| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/25/2010 | DE202009014291U1 Kontakt zur Oberflächenmontage Contact surface mount |
| 03/25/2010 | DE102008050668A1 Terminal element for supplying current into conducting path of printed circuit board, has two contact pins that are attached at contact element and protrude over soldering surface level of contact feet |
| 03/25/2010 | DE102008048459A1 Producing conductive structures on surface of polymer molded bodies, comprises providing polymer molded body from a polymer phase containing carbon nanotubes and thermally treating a surface of the polymer molded body |
| 03/25/2010 | DE102008047113A1 System for lift-dip soldering of the components, comprises a first zone, in which a protective gas is introduced and the solder baths and scooping tools are present, and a unit for forming a second zone for the components to be soldered |
| 03/25/2010 | DE102006013506B4 Elektrischer Steckeranschluss Electrical connector |
| 03/24/2010 | EP2166825A1 Solderable electronic module with printed circuit board |
| 03/24/2010 | EP2166824A1 Multilayer circuit board and motor driving circuit board |
| 03/24/2010 | EP2165851A1 Transfer films for burning and method of forming substrate with functional pattern |
| 03/24/2010 | EP2165583A1 Automated direct emulsion process for making printed circuits and multilayer printed circuits |
| 03/24/2010 | EP2165582A1 Compositions and methods for creating electronic circuitry |
| 03/24/2010 | EP2165581A1 Compositions and methods for creating electronic circuitry |
| 03/24/2010 | EP2165580A2 Component support for closing systems |
| 03/24/2010 | EP2165362A1 Low resistance through-wafer via |
| 03/24/2010 | EP2165007A1 A method for etching copper and recovery of the spent etching solution |
| 03/24/2010 | EP1581033A9 Metallic platelet for electrical connection, electric component comprising this platelet and connection adapter |
| 03/24/2010 | CN201430724Y Special clamper for BGA camera module flexible circuit board mounting |
| 03/24/2010 | CN201430723Y Digital control engraving machine |
| 03/24/2010 | CN101683011A Method for producing multilayer ceramic substrate and composite sheet |
| 03/24/2010 | CN101683010A Method for the production of laminated ceramic electronic parts |
| 03/24/2010 | CN101683009A Flexible circuit |
| 03/24/2010 | CN101683008A Composite multilayer wiring board |
| 03/24/2010 | CN101683007A Laminated wiring board and method for manufacturing the same |
| 03/24/2010 | CN101683006A Circuit board having built-in electronic parts and its manufacturing method |
| 03/24/2010 | CN101683005A Circuit materials, multilayer circuits, and methods of manufacture thereof |
| 03/24/2010 | CN101683004A Method for manufacturing multilayer printed wiring board |
| 03/24/2010 | CN101683003A Manufacturing method of the thin film ceramic multi layer substrate |
| 03/24/2010 | CN101683002A Heating furnace |
| 03/24/2010 | CN101683001A Solder ball mounting method |
| 03/24/2010 | CN101683000A Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires |
| 03/24/2010 | CN101682999A Insulating resin composition |
| 03/24/2010 | CN101682998A Printed circuit boards |
| 03/24/2010 | CN101682997A Method and device for applying media to flat substrates |
| 03/24/2010 | CN101682996A Method for the production of polymer-coated metal foils, and use thereof |
| 03/24/2010 | CN101682995A Method for the production of metal-coated base laminates |
| 03/24/2010 | CN101682994A Manufacturing method of fpcb |
| 03/24/2010 | CN101682988A Circuit connecting material and connecting structure for circuit member |
| 03/24/2010 | CN101682983A Wiring substrate, semiconductor package, and electronic device |
| 03/24/2010 | CN101682981A Control device of a motor vehicle |
| 03/24/2010 | CN101681899A Electronic assemblies without solder and methods for their manufacture |
| 03/24/2010 | CN101681891A Solder precoated substrate, mounting substrate, and solder precoating method |
| 03/24/2010 | CN101681860A Method of transferring adhesive film |
| 03/24/2010 | CN101681858A Electronic component connecting method and joined body |
| 03/24/2010 | CN101681855A Electric device, connecting method and adhesive film |
| 03/24/2010 | CN101681851A connecting microsized devices using ablative films |
| 03/24/2010 | CN101681107A Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board |
| 03/24/2010 | CN101679612A Resin composition for interlayer insulation of multilayer printed wiring board |
| 03/24/2010 | CN101678672A Method and apparatus for adjusting a substrate support |
| 03/24/2010 | CN101678671A Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production |
| 03/24/2010 | CN101677493A Making method of circuit board and circuit structure |
| 03/24/2010 | CN101677492A Manufacturing technology of printed circuit board (PCB) |
| 03/24/2010 | CN101677491A Embedded structure and method for making the same |
| 03/24/2010 | CN101677490A Multidirectional fluctuation board leveling mechanism |
| 03/24/2010 | CN101677489A Circuit board structure and manufacturing method thereof |
| 03/24/2010 | CN101677487A Printed wiring board and method for manufacturing the same |
| 03/24/2010 | CN101677486A Printed circuit board and manufacturing method thereof |
| 03/24/2010 | CN101677068A Copper core layer multilayer packaging substrate manufacturing method |
| 03/24/2010 | CN101677067A Copper core layer multilayer packaging substrate manufacturing method |
| 03/24/2010 | CN101677066A Build-up circuit board manufacturing method |
| 03/24/2010 | CN101676059A Method and device for perforating printed circuit board |
| 03/24/2010 | CN100596267C Method for setting a reference value for substrate inspection, device and program using the method |
| 03/24/2010 | CN100596263C Multilayered printed-circuit board, and method for manufacturing same |
| 03/24/2010 | CN100596262C Method for mutually connecting circuit boards |
| 03/24/2010 | CN100596261C Manual pasting method for mobile phone camera module group |
| 03/24/2010 | CN100596260C Method of attaching a solder element to a contact and the contact assembly formed thereby |
| 03/24/2010 | CN100596259C Method of manufacturing circuit board |
| 03/24/2010 | CN100596258C Method for manufacturing a circuit board structure, and a circuit board structure |
| 03/24/2010 | CN100596257C Method for preparing flexibility printed circuit board using PET as base material |
| 03/24/2010 | CN100596256C Apparatus and methods for continuously depositing a pattern of material onto a substrate |
| 03/24/2010 | CN100596255C Making method and structure for high power thin line carrier board |
| 03/24/2010 | CN100596254C Printed circuit boards |
| 03/24/2010 | CN100595913C Package for semiconductor devices |
| 03/24/2010 | CN100595898C Component mounting apparatus and component mounting method |
| 03/24/2010 | CN100595672C Photosensitive resin composition and process for production of printed wiring boards with the same |
| 03/24/2010 | CN100595343C Electrolytic copper plating bath and plating process therewith |
| 03/24/2010 | CN100595064C Liquid ejection apparatus, liquid ejection method, and method for forming wiring pattern of circuit board |
| 03/23/2010 | US7684202 Structure for mounting multifunctional vibrating actuator on circuit board |
| 03/23/2010 | US7683482 Electronic component unit |
| 03/23/2010 | US7683107 Ink jet printable thick film compositions and processes |
| 03/23/2010 | US7682691 Resin composition of layered silicate |
| 03/23/2010 | US7682552 Capacitive measurement method and system for nanoimprint process monitoring |
| 03/23/2010 | US7682468 Lead-free solder alloy |
| 03/23/2010 | US7682432 Adhesion promotion in printed circuit boards |
| 03/23/2010 | US7681777 A lead-free solder paste formed by blending an alloy powder and a flux; the alloy is a powder mixture formed by mixing at least one powder of a tin/zinc based alloy and at least one powder of a tin/silver based alloy; soldering electronic equipment; printed circuit board having soldered joints |
| 03/23/2010 | US7681309 Method for interconnecting an integrated circuit multiple die assembly |
| 03/23/2010 | US7681308 Fabrication method of semiconductor integrated circuit device |
| 03/23/2010 | US7681307 Soldering a flexible circuit |
| 03/23/2010 | US7681306 Method of forming an assembly to house one or more micro components |
| 03/23/2010 | US7681302 Method for manufacturing a hard disk drive arm |
| 03/23/2010 | CA2478688C Plug for terminal blocks and method for its production |
| 03/23/2010 | CA2396566C Conditioning of through holes and glass |
| 03/18/2010 | WO2010030505A1 Cleaning and testing ionic cleanliness of electronic assemblies |
| 03/18/2010 | WO2010030059A1 Multi layer circuit board and manufacturing method of the same |
| 03/18/2010 | WO2010029934A1 Substrate and process for forming electroconductive pattern |
| 03/18/2010 | WO2010029719A1 Chargeable powder for forming conductive pattern and multilayer ceramic electronic component using same |
| 03/18/2010 | WO2010029635A1 Method for metallic wiring formation and electronic component comprising metallic wiring |
| 03/18/2010 | WO2010029611A1 Multilayer flexible printed wiring board and electronic device |
| 03/18/2010 | WO2010029169A1 Solder material comprising a reactive filler material, carrier element or component comprising said type of solder material and use of a fluxing agent |
| 03/18/2010 | WO2009011696A8 A device and method for reparing a microelectromechanical system |
| 03/18/2010 | US20100070204 Damage index predicting system and method for predicting damage-related index |
| 03/18/2010 | US20100068880 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |