| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/18/2010 | US20100068467 Method for treating surface of substrate resin and substrate resin treated thereby |
| 03/18/2010 | US20100068409 Ink jet printable compositions |
| 03/18/2010 | US20100067208 Packaged device and method of fabricating packaged-device |
| 03/18/2010 | US20100067202 Electronics housing with standard interface |
| 03/18/2010 | US20100067163 Static electricity control part and process for manufacturing the same |
| 03/18/2010 | US20100066709 Interconnection line device, image display apparatus, and method for manufacturing interconnection line device |
| 03/18/2010 | US20100066313 Methods for Manufacturing and Operating a Semiconductor Device |
| 03/18/2010 | US20100065962 Power semiconductor module |
| 03/18/2010 | US20100065432 Electrochemical Fabrication Process Including Process Monitoring, Making Corrective Action Decisions, and Taking Appropriate Actions |
| 03/18/2010 | US20100065431 Electrochemical Fabrication Process Including Process Monitoring, Making Corrective Action Decisions, and Taking Appropriate Actions |
| 03/18/2010 | US20100065324 Embedded structure and method for making the same |
| 03/18/2010 | US20100065321 Printed wiring board and method for manufacturing the same |
| 03/18/2010 | US20100065319 Wiring board and process for fabricating the same |
| 03/18/2010 | US20100065309 Electrical and optical hybrid board and manufacturing method of the same |
| 03/18/2010 | US20100065308 Conductive emissions protection |
| 03/18/2010 | US20100065194 Method for manufacturing printed wiring board |
| 03/18/2010 | US20100064512 Multilayer printed wiring board |
| 03/18/2010 | US20100064511 Method for component mounting |
| 03/18/2010 | US20100064504 Railway beacon and related production method |
| 03/17/2010 | EP2164311A1 Circuit board and method for manufacturing the same |
| 03/17/2010 | EP2163148A1 Electric control device |
| 03/17/2010 | EP2163147A2 Method of forming solid blind vias through the dielectric coating on high density interconnect (hdi) substrate materials |
| 03/17/2010 | EP2163146A2 Method for the production of polymer-coated metal foils, and use thereof |
| 03/17/2010 | EP2163145A1 Electronic module and method for producing an electronic module |
| 03/17/2010 | EP2162900A1 Drying apparatus and method for silicon-based electronic circuits |
| 03/17/2010 | EP2162566A1 Multilayer printed wiring boards with holes requiring copper wrap plate |
| 03/17/2010 | EP2162228A1 An electrostatic spraying device and a method of electrostatic spraying |
| 03/17/2010 | EP1716730B1 Method for the partial removal of a conductive layer |
| 03/17/2010 | CN201426216Y PCB stacking structure |
| 03/17/2010 | CN201426212Y 镂空双面柔性印制线路板 Pierced sided flexible printed circuit boards |
| 03/17/2010 | CN201426211Y Hollow double-sided flexible printed circuit board printed with ACP conductive adhesive |
| 03/17/2010 | CN201426210Y Hollow flexible printed circuit board |
| 03/17/2010 | CN201426209Y 双面柔性印制线路板 Double-sided flexible printed circuit boards |
| 03/17/2010 | CN201426208Y Double-sided flexible printed circuit board printed with ACP conductive adhesive |
| 03/17/2010 | CN201426207Y Hollow flexible printed circuit board printed with ACP conductive adhesive |
| 03/17/2010 | CN201423482Y Nozzle elevating device of crest welder |
| 03/17/2010 | CN201423481Y Crest width adjusting mechanism of crest welder |
| 03/17/2010 | CN101675717A Wiring board and method of manufacturing the same |
| 03/17/2010 | CN101675716A Wiring board and method of manufacturing the same |
| 03/17/2010 | CN101675388A Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
| 03/17/2010 | CN101675387A Photosensitive resin composition, dry film, and processed product using the dry film |
| 03/17/2010 | CN101674721A Miniature array electromagnet mounting assembly |
| 03/17/2010 | CN101674720A Multifunctional table-type full-automatic chip mounter |
| 03/17/2010 | CN101674711A Aligning method of double-faced flexible printed circuit board |
| 03/17/2010 | CN101674710A A printed circuit board and an electronic equipment |
| 03/17/2010 | CN101674709A Layout structure and method for reducing noise generated by flexible printed circuit board |
| 03/17/2010 | CN101674708A Mother board and method for processing mother board |
| 03/17/2010 | CN101674706A Circuit boards, connectors, cases, case assemblies, devices and methods of manufacturing the same |
| 03/17/2010 | CN101674705A Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus |
| 03/17/2010 | CN101672959A 光收发器 Optical Transceivers |
| 03/17/2010 | CN101671820A Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board |
| 03/17/2010 | CN101670594A Method for processing contour of flexible circuit board |
| 03/17/2010 | CN100594764C Board pieces and composite wiring boards using the board pieces |
| 03/17/2010 | CN100594763C Improved method for micro-roughening treatment of copper and mixed-metal circuitry |
| 03/17/2010 | CN100594762C Automatic painting method of wave welding assisted agent |
| 03/17/2010 | CN100594761C Method for manufacturing double-faced flexible printing wiring board |
| 03/17/2010 | CN100594760C High flexible copper-clad laminate manufacturing method |
| 03/17/2010 | CN100594758C Multilayer circuit board and method for fabricating same |
| 03/17/2010 | CN100594757C Circuit board, its manufacturing method, and joint box using circuit board |
| 03/17/2010 | CN100594608C High-density circuit module |
| 03/17/2010 | CN100594604C 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers |
| 03/17/2010 | CN100594262C Electroless deposition methods and systems |
| 03/17/2010 | CN100594223C Block copolymerized polyimide ink composition for printing |
| 03/17/2010 | CN100594089C Solder composition, connecting process and substrate producing process using soldering |
| 03/16/2010 | US7679925 Method for fabricating wiring board provided with passive element, and wiring board provided with passive element |
| 03/16/2010 | US7679190 Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board |
| 03/16/2010 | US7679170 Electronic apparatus with wiring plates fixed directly to columns to space wiring circuit from base |
| 03/16/2010 | US7679004 Circuit board manufacturing method and circuit board |
| 03/16/2010 | US7679001 Circuit board and method of manufacture thereof |
| 03/16/2010 | US7678695 Circuit substrate and method for fabricating the same |
| 03/16/2010 | US7677195 Apparatus for supplying a droplet on a substrate and method of manufacturing display apparatus using the same |
| 03/16/2010 | US7676917 Method of manufacturing a circuit board |
| 03/16/2010 | US7676916 Electronic component mounting system and electronic component mounting method |
| 03/16/2010 | US7676915 Process for manufacturing an LED lamp with integrated heat sink |
| 03/16/2010 | US7676914 Methods for sensor having capacitor on chip |
| 03/16/2010 | US7676913 Wiring board, method of manufacturing wiring board, and electronic device |
| 03/16/2010 | US7676912 Method of manufacturing electronic component package |
| 03/16/2010 | CA2386129C An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
| 03/11/2010 | WO2010027206A2 Jig-integrated metal mask and a production method therefor |
| 03/11/2010 | WO2010027112A1 Method of manufacturing multi-level metal thin film and apparatus for manufacturing the same |
| 03/11/2010 | WO2010027077A1 2-benzyl-4-(3,4-dichlorophenyl)-5-methylimidazole compound |
| 03/11/2010 | WO2010027076A1 Method for producing transferred structure and mother die for use in the method |
| 03/11/2010 | WO2010027075A1 Wiring board and probe card |
| 03/11/2010 | WO2010027061A1 Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package |
| 03/11/2010 | WO2010027052A1 Ultrathin copper foil with carrier, and copper laminated board or printed wiring board |
| 03/11/2010 | WO2010027017A1 Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal |
| 03/11/2010 | WO2010026927A1 Photosensitive resin composition for protective film of printed wiring board for semiconductor package |
| 03/11/2010 | WO2010026895A1 Method for manufacturing multilayer laminated circuit board |
| 03/11/2010 | WO2010026822A1 Electric appliance disassembling method, and electric appliance disassembling device |
| 03/11/2010 | WO2010026685A1 Electronic part mounting device and work method using electronic part mounting device |
| 03/11/2010 | WO2010026571A2 Metal nanowire thin-films |
| 03/11/2010 | WO2010025972A1 Method for hot-embossing of at least one circuit path on a substrate and a substrate with at least one circuit path |
| 03/11/2010 | WO2010008138A3 Automatic mdf apparatus |
| 03/11/2010 | WO2009140524A3 Tin-silver compound coating on printed circuit boards |
| 03/11/2010 | US20100062617 Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same |
| 03/11/2010 | US20100062568 Electronic module with a conductive-pattern layer and a method of manufacturing same |
| 03/11/2010 | US20100062148 Electrically Responsive Composite Material, a Method of Manufacture and a Transducer Produced Using Said Material |
| 03/11/2010 | US20100061736 Optical transceiver |
| 03/11/2010 | US20100060696 Printhead Integrated Circuit Having Glass Nozzle Chambers |
| 03/11/2010 | US20100060381 Mulit-layer embedded capacitance and resistance substrate core |