| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/21/2010 | DE10340069B4 Oberflächenbefestigbare Elektronikvorrichtung Surface mount electronic device |
| 01/21/2010 | DE102008033205A1 Component holder for fixing electrolytic capacitor at printed circuit board, has frame defining accommodating chamber for accommodating electronic component, and recesses displaceably arranged against each other in axial direction |
| 01/21/2010 | CA2725766A1 Device for the thermal treatment of workpieces |
| 01/20/2010 | EP2146561A1 Flexible film and display device including the same |
| 01/20/2010 | EP2146560A1 Method for Fabricating Printed Circuit Board |
| 01/20/2010 | EP2146559A1 A method of forming a high density structure |
| 01/20/2010 | EP2146558A2 Attachment assembly for a safety module and use of a screw for attaching a safety module |
| 01/20/2010 | EP2144755A1 Method and apparatus for adjusting a substrate support |
| 01/20/2010 | EP1641081B1 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 01/20/2010 | EP1257682B1 Laser deposition process |
| 01/20/2010 | CN201388345Y Structure of PCB silk-screen nail bed |
| 01/20/2010 | CN201388344Y Tin spraying fixture of vertical tin-spraying machine |
| 01/20/2010 | CN201388342Y Resonant cavity integrated on PCB |
| 01/20/2010 | CN201387209Y Dewatering device of flexible printed circuit |
| 01/20/2010 | CN201386136Y Concentration control device of flexible circuit board etching liquid |
| 01/20/2010 | CN101631434A Method of interlamination conduction of printed circuit boards |
| 01/20/2010 | CN101631433A Implementation method of printing thick copper foil in PCB |
| 01/20/2010 | CN101631432A Flexible-rigid compound circuit board and method for manufacturing same |
| 01/20/2010 | CN101631431A Soft-hard plate structure and manufacturing method thereof |
| 01/20/2010 | CN101631430A Circuit board group and electronic device |
| 01/20/2010 | CN101631429A Circuit board |
| 01/20/2010 | CN101631428A Method and device for connecting optical transceiving device with printed circuit board (PCB) |
| 01/20/2010 | CN101631427A Method for plating thick gold layer in circuit board manufacturing process |
| 01/20/2010 | CN101631426A Layout method for element |
| 01/20/2010 | CN101631423A Multi-layer printed board |
| 01/20/2010 | CN100584185C Circuit board working unit support apparatus |
| 01/20/2010 | CN100584156C Circuit board and its making method |
| 01/20/2010 | CN100584155C Manufacture process for substrate of internally embedded element |
| 01/20/2010 | CN100584154C Wave soldering bath |
| 01/20/2010 | CN100584153C Electronic device and method of manufacturing the same |
| 01/20/2010 | CN100584152C Manufacturing method of electronic device |
| 01/20/2010 | CN100584151C Manufacturing installation of substrate for element mounting |
| 01/20/2010 | CN100584150C Multilayer printed wiring board |
| 01/20/2010 | CN100584147C Soft circuit board and its making method |
| 01/20/2010 | CN100584146C Multilayer ceramic substrate and production method thereof |
| 01/20/2010 | CN100584144C A passive base board for the switch power module and its making method |
| 01/20/2010 | CN100583423C Multilayered wiring substrate and method of manufacturing the same |
| 01/20/2010 | CN100583401C Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 01/20/2010 | CN100583133C Polymeric film substrate for use in radio-frequency responsive tags |
| 01/20/2010 | CN100582318C Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations |
| 01/20/2010 | CN100582317C Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 01/20/2010 | CN100581817C Screen printing apparatus and screen printing method |
| 01/20/2010 | CN100581660C Structure for mounting multi-featured vibration actuator on circuit board |
| 01/19/2010 | US7649252 Ceramic multilayer substrate |
| 01/19/2010 | US7649145 Compliant spring contact structures |
| 01/19/2010 | US7648821 Method of forming flexible electronic circuits |
| 01/19/2010 | US7648770 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet |
| 01/19/2010 | US7648369 Interposer with electrical contact button and method |
| 01/19/2010 | US7647695 Method of matching harnesses of conductors with apertures in connectors |
| 01/19/2010 | US7647694 Method for mounting electronic component |
| 01/19/2010 | US7647691 Method of producing antenna elements for a wireless communication device |
| 01/14/2010 | WO2010004983A1 Micro-ball removal method and removal device, and micro-ball batch mounting method and batch mounting device |
| 01/14/2010 | WO2010004929A1 Interlayer connecting member for multilayer printed wiring board, method for manufacturing the interlayer connecting member, multilayer printed wiring board, and method for manufacturing the multilayer printed wiring board |
| 01/14/2010 | WO2010004914A1 Critical flaw detecting method |
| 01/14/2010 | WO2010004856A1 Catalyst-imparting liquid for palladium plating |
| 01/14/2010 | WO2010004841A1 Printed wiring board and method for manufacturing same |
| 01/14/2010 | WO2010003542A1 Extensible nonwoven with conductor structures |
| 01/14/2010 | WO2009141145A4 Digital television receiver |
| 01/14/2010 | WO2009083487A3 Method for obtaining a metal microstructure and microstructure obtained according to said method |
| 01/14/2010 | WO2003071378A9 High capacity memory module with built-in performance enhancing features |
| 01/14/2010 | US20100011223 Method for making smart cards capable of operating with and without contact |
| 01/14/2010 | US20100009471 Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device |
| 01/14/2010 | US20100009173 Compositions and methods for creating electronic circuitry |
| 01/14/2010 | US20100009070 Method for forming solder layer on printed-wiring board and slurry discharge device |
| 01/14/2010 | US20100009068 Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors |
| 01/14/2010 | US20100008093 Fixture for Securing Optoelectronic Packages for Wire and/or Component Bonding |
| 01/14/2010 | US20100008056 Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| 01/14/2010 | US20100007012 Electronic system modules |
| 01/14/2010 | US20100006988 Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging |
| 01/14/2010 | US20100006653 System comprised of a chip and a substrate and method of assembling such a system |
| 01/14/2010 | US20100006452 Biosensor Apparatus and Methods of Use |
| 01/14/2010 | US20100006446 Method for manufacturing package on package with cavity |
| 01/14/2010 | US20100006334 Printed wiring board and method for manufacturing the same |
| 01/14/2010 | US20100006331 Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same |
| 01/14/2010 | US20100006329 Sealing material and mounting method using the sealing material |
| 01/14/2010 | US20100006328 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 01/14/2010 | US20100006325 Printed wiring board |
| 01/14/2010 | US20100005654 Planarization Methods |
| 01/14/2010 | US20100005653 Circuit Apparatus and Method of Fabricating the Apparatus |
| 01/14/2010 | US20100005652 Method of manufacturing a wiring substrate, method of manufacturing a tape package and method of manufacturing a display device |
| 01/14/2010 | US20100005651 Conductive elastomeric and mechanical pin and contact system |
| 01/14/2010 | US20100005647 Method of manufacturing an inlet member for an electronic tag |
| 01/14/2010 | DE102009031494A1 Härtbare Kunstharzzusammensetzung, halogenfreies Kunstharzsubstrat und halogenfreie zusammengesetzte gedruckte Leiterplatte The curable resin composition, halogen-free resin substrate and halogen-free composite printed circuit board |
| 01/14/2010 | DE102008031633A1 Arrangement for mounting an electric component on a carrier such as printed circuit board, where the carrier comprises a contact surface for electrically contacting a connection of the component |
| 01/14/2010 | DE102006034600B4 Verfahren zur Herstellung einer Lötverbindung A process for producing a solder joint |
| 01/13/2010 | EP2144283A1 Method of transferring adhesive film |
| 01/13/2010 | EP2143311A1 Non-planar circuit board and a method for fabricating the same |
| 01/13/2010 | EP2143310A1 Method for the selective surface treatment of non-flat workpieces |
| 01/13/2010 | EP2142485A1 Metallic surface enhancement |
| 01/13/2010 | EP1811824B1 Multilayer printed wiring board and process for producing the same |
| 01/13/2010 | EP1542266B1 Semiconductor abrasive, process for producing the same and method of polishing |
| 01/13/2010 | EP1378025B1 Circuit board connector |
| 01/13/2010 | CN201383903Y Processing table equipment and lifting equipment thereof |
| 01/13/2010 | CN201383901Y Buried hole type circuit board |
| 01/13/2010 | CN201383900Y 盲孔型线路板 Blind Hole board |
| 01/13/2010 | CN101627668A Use of silane compositions for the production of mutilayer laminates |
| 01/13/2010 | CN101627667A Process for producing circuit board |
| 01/13/2010 | CN101626666A Process flow for filling holes with resin after circuit etching |
| 01/13/2010 | CN101626665A Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board |
| 01/13/2010 | CN101626664A Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |