| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/28/2010 | US20100018757 Printed circuit board (PCB) with slot for pass through terminal (PTT), method of drilling a slot in a printed circuit board and printed circuit board assembly with slot and pass through terminal |
| 01/28/2010 | US20100018754 Flexible printed circuit layout and method thereof |
| 01/28/2010 | US20100018634 Flex-rigid wiring board and method of manufacturing the same |
| 01/28/2010 | US20100018052 Method of manufacturing printed circuit board for optical waveguide |
| 01/28/2010 | US20100018049 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 01/28/2010 | US20100018048 Connecting method of electronic component |
| 01/28/2010 | US20100018047 Surface mount package |
| 01/28/2010 | US20100018046 Method for the production of an identification carrier or electronic key for electronically actuated locks |
| 01/28/2010 | DE112008000853T5 Dekompressions-Heizgerät, Heizverfahren damit und Verfahren zur Herstellung eines Elektronikprodukts Decompression heater, thereby heating method and methods of manufacturing an electronic product |
| 01/28/2010 | DE112008000485T5 Platine und Herstellungsverfahren derselben Board and manufacturing method thereof |
| 01/28/2010 | DE102008040614A1 Kontaktierungsverfahren für substratbasierte Schaltungen und zugehörige Schaltungsanordnung Contacting method for substrate-based circuits and associated circuitry |
| 01/27/2010 | EP2148556A2 Noble metal connection and application method thereof |
| 01/27/2010 | EP2148393A1 Circuit-connecting material, and connection structure for circuit member |
| 01/27/2010 | EP2148365A2 Semiconductor device and manufacturing method thereof |
| 01/27/2010 | EP2148364A2 Contacting method for substrate-based switches and accompanying switch assembly |
| 01/27/2010 | EP2147740A1 Lead-free solder paste |
| 01/27/2010 | EP2147463A2 Connecting microsized devices using ablative films |
| 01/27/2010 | EP2147245A1 Lighting device, backlighting device, and display device |
| 01/27/2010 | CN201393345Y Carrier for processing procedure of flexible printed wiring board surface mounting technology |
| 01/27/2010 | CN201393344Y Double-sided insertion backplane and slot connector |
| 01/27/2010 | CN201392779Y Fuse electrical control panel manufacturing device |
| 01/27/2010 | CN201392705Y Conducting plate series connection and positioning structure for plane-type electromagnetic induction element |
| 01/27/2010 | CN101637070A Base-equipped insulating sheet, multi-layer printed circuit board, semiconductor device, and multi-layer printed circuit board manufacturing method |
| 01/27/2010 | CN101636046A Method for processing multilayer flexible circuit board |
| 01/27/2010 | CN101636045A Bearing plate for wave-soldering device |
| 01/27/2010 | CN101636044A Embedded type circuit structure and manufacturing method thereof |
| 01/27/2010 | CN101636043A Method for manufacturing electric conduction line |
| 01/27/2010 | CN101636042A Printed circuit board including embedded capacitor and method of fabricating same |
| 01/27/2010 | CN101636041A Substrate plane planarization system and method thereof |
| 01/27/2010 | CN100586260C Printed circuit board using bump and method for manufacturing thereof |
| 01/27/2010 | CN100586259C Method for manufacturing circuit board with differential break structure |
| 01/27/2010 | CN100586258C Method for soldering electronic component and soldering structure of electronic component |
| 01/27/2010 | CN100586257C Wiring board and wiring board module |
| 01/27/2010 | CN100586256C Ceramic substrate, electronic apparatus, and method for producing ceramic substrate |
| 01/27/2010 | CN100586255C Method for manufacturing printed circuit board using imprinting |
| 01/27/2010 | CN100586254C Printed circuit board printing system and method |
| 01/27/2010 | CN100586253C Package, package carrier and its manufacture method, diagosis equipment and its manufacture method |
| 01/27/2010 | CN100586252C Method of manufacturing circuit board with heat radiating function |
| 01/27/2010 | CN100586248C Anti-theft circuit and producing method |
| 01/27/2010 | CN100585823C Electronic component soldering structure and electronic component soldering method |
| 01/27/2010 | CN100585772C Method for filling vias with thick film paste using contact printing |
| 01/27/2010 | CN100585761C Surface mounting type part |
| 01/27/2010 | CN100585760C Electronic component mounting method and electronic component mounting structure |
| 01/27/2010 | CN100585392C Silk screen printing electrode and producing process, and sensor and detecting method |
| 01/27/2010 | CN100585274C 发光模块 The light emitting module |
| 01/27/2010 | CN100585022C Method for electroplating gold on surface of circuit board |
| 01/27/2010 | CN100584872C Latent curing agent and composition |
| 01/27/2010 | CN100584552C Punching machine |
| 01/26/2010 | US7652895 Electrically insulating body, and electronic device |
| 01/26/2010 | US7652381 Interconnect system without through-holes |
| 01/26/2010 | US7652292 Flexible electronic device and production method of the same |
| 01/26/2010 | US7652213 Internal conductor connection structure and multilayer substrate |
| 01/26/2010 | US7651940 Electronic part producing method and electronic part |
| 01/26/2010 | US7651783 Surface treated copper film |
| 01/26/2010 | US7651724 Sealing substrate, wafter; cost efficiency |
| 01/26/2010 | US7651382 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity |
| 01/26/2010 | US7650897 Nozzle arrangement |
| 01/26/2010 | US7650851 Nozzle for soldering apparatus |
| 01/26/2010 | US7650694 Method for forming multilayer substrate |
| 01/26/2010 | US7650693 Method of assembling electronic components of an electronic system, and system thus obtained |
| 01/26/2010 | US7650692 Method for mounting electronic-component module |
| 01/26/2010 | US7650691 Component supply head device and component mounting head device |
| 01/26/2010 | US7650683 Method of preparing an antenna |
| 01/21/2010 | WO2010008281A1 A method of forming a high density structure |
| 01/21/2010 | WO2010008138A2 Automatic mdf apparatus |
| 01/21/2010 | WO2010008085A1 Screen plate, interlayer insulation film, circuit board, active matrix circuit board, and image display apparatus |
| 01/21/2010 | WO2010008033A1 Wiring board, chip component mounting structure and chip component mounting method |
| 01/21/2010 | WO2010007969A1 Method for manufacturing module having built-in component, and module having built-in component |
| 01/21/2010 | WO2010007878A1 Multilayer ceramic substrate and method for manufacturing the same |
| 01/21/2010 | WO2010007817A1 Anisotropic conductive adhesive |
| 01/21/2010 | WO2010007736A1 Module with built-in component and method for manufacturing the module |
| 01/21/2010 | WO2010007715A1 Manufacturing method of a parts installation module |
| 01/21/2010 | WO2010007704A1 Flex-rigid wiring board and electronic device |
| 01/21/2010 | WO2010007405A1 Method for photoimaging a substrate |
| 01/21/2010 | WO2010006864A1 Electronic assembly and method for the production thereof |
| 01/21/2010 | WO2010006568A1 Device for the heat treatment of workpieces |
| 01/21/2010 | WO2009145462A3 Substrate for metal printed circuit board and method for manufacturing the substrate |
| 01/21/2010 | WO2009145461A3 Substrate for ceramic printed circuit board and method for manufacturing the substrate |
| 01/21/2010 | WO2009133969A3 Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 01/21/2010 | WO2009132061A3 Assembly method for implantable medical device |
| 01/21/2010 | WO2009129032A3 Electronic assemblies without solder and method for their design, prototyping, and manufacture |
| 01/21/2010 | US20100016039 Flexible printed board, electronic apparatus mounted with this, and folding method for flexible printed board |
| 01/21/2010 | US20100015440 Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways |
| 01/21/2010 | US20100014271 Capacitor material, production method of the same, and capacitor, wiring board and electronic device containing that material |
| 01/21/2010 | US20100014267 Circuit board device, electronic device provided with the same, and gnd connecting method |
| 01/21/2010 | US20100014261 Printed circuit board and method of manufacturing printed circuit board |
| 01/21/2010 | US20100014234 Light-Emitting Pixel Array Package And Method of Manufacturing The Same |
| 01/21/2010 | US20100014146 Encapsulation methods for interferometric modulator and mems devices |
| 01/21/2010 | US20100014035 Printed circuit board and method for manufacturing the same |
| 01/21/2010 | US20100012366 Wiring board having via and method forming a via in a wiring board |
| 01/21/2010 | US20100012365 Printed circuit board |
| 01/21/2010 | US20100012364 Method of manufacturing electronic component embedded circuit board |
| 01/21/2010 | US20100012361 Circuit obfuscation |
| 01/21/2010 | US20100012359 Article with a Coating of Electrically Conductive Polymer and Precious/Semiprecious Metal and Process for Production Thereof |
| 01/21/2010 | US20100012358 Circuit connecting material, connection structure for circuit member using the same and production method thereof |
| 01/21/2010 | US20100012357 Printed Circuit Board With Improved Via Design |
| 01/21/2010 | US20100011573 Method for fabricating printed circuit board |
| 01/21/2010 | US20100011572 Electronic component assembly, electric component with solder bump and process for producing the same |
| 01/21/2010 | DE202009015051U1 Dampfphasen-Lötanlage Vapor phase soldering |
| 01/21/2010 | DE112009000006T5 Verfahren zum Herstellen eines Keramiksubstrats und Keramiksubstrat A method of manufacturing a ceramic substrate, and ceramic substrate |