Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/11/2010 | US20100059267 Printed circuit board and method of manufacturing the same |
03/11/2010 | US20100059265 Contact of semiconductor device and manufacturing method thereof |
03/11/2010 | US20100059256 Circuit structure of circuit board and process for manufacturing the same |
03/11/2010 | US20100059255 Ltcc substrate structure and method for the production thereof |
03/11/2010 | US20100058899 Electro-mechanical actuator device and apparatus incorporating such device |
03/11/2010 | US20100058863 Manufacturing method for a rotation sensor device and rotation sensor device |
03/11/2010 | US20100058585 Method of manufacturing printed circuit board |
03/11/2010 | US20100058584 System and method for manufacturing laminated circuit boards |
03/11/2010 | US20100058580 Stacking Integrated Circuits containing Serializer and Deserializer Blocks using Through Silicon Via |
03/11/2010 | DE202009015945U1 Leiterplattentrenneinrichtung PCB separator |
03/11/2010 | DE102008041873A1 LTCC-Substratstruktur und Verfahren zur Herstellung derselben LTCC substrate structure and method of manufacturing the same |
03/10/2010 | EP2161976A1 Multilayer board surface-treated configuration and the producing method thereof |
03/10/2010 | EP2161975A2 Connection structure of circuit board and connecting device |
03/10/2010 | EP2161974A1 Bifunctional EMC coating |
03/10/2010 | EP2161973A1 A structure and manufacturing method of metal wiring on multilayered board |
03/10/2010 | EP2161355A1 Copper electroplating bath |
03/10/2010 | EP2161354A1 Copper surface treating agent and surface treatment method |
03/10/2010 | EP2161240A2 Carbon nanotube device, method of manufacturing the same, and carbon nanotube transfer body |
03/10/2010 | EP2160932A1 Restraining a connecting material |
03/10/2010 | EP2160771A1 Solderless integrated package connector and heat sink for led |
03/10/2010 | EP1897424B1 Warpage preventing substrates and method of making same |
03/10/2010 | EP1891844B1 Compact passive transponder |
03/10/2010 | EP1667503B1 Structure and process for producing the same |
03/10/2010 | CN201422209Y Solder leveling rack for PCB production |
03/10/2010 | CN201422208Y Cleaning frame component used for printed circuit board cleaning machine |
03/10/2010 | CN201422207Y Cleaning system used for printed circuit board cleaning machine |
03/10/2010 | CN201422206Y Pin positioning mold for production of PCBs |
03/10/2010 | CN201422205Y Fixture for production of thin PCBs |
03/10/2010 | CN201422204Y PCB with projection |
03/10/2010 | CN201422195Y Protective film for rigid-flexible printed circuit boards |
03/10/2010 | CN201421900Y Socket connector and printed circuit board assembly |
03/10/2010 | CN101668391A Circuit board assembly and manufacturing method thereof |
03/10/2010 | CN101668390A Production technology of PCB (Printed Circuit Board) solder mask |
03/10/2010 | CN101668389A Method for making high alignment printed circuit board |
03/10/2010 | CN101668388A Method for manufacturing through-hole circuit board for solving bilateral contraposition precision offset of laser through hole |
03/10/2010 | CN100593964C Wiring circuit board and method for manufacturing wiring circuit board |
03/10/2010 | CN100593963C Inside imbedded type line structure and technique thereof |
03/10/2010 | CN100593841C Liquor processing apparatus circuit substrate and method for manufacturing circuit substrate |
03/10/2010 | CN100593756C Photosensitive resin composition and method for the formation of a resin pattern using the composition |
03/09/2010 | US7675401 Electronic circuit board |
03/09/2010 | US7675301 Electronic components with plurality of contoured microelectronic spring contacts |
03/09/2010 | US7675009 Electrode for machines for electromagnetic induction welding of the layers forming a multi-layer printed circuit |
03/09/2010 | US7674988 Shielded circuit board and method for shielding a circuit board |
03/09/2010 | US7674756 Solvent compositions containing chlorofluoroolefins or fluoroolefins |
03/09/2010 | US7674729 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations |
03/09/2010 | US7674117 Strain-resistant electrical connection |
03/09/2010 | US7673387 Manufacture of a layer including a component |
03/09/2010 | US7673386 Flip-chip component production method |
03/09/2010 | US7673385 Laminated structure method |
03/09/2010 | CA2553612C Process and device for printing a substrate |
03/04/2010 | WO2010024823A1 Use of hybrid pcb materials in printed circuit boards |
03/04/2010 | WO2010024472A1 Surface treating agent for copper or copper alloy and use thereof |
03/04/2010 | WO2010024421A1 Surface treating agent for copper or copper alloy and use thereof |
03/04/2010 | WO2010024370A1 Film with metal film |
03/04/2010 | WO2010024369A1 Method for manufacturing circuit board |
03/04/2010 | WO2010024368A1 Film with metal film |
03/04/2010 | WO2010024233A1 Wiring board capable of containing functional element and method for manufacturing same |
03/04/2010 | WO2010024175A1 Laminate and process for producing the laminate |
03/04/2010 | WO2010024141A1 Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux |
03/04/2010 | WO2010023895A1 Sensitizing solution for electroless plating and electroless plating method |
03/04/2010 | WO2010023865A1 Printed wiring board and method of manufacturing printed wiring board |
03/04/2010 | WO2010023773A1 Flex-rigid wiring board and electronic device |
03/04/2010 | WO2010022501A1 Apparatus and method for manufacturing or repairing a circuit board |
03/04/2010 | US20100057381 Imposing and determining stress in sub-micron samples |
03/04/2010 | US20100056212 Mobile wireless communications device comprising a satellite positioning system antenna and electrically conductive director element therefor |
03/04/2010 | US20100055941 System and method for connecting flat flx cable with an integrated circuit, such as a camera module |
03/04/2010 | US20100055909 Semiconductor polishing compound, process for its production and polishing method |
03/04/2010 | US20100053918 Electronic-parts package and manufacturing method therefor |
03/04/2010 | US20100053423 Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
03/04/2010 | US20100053388 Solid-state imaging device |
03/04/2010 | US20100053012 Antenna apparatus for printed circuit board having auxiliary antenna |
03/04/2010 | US20100051345 Package, method of manufacturing a package and frame |
03/04/2010 | US20100051338 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
03/04/2010 | US20100051334 Printed Circuit Board and Method of Manufacturing the Same |
03/04/2010 | US20100051333 Conductive ink, conductive circuit and non-contact media |
03/04/2010 | US20100051329 Printed circuit board and method of manufacturing the same |
03/04/2010 | US20100051321 Printed circuit board and method of producing the same |
03/04/2010 | US20100050430 Method for Holding and Carrying Substrate |
03/04/2010 | US20100050429 Component mounting method |
03/04/2010 | US20100050426 System for mounting components on boards |
03/04/2010 | DE102009037795A1 Elektrischer Schalter Electric switch |
03/04/2010 | DE102008041538A1 Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn A method of hot-stamping at least one strip conductor on a substrate as well as substrate with at least one conductor track |
03/04/2010 | DE102008041497A1 Bauteil mit einem mechanischen Kontakt und Verfahren zur Herstellung des Bauteils Component having a mechanical contact and method for producing the component |
03/04/2010 | DE102008039921A1 Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass |
03/04/2010 | DE102008037706B3 Vorrichtung zum Löten von Werkstücken sowie Verfahren zum Betieb einer solchen Vorrichtung Apparatus for soldering tools and the method of con- sumption During operation of such a device |
03/03/2010 | EP2159270A1 Method for manufacturing electrically conductive structures |
03/03/2010 | EP2158997A2 Control of the porosity of metal pastes for pressure-free low temperature sinter-process |
03/03/2010 | EP2158797A2 Methods for integration of thin-film capacitors into the build-up layers of a printed wiring board |
03/03/2010 | EP1723581B1 Flat transponder and method for the production thereof |
03/03/2010 | EP1062849B1 Circuit board features with reduced parasitic capacitance and method therefor |
03/03/2010 | CN201418211Y Flexible circuit board reflow soldering protective fixture |
03/03/2010 | CN201418210Y Connection structure between circuit board and wires welded on the circuit board |
03/03/2010 | CN201418209Y Circuit board |
03/03/2010 | CN201418208Y Printed circuit board adopting direct interconnection between daughter board and mother board |
03/03/2010 | CN101663926A Component-incorporating module and its manufacturing method |
03/03/2010 | CN101662897A Manufacturing method for multilayer stacking printed wiring board |
03/03/2010 | CN101662896A Method for manufacturing printed wiring board |
03/03/2010 | CN101662895A Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board |
03/03/2010 | CN101662894A Encapsulating base plate and encapsulating structure |
03/03/2010 | CN101662893A Manufacturing method for printed wiring board with dense disk holes |