| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/08/2010 | WO2010038753A1 Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive |
| 04/08/2010 | WO2010038668A1 Flux composition and soldering paste composition |
| 04/08/2010 | WO2010038570A1 Functional layer manufacturing method, functional layer and electronic device |
| 04/08/2010 | WO2010038559A1 Method for manufacturing printed wiring board and printed wiring board |
| 04/08/2010 | WO2010038543A1 Photosensitive siloxane polyimide resin composition |
| 04/08/2010 | WO2010038532A1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 04/08/2010 | WO2010038531A1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 04/08/2010 | WO2010038489A1 Wiring board with built-in electronic component and method for manufacturing the wiring board |
| 04/08/2010 | WO2010038440A1 Electronic component mounting system |
| 04/08/2010 | WO2010038439A1 Electronic component mounting system |
| 04/08/2010 | WO2010038438A1 Electronic component mounting system and electronic component mounting method |
| 04/08/2010 | WO2010038437A1 Electronic component mounting system and electronic component mounting method |
| 04/08/2010 | WO2010037150A1 Method for treating the surface of a planar object, planar object and use |
| 04/08/2010 | WO2009141551A3 Electroplating composition and process for coating a semiconductor substrate using said composition |
| 04/08/2010 | US20100087118 Mounting arrangement and method for light emitting diodes |
| 04/08/2010 | US20100086793 Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film |
| 04/08/2010 | US20100085718 Window base material, card with embedded module, and manufacturing method of card with embedded module |
| 04/08/2010 | US20100085717 Multi-diameter unplugged component hole(s) on a printed circuit board (pcb) |
| 04/08/2010 | US20100085715 Printed electronic component assembly enabled by low temperature processing |
| 04/08/2010 | US20100085682 Laminated ceramic electronic component and method for manufacturing the same |
| 04/08/2010 | US20100085402 Printhead Integrated Circuit With A Solenoid Piston |
| 04/08/2010 | US20100084850 Security document containing an authentication device |
| 04/08/2010 | US20100084751 Double Broken Seal Ring |
| 04/08/2010 | US20100084727 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device |
| 04/08/2010 | US20100084178 bond strength and interconnection in a via |
| 04/08/2010 | US20100084177 Electronic circuit device |
| 04/08/2010 | US20100084176 Preserving stopband characteristics of electromagnetic bandgap structures in circuit boards |
| 04/08/2010 | US20100084174 Sealing material and mounting method using the sealing material |
| 04/08/2010 | US20100084168 Manufacturing method of a flexible printed circuit board and a structure thereof |
| 04/08/2010 | US20100084164 Electronic component mounting method |
| 04/08/2010 | US20100083496 Compliant membrane thin film interposer probe for integrated circuit device testing |
| 04/08/2010 | US20100083495 Method for manufacturing substrate having built-in components |
| 04/08/2010 | US20100083494 Bonding Tool for Mounting Semiconductor Chips |
| 04/08/2010 | US20100083493 Transfer tape strap process |
| 04/08/2010 | US20100083492 Suspension board with circuit and producing method thereof |
| 04/08/2010 | US20100083491 Electonic component mounting apparatus |
| 04/08/2010 | US20100083490 Multilayer circuit board and method for manufacturing the same |
| 04/08/2010 | DE19943388B4 Vorrichtung zum Prüfen von Leiterplatten An apparatus for testing printed circuit boards |
| 04/08/2010 | DE10238320B4 Keramische Leiterplatte und Verfahren zu ihrer Herstellung Ceramic printed circuit board and process for its preparation |
| 04/08/2010 | DE102008050879A1 Sealing i.e. flat sealing, for preventing penetration of e.g. moisture in protection region between magnetic head and device plug receptacle, has component attached to conductor path section and detecting current flowing at section |
| 04/08/2010 | DE102008048874A1 Beschichtungen für elektronische Schaltungen Coatings for electronic circuits |
| 04/08/2010 | DE102008031633B4 Anordnung zum Befestigen eines elektrischen Bauelements auf einem Träger Arrangement for fastening an electrical component on a support |
| 04/07/2010 | EP2173148A1 Ceramic multilayer substrate |
| 04/07/2010 | EP2173147A1 Wiring board and its manufacturing method |
| 04/07/2010 | EP2173146A1 Wiring board and manufacturing method thereof |
| 04/07/2010 | EP2173145A2 Manufacturing method of a flexible printed circuit board and a structure thereof |
| 04/07/2010 | EP2172806A2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board |
| 04/07/2010 | EP2172524A1 Resin composition and its use |
| 04/07/2010 | EP2172089A1 Multilayer wiring element having pin interface |
| 04/07/2010 | EP2172088A1 Method for preparing a patterned electric circuit |
| 04/07/2010 | EP2172087A2 Display device, in particular transparent multimedia façade |
| 04/07/2010 | EP2171797A1 A panel antenna and method of forming a panel antenna |
| 04/07/2010 | EP2170455A1 Flexible circuit electrode array |
| 04/07/2010 | EP1789205B1 Method of forming uniform lines on a substrate |
| 04/07/2010 | EP1145845B1 Composite film |
| 04/07/2010 | CN201436833U An automatic tin soldering machine |
| 04/07/2010 | CN1939104B Rigid-flexible board and manufacturing method thereof |
| 04/07/2010 | CN1767265B Graduated stiffness for electrical connections in tires |
| 04/07/2010 | CN101692757A Process for manufacturing 12OZ thick copper multilayer circuit board |
| 04/07/2010 | CN101692441A Packaging structure of printed circuit board |
| 04/07/2010 | CN101690988A Small wave crest clearing device of wave crest soldering machine |
| 04/07/2010 | CN101312618B Circuit board bearing and transferring construction of reflow furnace |
| 04/07/2010 | CN101299902B Circuit structure of circuit board and circuit technique thereof |
| 04/07/2010 | CN101071156B Multi-connecting board bad-product detecting device and method |
| 04/07/2010 | CN101069458B Multilayer printed wiring board |
| 04/06/2010 | US7693382 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication |
| 04/06/2010 | US7692301 Stitched micro-via to enhance adhesion and mechanical strength |
| 04/06/2010 | US7692119 Reflow furnace |
| 04/06/2010 | US7692103 Wiring substrate and manufacturing process of the same |
| 04/06/2010 | US7691961 Polyimide film and use thereof |
| 04/06/2010 | US7691680 Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 04/06/2010 | US7691673 Electronic parts packaging structure and method of manufacturing the same |
| 04/06/2010 | US7691664 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 04/06/2010 | US7691487 Electrodeposited copper foil with carrier foil |
| 04/06/2010 | US7691458 Carrier substrate with a thermochromatic coating |
| 04/06/2010 | US7691189 electroless plating solution comprising aqueous solution of 0.025-0.25 mol/L basic compound, 0.03-0.15 mol/L reducing agent, 0.02-0.06 mol/L copper ion, 0.05-0.3 mol/L tartaric acid; nickel ion formed from nickel chloride or nickel sulfate; reducing agent comprises formaldehyde or hydrazine; uniformity |
| 04/06/2010 | US7690110 plating copper in walls of circuit board via to form first plated through hole, applying thin layer of first adhesive promotor to surface of plated via, vacuum depositing high dielectric strength organic layer unto first adhesive promoter, applying second layer of adhesive promoter over organic layer |
| 04/06/2010 | US7690109 Method of manufacturing a multilayer wiring board |
| 04/06/2010 | US7690108 Self-compensating connector support method and apparatus |
| 04/06/2010 | US7690107 Method for aligning and installing flexible circuit interconnects |
| 04/06/2010 | US7690106 Ceramic header method |
| 04/06/2010 | US7690105 Method for conserving space in a circuit |
| 04/06/2010 | US7690104 Technique for reducing wasted material on a printed circuit board panel |
| 04/06/2010 | US7690103 Method of forming a printed circuit board with improved via design |
| 04/01/2010 | WO2010036529A1 Modulating polarization voltage of amperometric sensors |
| 04/01/2010 | WO2010036496A1 Printed circuit board for harsh environments |
| 04/01/2010 | WO2010036114A2 Method and kit for manufacturing metal nanoparticles and metal-containing nanostructured composite materials |
| 04/01/2010 | WO2010036113A1 Kit for preparing a conductive pattern |
| 04/01/2010 | WO2010036075A2 Cliche for off-set printing and product manufactured using the same |
| 04/01/2010 | WO2010035866A1 Package substrate for mounting semiconductor element and method for manufacturing the package substrate |
| 04/01/2010 | WO2010035865A1 Package substrate for mounting semiconductor element and method for manufacturing the package substrate |
| 04/01/2010 | WO2010035622A1 Method for forming wiring and apparatus for forming wiring |
| 04/01/2010 | WO2010035601A1 Printed wiring board and method for manufacturing same |
| 04/01/2010 | WO2010035551A1 Substrate module and method for manufacturing the same |
| 04/01/2010 | WO2010035263A1 System and method for conveyor based printing |
| 04/01/2010 | WO2010035235A2 Transferring assembly and method for transferring a radiofrequency identification device onto an object |
| 04/01/2010 | WO2010034545A1 Housing for an electrical circuit |
| 04/01/2010 | WO2010034194A1 Multilayer circuit board and production method thereof and communication device |
| 04/01/2010 | WO2010034047A1 Method for improving the corrosion resistance of an electronic component, particularly of conductors of a printed circuit board |
| 04/01/2010 | WO2009156993A3 Method for non-contact materials deposition |