Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2010
03/03/2010CN101662892A Ultra-thin copper foil with carrier, method for producing ultra-thin copper foil with carrier and printed circuit board
03/03/2010CN101662891A Double-sided circuit front and back connecting technique and connecting structure
03/03/2010CN101662890A Tin furnace tool
03/03/2010CN101662889A Post-soldering-free tin-coating method, printed circuit board and device thereof
03/03/2010CN101662888A Preparation method for PCB plate with step trough
03/03/2010CN101662887A Printing circuit board and method for optimizing position of induction point thereof
03/03/2010CN101662886A Transplanting and repairing method of printed circuit board
03/03/2010CN101662885A Method for performing gold backing on printed circuit board of Ku waveband microstrip type switch circuit
03/03/2010CN100593365C Wiring pattern drawing formation method and circuit board manufactured by using the same
03/03/2010CN100593364C Electronic device and method of manufacturing same
03/02/2010US7671457 Semiconductor package including top-surface terminals for mounting another semiconductor package
03/02/2010US7671281 Multilayer wiring circuit board
03/02/2010US7671133 Vulcanized fluorine rubber and cushioning material for heat press containing same
03/02/2010US7670672 Multilayer ceramic substrate and method for producing same
03/02/2010US7670639 Continuously forming a cable or flexible circuit board with permanently attached fastener means extending along its length for securing the cable to a supporting surface; extruding thermoplastic resin about spaced-apart electrical conductors rails having fastener-shaped profiles;dielectrics
03/02/2010US7670363 Protection apparatus for implantable medical device
03/02/2010US7669971 Inkjet printer with low nozzle to chamber cross-section ratio
03/02/2010US7669773 IC card module
03/02/2010US7669320 Coreless cavity substrates for chip packaging and their fabrication
03/02/2010US7669319 Method for fabricating a flexible display
03/02/2010US7669318 High-speed RFID circuit placement method
03/02/2010US7669317 Method for reversing a chip vertically
02/2010
02/25/2010WO2010021624A1 Mitigation of whiskers in sn-films
02/25/2010WO2010021278A1 Multilayer laminated circuit board wherein resin films having different thermal expansion coefficients are laminated
02/25/2010WO2010021262A1 Circuit module and method for manufacturing same
02/25/2010WO2010020753A2 Halo-hydrocarbon polymer coating
02/25/2010US20100048066 Method for contacting partially conductive textile materials
02/25/2010US20100047961 Placement Of An Integrated Circuit
02/25/2010US20100046186 Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component
02/25/2010US20100046182 Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board
02/25/2010US20100045265 Method and device for forming a temporary electrical contact to a solar cell
02/25/2010US20100044094 Printed wiring board and method for manufacturing the same
02/25/2010US20100044091 Electrode structure and method for forming bump
02/25/2010US20100044089 Interposer integrated with capacitors and method for manufacturing the same
02/25/2010US20100044086 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
02/25/2010US20100044084 Printed circuit board and method of manufacturing the same
02/25/2010US20100044083 Build-up printed circuit board structure for increasing fine circuit density and method of manufacturing the same
02/25/2010US20100044072 Methods of Fabricating Complex Two-Dimensional Conductive Silicides
02/25/2010US20100043550 Physical quantity sensor device and method for producing the same
02/25/2010US20100043223 Stripline Flex Circuit
02/25/2010US20100043222 Conforming, electro-magnetic interference reducing cover for circuit components
02/25/2010DE10392500B4 Lottragendes Bauteil und Verfahren zum Halten einer Lotmasse darauf Lottragendes component and method for holding a solder mass on it,
02/25/2010DE102008044456A1 Printed circuit board manufacturing method, involves processing laser diode and printed circuit board blanks relative to each other, such that region of photosensitive layer is illuminated
02/25/2010DE10036976B4 Verfahren zum Verbinden und Verbindungsaufbau eines thermoplastischen Harzmaterials A method for joining and connecting structure of a thermoplastic resin material
02/25/2010CA2733765A1 Halo-hydrocarbon polymer coating
02/24/2010EP2157842A1 Laminated wiring board and method for manufacturing the same
02/24/2010EP2157841A1 Solder ball mounting method
02/24/2010EP2157840A1 Transfer film for burning
02/24/2010EP2157585A1 Method for production of laminated dielectric material
02/24/2010EP2157146A1 Filmy adhesive for circuit connection
02/24/2010EP2156716A1 Flexible circuit
02/24/2010EP2156715A2 Improvements relating to direct write and additive manufacturing processes
02/24/2010EP2156713A1 Control device of a motor vehicle
02/24/2010EP2047724B1 Conductor carrier and arrangement comprising a conductor carrier
02/24/2010EP1392449B1 Over-clocking in a microdeposition control system to improve resolution
02/24/2010EP1278612B1 Flip chip Interconnection structure and method of obtaining the same
02/24/2010CN201414259Y Circuit board hot-connecting device
02/24/2010CN201414258Y Basket-vibrating device
02/24/2010CN201414257Y Circuit board double-face printing tool
02/24/2010CN201413122Y Engraving depth measuring device of circuit board engraving machine
02/24/2010CN101658082A Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
02/24/2010CN101658081A Flexible wiring board and method of manufacturing same
02/24/2010CN101658080A Apparatus and method for manufacturing multilayer wiring board
02/24/2010CN101658079A Multilayer printed wiring board and method for manufacturing the same
02/24/2010CN101657074A Circuit board and manufacturing method of circuit board
02/24/2010CN101657073A Multi-power-supply PCB composite panel
02/24/2010CN101657072A Circuit board manufacturing method
02/24/2010CN101657071A Manufacturing method of blind via structure of substrate
02/24/2010CN101657070A Method for forming the printed wiring board
02/24/2010CN101657069A Surface processing method for printed circuit board and corresponding printed circuit board
02/24/2010CN101657068A Method for preparing coaxial cable
02/24/2010CN100592549C Flat display device
02/24/2010CN100592501C Conductive substrate, semiconductor device and manufacturing method thereof
02/24/2010CN100592412C Making process for flexible printed circuit suspended rack assembly
02/24/2010CN100592207C Binder diffusion transfer patterning of a thick film paste layer
02/23/2010US7669162 Integrated power supply system analyzing system, integrated power supply system analyzing method, and multiplayer printed circuit board
02/23/2010US7667975 Lighting device of discharge lamp, illumination apparatus and illumination system
02/23/2010US7667299 Circuit board and method for mounting chip component
02/23/2010US7667160 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
02/23/2010US7667143 Circuit board module and forming method thereof
02/23/2010US7667142 Lightweight circuit board with conductive constraining cores
02/23/2010US7666320 Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor
02/23/2010US7665652 Electronic devices including metallurgy structures for wire and solder bonding
02/23/2010US7665648 Fabrication method and structure of PCB assembly, and tool for assembly thereof
02/23/2010US7665207 Method of making a multi-chip electronic package having laminate carrier
02/23/2010US7665206 Printed circuit board and manufacturing method thereof
02/23/2010US7665196 Method for forming a multi-frequency surface acoustic wave device
02/18/2010WO2010018790A1 Multilayer laminated circuit board having multiple conduction part
02/18/2010WO2010018756A1 Electric circuit structure
02/18/2010WO2010018712A1 Conductive adhesive and led substrate using the same
02/18/2010WO2010018708A1 Method for manufacturing module with built-in component, and module with built-in component
02/18/2010WO2010018680A1 Surface-mounting machine using optical beam
02/18/2010WO2010018679A1 Method of manufacturing printed wiring board with surface-mount component mounted thereon
02/18/2010WO2010017746A1 Printed circuit board, method for making the same and equipment with rf power amplifier
02/18/2010WO2009140050A3 Electronic assemblies without solder and method for their design, prototyping, and manufacture
02/18/2010US20100039579 Liquid crystal display with light emitting diode backlight assembly and liquid crystal display thereof
02/18/2010US20100038803 Low fabrication cost, high performance, high reliability chip scale package
02/18/2010US20100038127 Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery
02/18/2010US20100038125 Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards
02/18/2010US20100038124 Embedded structure and method for making the same