Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2010
03/11/2010US20100059267 Printed circuit board and method of manufacturing the same
03/11/2010US20100059265 Contact of semiconductor device and manufacturing method thereof
03/11/2010US20100059256 Circuit structure of circuit board and process for manufacturing the same
03/11/2010US20100059255 Ltcc substrate structure and method for the production thereof
03/11/2010US20100058899 Electro-mechanical actuator device and apparatus incorporating such device
03/11/2010US20100058863 Manufacturing method for a rotation sensor device and rotation sensor device
03/11/2010US20100058585 Method of manufacturing printed circuit board
03/11/2010US20100058584 System and method for manufacturing laminated circuit boards
03/11/2010US20100058580 Stacking Integrated Circuits containing Serializer and Deserializer Blocks using Through Silicon Via
03/11/2010DE202009015945U1 Leiterplattentrenneinrichtung PCB separator
03/11/2010DE102008041873A1 LTCC-Substratstruktur und Verfahren zur Herstellung derselben LTCC substrate structure and method of manufacturing the same
03/10/2010EP2161976A1 Multilayer board surface-treated configuration and the producing method thereof
03/10/2010EP2161975A2 Connection structure of circuit board and connecting device
03/10/2010EP2161974A1 Bifunctional EMC coating
03/10/2010EP2161973A1 A structure and manufacturing method of metal wiring on multilayered board
03/10/2010EP2161355A1 Copper electroplating bath
03/10/2010EP2161354A1 Copper surface treating agent and surface treatment method
03/10/2010EP2161240A2 Carbon nanotube device, method of manufacturing the same, and carbon nanotube transfer body
03/10/2010EP2160932A1 Restraining a connecting material
03/10/2010EP2160771A1 Solderless integrated package connector and heat sink for led
03/10/2010EP1897424B1 Warpage preventing substrates and method of making same
03/10/2010EP1891844B1 Compact passive transponder
03/10/2010EP1667503B1 Structure and process for producing the same
03/10/2010CN201422209Y Solder leveling rack for PCB production
03/10/2010CN201422208Y Cleaning frame component used for printed circuit board cleaning machine
03/10/2010CN201422207Y Cleaning system used for printed circuit board cleaning machine
03/10/2010CN201422206Y Pin positioning mold for production of PCBs
03/10/2010CN201422205Y Fixture for production of thin PCBs
03/10/2010CN201422204Y PCB with projection
03/10/2010CN201422195Y Protective film for rigid-flexible printed circuit boards
03/10/2010CN201421900Y Socket connector and printed circuit board assembly
03/10/2010CN101668391A Circuit board assembly and manufacturing method thereof
03/10/2010CN101668390A Production technology of PCB (Printed Circuit Board) solder mask
03/10/2010CN101668389A Method for making high alignment printed circuit board
03/10/2010CN101668388A Method for manufacturing through-hole circuit board for solving bilateral contraposition precision offset of laser through hole
03/10/2010CN100593964C Wiring circuit board and method for manufacturing wiring circuit board
03/10/2010CN100593963C Inside imbedded type line structure and technique thereof
03/10/2010CN100593841C Liquor processing apparatus circuit substrate and method for manufacturing circuit substrate
03/10/2010CN100593756C Photosensitive resin composition and method for the formation of a resin pattern using the composition
03/09/2010US7675401 Electronic circuit board
03/09/2010US7675301 Electronic components with plurality of contoured microelectronic spring contacts
03/09/2010US7675009 Electrode for machines for electromagnetic induction welding of the layers forming a multi-layer printed circuit
03/09/2010US7674988 Shielded circuit board and method for shielding a circuit board
03/09/2010US7674756 Solvent compositions containing chlorofluoroolefins or fluoroolefins
03/09/2010US7674729 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations
03/09/2010US7674117 Strain-resistant electrical connection
03/09/2010US7673387 Manufacture of a layer including a component
03/09/2010US7673386 Flip-chip component production method
03/09/2010US7673385 Laminated structure method
03/09/2010CA2553612C Process and device for printing a substrate
03/04/2010WO2010024823A1 Use of hybrid pcb materials in printed circuit boards
03/04/2010WO2010024472A1 Surface treating agent for copper or copper alloy and use thereof
03/04/2010WO2010024421A1 Surface treating agent for copper or copper alloy and use thereof
03/04/2010WO2010024370A1 Film with metal film
03/04/2010WO2010024369A1 Method for manufacturing circuit board
03/04/2010WO2010024368A1 Film with metal film
03/04/2010WO2010024233A1 Wiring board capable of containing functional element and method for manufacturing same
03/04/2010WO2010024175A1 Laminate and process for producing the laminate
03/04/2010WO2010024141A1 Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
03/04/2010WO2010023895A1 Sensitizing solution for electroless plating and electroless plating method
03/04/2010WO2010023865A1 Printed wiring board and method of manufacturing printed wiring board
03/04/2010WO2010023773A1 Flex-rigid wiring board and electronic device
03/04/2010WO2010022501A1 Apparatus and method for manufacturing or repairing a circuit board
03/04/2010US20100057381 Imposing and determining stress in sub-micron samples
03/04/2010US20100056212 Mobile wireless communications device comprising a satellite positioning system antenna and electrically conductive director element therefor
03/04/2010US20100055941 System and method for connecting flat flx cable with an integrated circuit, such as a camera module
03/04/2010US20100055909 Semiconductor polishing compound, process for its production and polishing method
03/04/2010US20100053918 Electronic-parts package and manufacturing method therefor
03/04/2010US20100053423 Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
03/04/2010US20100053388 Solid-state imaging device
03/04/2010US20100053012 Antenna apparatus for printed circuit board having auxiliary antenna
03/04/2010US20100051345 Package, method of manufacturing a package and frame
03/04/2010US20100051338 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
03/04/2010US20100051334 Printed Circuit Board and Method of Manufacturing the Same
03/04/2010US20100051333 Conductive ink, conductive circuit and non-contact media
03/04/2010US20100051329 Printed circuit board and method of manufacturing the same
03/04/2010US20100051321 Printed circuit board and method of producing the same
03/04/2010US20100050430 Method for Holding and Carrying Substrate
03/04/2010US20100050429 Component mounting method
03/04/2010US20100050426 System for mounting components on boards
03/04/2010DE102009037795A1 Elektrischer Schalter Electric switch
03/04/2010DE102008041538A1 Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn A method of hot-stamping at least one strip conductor on a substrate as well as substrate with at least one conductor track
03/04/2010DE102008041497A1 Bauteil mit einem mechanischen Kontakt und Verfahren zur Herstellung des Bauteils Component having a mechanical contact and method for producing the component
03/04/2010DE102008039921A1 Electronic device e.g. electronic guiding device, for use in vehicle, has free space formed between discrete element and component side of board, where openings of printed circuit board and free space are filled with adhesive mass
03/04/2010DE102008037706B3 Vorrichtung zum Löten von Werkstücken sowie Verfahren zum Betieb einer solchen Vorrichtung Apparatus for soldering tools and the method of con- sumption During operation of such a device
03/03/2010EP2159270A1 Method for manufacturing electrically conductive structures
03/03/2010EP2158997A2 Control of the porosity of metal pastes for pressure-free low temperature sinter-process
03/03/2010EP2158797A2 Methods for integration of thin-film capacitors into the build-up layers of a printed wiring board
03/03/2010EP1723581B1 Flat transponder and method for the production thereof
03/03/2010EP1062849B1 Circuit board features with reduced parasitic capacitance and method therefor
03/03/2010CN201418211Y Flexible circuit board reflow soldering protective fixture
03/03/2010CN201418210Y Connection structure between circuit board and wires welded on the circuit board
03/03/2010CN201418209Y Circuit board
03/03/2010CN201418208Y Printed circuit board adopting direct interconnection between daughter board and mother board
03/03/2010CN101663926A Component-incorporating module and its manufacturing method
03/03/2010CN101662897A Manufacturing method for multilayer stacking printed wiring board
03/03/2010CN101662896A Method for manufacturing printed wiring board
03/03/2010CN101662895A Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board
03/03/2010CN101662894A Encapsulating base plate and encapsulating structure
03/03/2010CN101662893A Manufacturing method for printed wiring board with dense disk holes