Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2010
02/18/2010US20100038119 Metal Deposition
02/18/2010US20100038116 Printed circuit board and method for manufacturing same
02/18/2010US20100037690 Rotational Speed Sensor Having A Coupling Bar
02/18/2010DE202008012559U1 Reflow-Lötvorrichtung Reflow soldering
02/18/2010DE102008035056A1 Lötkontaktvorrichtung Lötkontaktvorrichtung
02/18/2010DE10063619B4 Antriebseinheit für Gebläse in Fahrzeugen Drive unit for blower in vehicles
02/18/2010DE10007868B4 Elektronische Steuerschaltung An electronic control circuit
02/17/2010EP2154939A1 Wiring board and method of manufacturing the same
02/17/2010EP2154212A1 A method for the production of conductive and transparent nano-coatings
02/17/2010EP2153708A1 Method for the production of metal-coated base laminates
02/17/2010EP2153706A1 Electronic circuit device
02/17/2010EP2152830A1 Corrosion-preventive adhesive compositions
02/17/2010EP1806037B1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method
02/17/2010EP1757175B1 Method and apparatus for accurately applying structures to a substrate
02/17/2010EP1520446B1 Method for forming acoustically active element in a multi-layer circuit-board structure and a multi-layer circuit-board structure
02/17/2010EP1437036B1 Latching micro magnetic relay packages and methods of packaging
02/17/2010EP1321978B1 Contact structure
02/17/2010CN201409258Y Universal positioning device of flexible printed circuit board
02/17/2010CN201409256Y Component switching device
02/17/2010CN201409255Y Solder resisting structure of thick copper circuit board
02/17/2010CN201409254Y Thick copper circuit board
02/17/2010CN201406477Y Jig device used for electroplating PCB sheet
02/17/2010CN201406472Y Etching machine with stable parameter of etching agent for printed circuit boards
02/17/2010CN101653053A Multilayer wiring board and its manufacturing method
02/17/2010CN101653052A Circuit connecting method
02/17/2010CN101653051A Pin to be inserted in a receiving opening in a circuit board and method for inserting a pin into a receiving opening in a circuit board
02/17/2010CN101652034A Printed circuit board (PCB) and manufacturing method thereof and device for solving reflux of radio-frequency power amplifier
02/17/2010CN101652033A PCB composite board for LED light-emitting diode
02/17/2010CN101652032A PCB composite board with fixing device
02/17/2010CN101652031A Method for reliably connecting bridge printed circuit boards of optical transceivers and positioning component
02/17/2010CN101652030A Manual board discharging device for reflow soldering furnaces
02/17/2010CN101652029A Rinse device and rinse system
02/17/2010CN101652028A Embedded structure and method for making the same
02/17/2010CN101652027A Making process of circuit board with radiation fins
02/17/2010CN101652026A Preparation method of copper clad plate
02/17/2010CN101652025A Method for manufacturing and forming circuit board
02/17/2010CN101652024A Method for deploying component on circuit board
02/17/2010CN100591198C Light communication apparatus
02/17/2010CN100591197C Method for preparing hierarchical and grading gold finger plate using method of selecting wet film
02/17/2010CN100591196C ACF paste device and flat panel display
02/17/2010CN100590855C Flexible substrate, manufacturing method thereof and semiconductor package
02/17/2010CN100590142C Nanoporous laminates
02/17/2010CN100589918C Solder and circuit basal plate using the same
02/17/2010CN100589915C Method for separating flat ceramic workpieces with a calculated radiation spot length
02/16/2010US7664311 Component mounting board inspecting apparatus
02/16/2010US7663890 Printed circuit boards for use in optical transceivers
02/16/2010US7663564 Method for making smart cards capable of operating with and without contact
02/16/2010US7663234 Package of a semiconductor device with a flexible wiring substrate and method for the same
02/16/2010US7663225 Method for manufacturing electronic components, mother substrate, and electronic component
02/16/2010US7663223 Coupling substrate for semiconductor components and method for producing the same
02/16/2010US7663215 Electronic module with a conductive-pattern layer and a method of manufacturing same
02/16/2010US7663113 Semiconductor device and radiation detector employing it
02/16/2010US7662429 Multilayer
02/16/2010US7661577 Imidazole compound and use thereof
02/16/2010US7661191 Multilayer substrate manufacturing method
02/16/2010US7661190 Process for producing multilayer printed wiring board
02/11/2010WO2010016656A1 Moving device for an automatic mdf
02/11/2010WO2010016620A1 Surface treating agent for copper or copper alloy and use thereof
02/11/2010WO2010016522A1 Printed-circuit board, printed-circuit board manufacturing method, and electronic device
02/11/2010WO2010016258A1 Flame-retardant photocurable resin composition, dry film and cured product of the same, and printed wiring board using the composition, dry film or cured product
02/11/2010WO2010016256A1 Flame-retardant photocurable resin composition, dry film and cured product of the same, and printed wiring board using the composition, dry film or cured product
02/11/2010WO2010016170A1 Compression bonding device, compression bonding method, package, and pressing plate
02/11/2010WO2010015717A1 Sensor device and method for manufacture
02/11/2010WO2010015571A1 Electrical contact pair
02/11/2010WO2010015444A1 Electronic sensor or sensor device, in particular acceleration sensor, comprising a chip module mounted in a sensor housing
02/11/2010WO2009151806A3 Elastic-cushioned capacitively-coupled connector
02/11/2010US20100034986 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
02/11/2010US20100034965 Direct Metallization Process
02/11/2010US20100034237 Laminated temperature sensor
02/11/2010US20100033384 Wireless communication terminal, shield case, and method of manufacturing case body
02/11/2010US20100033263 Flat transmission wire and fabricating methods thereof
02/11/2010US20100032202 Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate
02/11/2010US20100032200 Conductive connecting pin and package substrate
02/11/2010US20100032197 Circuit board including aligned nanostructures
02/11/2010US20100032194 Printed wiring board, manufacturing method for printed wiring board and electronic device
02/11/2010US20100031503 Multilayer printed circuit board and multilayer printed circuit board manufacturing method
02/11/2010US20100031502 Method for fabricating blind via structure of substrate
02/11/2010US20100031501 Method for filling through hole or non-through hole formed on board with filler
02/11/2010US20100031500 Method of fabricating a base layer circuit structure
02/11/2010DE202009014150U1 Lötrahmen zum insbesondere maschinellen Löten von elektrischen und elektronischen Bauteilen auf Leiterplatten Solder frames for particular machine soldering electrical and electronic components on printed circuit boards
02/11/2010DE102009033321A1 Leistungshalbleitervorrichtung Power semiconductor device
02/11/2010DE102009027309A1 Leiterplatten-Kugelmatrix-System mit verbesserter mechanischer Festigkeit PCB ball grid array system with improved mechanical strength
02/11/2010DE102008047959A1 Flexible flächige Struktur, Verfahren zur Herstellung einer flexiblen flächigen Struktur und Verwendung Flexible flat structure, methods of making a flexible sheet-like structure and use
02/11/2010DE102008036421A1 Electronic arrangement for portable equipment, such as mobile telephone, has printed circuit board with contact hole and component with electrical connection, which is arranged at side of printed circuit board
02/10/2010EP2152053A2 Fixing heat dissipating unit and electronic device having fixing heat dissipating unit
02/10/2010EP2151150A1 Method in manufacturing of circuit boards
02/10/2010EP2151149A1 Chip resistor substrat
02/10/2010EP2151148A2 Method for producing a circuit board having a cavity for the integration of components and circuit board and application
02/10/2010EP1408726B1 Method of manufacturing a printed wiring board
02/10/2010CN201403257Y Tooling structure used for Surface Mounting Technology (SMT) of flexible printed circuit (FPC)
02/10/2010CN201403256Y Printing fixture for surface mount
02/10/2010CN201403255Y Circuit board dry film vacuum fitting device
02/10/2010CN201403254Y Tooling structure used for brushing surface of flexible circuit board
02/10/2010CN201403253Y Flexible circuit board compression structure with PET single-sided parting film
02/10/2010CN201403251Y Printed wiring board, printed circuit board and electronic product with printed circuit board
02/10/2010CN201403248Y Printed wiring board
02/10/2010CN101647327A Multilayered circuit board and semiconductor device
02/10/2010CN101647326A Multilayer printed-circuit board
02/10/2010CN101647074A Conductive film and method for producing the same
02/10/2010CN101646311A Method and device for realizing connection of optical transceiver and main printed circuit board