/2010 | CN100579339C Making method for circuit board and method for reducing electrode joint thickness of circuit board embedded element |
01/06/2010 | CN100579338C Circuitized substrate assembly and method of making same |
01/06/2010 | CN100579337C Mounting structure |
01/06/2010 | CN100579336C Method of forming metal wiring and method of manufacturing active matrix substrate |
01/06/2010 | CN100579335C Printing device and use method thereof |
01/06/2010 | CN100579334C Making process of the circuit board for preventing etchant etching aluminum base board |
01/06/2010 | CN100579333C Member for circuit board, method for manufacturing circuit board, and apparatus for manufacturing circuit board |
01/06/2010 | CN100579332C Circuit board, member for circuit board and production method therefor and method of laminating fexible film |
01/06/2010 | CN100579330C Technique for accommodating electronic components on a multilayer signal routing device |
01/06/2010 | CN100578778C Electronic device |
01/06/2010 | CN100578774C Interconnect module with reduced power distribution impedance and manufacturing method thereof |
01/06/2010 | CN100578762C Circuit device and mixing integrated circuit device |
01/06/2010 | CN100578685C Conductive paste and multilayer printed wiring board using same |
01/06/2010 | CN100578299C Module for manufacturing display device, method of manufacturing the same, and method of manufacturing display device |
01/06/2010 | CN100577890C Method for improving uniformity of electrochemical plating films |
01/06/2010 | CN100577853C Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus |
01/06/2010 | CN100577810C Cooling stations for use in a web printing process for the manufacture of electrochemical sensors |
01/06/2010 | CN100577542C Super long film conveying device and method |