| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/10/2010 | CN101646310A Reflow soldering multi-segment type transmission method and device thereof |
| 02/10/2010 | CN101646309A Circuit board processing method |
| 02/10/2010 | CN101646308A Circuit compensation system of circuit board and method for circuit compensation thereby |
| 02/10/2010 | CN101646307A Method for manufacturing FPC and FPC |
| 02/10/2010 | CN101646306A Assembly circuit board replacing method of integrated substrate and the integrated substrate |
| 02/10/2010 | CN101646305A Method for manufacturing lead on non-conductor substrate |
| 02/10/2010 | CN101646304A Alignment method for printed circuit board |
| 02/10/2010 | CN101646303A Jig for plugging holes and process for plugging holes by using same |
| 02/10/2010 | CN100589684C Buried pattern substrate and manufacturing method thereof |
| 02/10/2010 | CN100589683C Production method for soft and hard combined printing circuit board |
| 02/10/2010 | CN100589682C Method for filling through hole |
| 02/10/2010 | CN100589680C Conductive paste and multilayer ceramic substrate |
| 02/10/2010 | CN100589121C Memory card with raised portion |
| 02/09/2010 | US7660643 Solder material test apparatus, and method of controlling the same |
| 02/09/2010 | US7659621 Solder structures for out of plane connections |
| 02/09/2010 | US7659604 Module component and method for manufacturing the same |
| 02/09/2010 | US7659194 High reliability multilayer circuit substrates and methods for their formation |
| 02/09/2010 | US7659148 Bonding method and apparatus |
| 02/09/2010 | US7658860 etching; surface treatment; water and oil repellent; ink jets |
| 02/09/2010 | US7658772 Creating network of channels on one surface of two substrates, coating substrates with one or more layers of materials, the coating extending over regions between channels and into channels, contacting surfaces and applying pressure causing surface features on one layer to match surface features in other |
| 02/09/2010 | US7658473 Inkjet printhead with arcuate actuator path |
| 02/09/2010 | US7658163 Direct write# system |
| 02/09/2010 | US7657999 Method of forming an electrical circuit with overlaying integration layer |
| 02/09/2010 | US7657998 Method of making a resin-packaged protection circuit module for rechargeable batteries |
| 02/09/2010 | US7657997 Reference position determining method |
| 02/04/2010 | WO2010014377A1 Novel capacitive elements and filtered feedthrough elements for implantable medical devices |
| 02/04/2010 | WO2010013741A1 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| 02/04/2010 | WO2010013623A1 Photosensitive element, method for forming resist pattern using the same, and method for manufacturing printed wiring board |
| 02/04/2010 | WO2010013611A1 Electroless copper plating method, printed wiring board, method for manufacturing printed wiring board and semiconductor device |
| 02/04/2010 | WO2010013366A1 Flex-rigid wiring board and method for manufacturing the same |
| 02/04/2010 | WO2010012540A1 Method for the hot stamping of at least one conductor track onto a substrate, substrate comprising at least one conductor track and stamping tool |
| 02/04/2010 | US20100029969 Copper compound and method for producing copper thin film using the same |
| 02/04/2010 | US20100027228 Semiconductor device and method for manufacturing the same |
| 02/04/2010 | US20100027225 Component-embedded module and manufacturing method thereof |
| 02/04/2010 | US20100026442 Method of manufacturing an RFID antenna |
| 02/04/2010 | US20100026438 Form-less electronic device assemblies and methods of operation |
| 02/04/2010 | US20100025793 Assembly for image sensing chip and assembling method thereof |
| 02/04/2010 | US20100025099 Circuit board and method of manufacturing the same |
| 02/04/2010 | US20100025095 Device Carrying an Intergrated Circuit/Components and Method of Producing the Same |
| 02/04/2010 | US20100025089 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| 02/04/2010 | US20100025087 Flex-rigid wiring board and method for manufacturing the same |
| 02/04/2010 | US20100025080 Printed circuit board with conductive ink/paste, having plating layers, and method for manufacturing the same |
| 02/04/2010 | US20100024957 Fixtures and methods for facilitating the fabrication of devices having thin film materials |
| 02/04/2010 | US20100024212 Method of fabricating multilayer printed circuit board |
| 02/04/2010 | US20100024211 Conductive elastomeric and mecchanical pin and contact system |
| 02/04/2010 | US20100024210 Product Optimization Process for Embedded Passives |
| 02/04/2010 | DE102008040882A1 Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat, Substrat mit mindestens einer Leiterbahn sowie Prägestempel A method of hot-stamping at least one strip conductor on a substrate, the substrate having at least one conductor track and die |
| 02/04/2010 | DE102008035405A1 Mixed printed circuit board manufacturing method for use in electronic device i.e. measuring device, involves soldering connection on through hole technical parts arranged on former side of printed circuit board by reflow-soldering machine |
| 02/04/2010 | DE102008034616A1 Embossed film for producing e.g. antenna structure, has peel-off layer designed as metallic peel-off layer formed from aluminum, silver, gold or combination of alloys, and metal layer formed from copper |
| 02/04/2010 | DE102008031573A1 Dehnbares Vlies mit Leiterstrukturen Stretch fleece with conductor structures |
| 02/04/2010 | DE102008002969A1 Contact pin i.e. flat contact pin, for insertion into borehole in multi-layer conductor plate, has hole or recess into which soldering agent is pressed, and material connection made between pin walls and front walls of conducting paths |
| 02/03/2010 | EP2150096A1 Wiring board and method of manufacturing the same |
| 02/03/2010 | EP2150095A1 Printed circuit board with conductive ink/paste, having plating layers, and method for manufacturing the same |
| 02/03/2010 | CN201398266Y Wave-soldering mechanical device |
| 02/03/2010 | CN201398265Y Air knife regulating device |
| 02/03/2010 | CN101642004A Method for fitting an electrical component to a contacting element and contacting element with an electrical component |
| 02/03/2010 | CN101642003A Reduced-pressure heater, its heating method, and electronic product manufacturing method |
| 02/03/2010 | CN101640983A Processing method of printing circuit board blind hole |
| 02/03/2010 | CN101640982A Terminal table for substrate installation and printed circuit board for the same |
| 02/03/2010 | CN101640981A Pressing device |
| 02/03/2010 | CN101640980A Manufacturing method of stereo lines |
| 02/03/2010 | CN101640979A Manufacturing method of conducting circuit |
| 02/03/2010 | CN101640978A Method and device for manufacturing single-side nickel-plated sheet |
| 02/03/2010 | CN101640977A Laminated product and production method therof, and circuit substrate using the same |
| 02/03/2010 | CN101640976A Manufacturing method of flexible circuit board |
| 02/03/2010 | CN100588311C Production method of suspension board with circuit |
| 02/03/2010 | CN100586980C Non-flow joint-filling composition |
| 02/02/2010 | US7655871 High heat resistance; low thermal expansion; noncracking ; fireproofing; blend of cyanate resin, epoxy resin, phenoxy resin with imidazole compound and filler; halogen-free |
| 02/02/2010 | US7655869 Flex-rigid wiring board |
| 02/02/2010 | US7655560 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 02/02/2010 | US7655530 Segmented end electrode capacitor and method of segmenting an end electrode of a capacitor |
| 02/02/2010 | US7655498 Film comprising organic semiconductors |
| 02/02/2010 | US7655348 Chip-type battery |
| 02/02/2010 | US7655304 electrostatics or electrokinetic depositiing; include a solder medium containing metal or alloy e.g. Sn, Sn/Pb, Sn/Ag/Cu etc., a coating medium containing a polymer (e.g. styrene acrylic acid copolymer, ethylene acrylic acid co-polymers, propylene acrylic acid copolymer); a charge directing material |
| 02/02/2010 | US7655282 Method of forming patterned film |
| 02/02/2010 | US7655107 Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film |
| 02/02/2010 | US7653991 Method for manufacturing printed circuit board having embedded component |
| 02/02/2010 | US7653990 Manufacturing method of printed circuit board using an ink jet |
| 02/02/2010 | US7653982 Individually unique hybrid printed antennae for chipless RFID applications |
| 02/02/2010 | CA2505315C Multi-layer circuit assembly and process for preparing the same |
| 01/28/2010 | WO2010011841A2 Metal nanoparticle ink compositions |
| 01/28/2010 | WO2010010911A1 Semiconductor device and method for manufacturing same |
| 01/28/2010 | WO2010010910A1 Coreless wiring substrate, semiconductor device, and methods for manufacturing same |
| 01/28/2010 | WO2010010851A1 Base, method for forming conductive pattern, and organic thin film transistor |
| 01/28/2010 | WO2010010813A1 Wire forming method |
| 01/28/2010 | WO2010010792A1 Method for forming conductive pattern and organic thin film transistor |
| 01/28/2010 | WO2010010768A1 Conductive particle, anisotropic conductive film, joined body, and connecting method |
| 01/28/2010 | WO2010010753A1 Wiring board and method for manufacturing the same |
| 01/28/2010 | WO2010010743A1 Electronic circuit device, method for manufacturing the same, and display device |
| 01/28/2010 | WO2010010716A1 Agent and method for treating copper surface |
| 01/28/2010 | WO2010010663A1 Component mounting device and method |
| 01/28/2010 | WO2010010609A1 Method for forming contact hole, and circuit board |
| 01/28/2010 | WO2010009970A1 Sealing frame and method for covering a component |
| 01/28/2010 | WO2009092064A3 Electrically conductive adhesive |
| 01/28/2010 | US20100021657 Process for producing electrically conductive surfaces |
| 01/28/2010 | US20100021045 Manufacturing method of printed circuit board and manufacturing apparatus for the same |
| 01/28/2010 | US20100018869 Small Volume In Vitro Sensor and Methods of Making |
| 01/28/2010 | US20100018764 Substrate-penetrating electrical connections |
| 01/28/2010 | US20100018762 Buildup printed circuit board |
| 01/28/2010 | US20100018761 Embedded chip substrate and fabrication method thereof |