| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/15/2010 | WO2010041589A1 Composite module |
| 04/15/2010 | WO2010040399A1 Method for protecting a condutive material structure provided on a carrier |
| 04/15/2010 | WO2009132861A3 Aqueous, acid bath and method for the electrolytic deposition of copper |
| 04/15/2010 | WO2008063138A3 An improved ball mounting apparatus and method |
| 04/15/2010 | US20100094607 Method of reducing solder wicking on a substrate |
| 04/15/2010 | US20100094279 Circuit for a catheter or sheath and method of forming same |
| 04/15/2010 | US20100091817 Turbocharger Protection Device |
| 04/15/2010 | US20100091471 Circuit board having isolation cover and assembling method thereof |
| 04/15/2010 | US20100090781 Sheet-like composite electronic component and method for manufacturing same |
| 04/15/2010 | US20100089891 Method of preparing an antenna |
| 04/15/2010 | US20100089631 Wiring board and manufacturing method of the same |
| 04/15/2010 | US20100089630 Crossover |
| 04/15/2010 | US20100089627 Multilayer three-dimensional circuit structure and manufacturing method thereof |
| 04/15/2010 | US20100089626 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof |
| 04/15/2010 | US20100089620 Electronic Component Module and Method for the Production Thereof |
| 04/15/2010 | US20100089619 Circuit board of communication product and manufacturing method thereof |
| 04/15/2010 | US20100088888 Lithographic contact elements |
| 04/15/2010 | US20100088887 Circuit board and method for manufacturing the same |
| 04/15/2010 | US20100088886 Packaging method for assembling captive screw to printed circuit board |
| 04/15/2010 | DE20321792U1 Mittels Druckformerzeugung herstellbare Leiterplatte By pressure waveform generation manufacturable PCB |
| 04/15/2010 | DE102008060645A1 Leiterplatte mit ausgerichteten Nanostrukturen PCB with aligned nanostructures |
| 04/15/2010 | DE102008050798A1 Method for positioning and fixing e.g. semiconductor chip, on e.g. direct copper Bonding substrate, involves pressing components together such that electrical connection and mechanical fixing of components are obtained |
| 04/15/2010 | DE102008047114A1 Device for lifting-immersing soldering comprises a workpiece support with a guiding unit for a cropping tool |
| 04/15/2010 | DE102008042810A1 Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats A method for preparing a substrate provided with electric elements |
| 04/15/2010 | DE102008036152B3 Selective partial coating of sheet materials, e.g. to make conductive patterns on textiles, involves applying a mask of intumescent material, coating the entire surface by thermal spraying and then removing the mask |
| 04/15/2010 | DE102006051542B4 LED-Signalscheinwerfer, insbesondere für Schienenfahrzeuge, sowie LED-Halter für einen solchen Scheinwerfer LED signal lights, especially for rail vehicles, and LED holder for such headlamps |
| 04/14/2010 | EP2175706A1 Composite for multilayer circuit board |
| 04/14/2010 | EP2175705A1 Process and device for assembly of a pastille on a substrate by supply of brazing material |
| 04/14/2010 | EP2175704A1 An arrangement for electrically and mechanically connecting electronic components to each other |
| 04/14/2010 | EP2175527A1 Mechanical reclosable fastener component |
| 04/14/2010 | EP2175485A2 Connection between two soldered inserts and method of manufacturing the same |
| 04/14/2010 | EP2174535A1 Method for providing hermetic electrical feedthrough |
| 04/14/2010 | EP2174534A2 Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board |
| 04/14/2010 | EP2174324A1 Conductive patterns and methods of using them |
| 04/14/2010 | EP1727629B1 Method of processing multicomponent, composite and combined materials and use of so separated components |
| 04/14/2010 | EP1550358B1 Printed board comprising at least one stiff area and at least one flexible area, and method for the production of stiff-flexible printed boards |
| 04/14/2010 | EP1503216B1 Sheet-form connector and production method and application therefor |
| 04/14/2010 | EP1112530B1 Method for producing micro-openings |
| 04/14/2010 | CN201438792U Transmission structure of SMT buffer convey |
| 04/14/2010 | CN201438791U Weld assembly |
| 04/14/2010 | CN201438790U Jig for pressing combination |
| 04/14/2010 | CN201438788U Printed circuit board and module with surface mount component |
| 04/14/2010 | CN201438787U 电路板 Board |
| 04/14/2010 | CN201438785U LED printed circuit pressure plate |
| 04/14/2010 | CN201438784U Irregular cutting circuit board |
| 04/14/2010 | CN201438259U 曝光机 Exposure Machine |
| 04/14/2010 | CN201437180U Sealing device for soldering pot of wave crest soldering machine |
| 04/14/2010 | CN201437179U Nitrogen heating and protecting device of spot soldering pot |
| 04/14/2010 | CN201437177U Soldering furnace body of crest welder and soldering furnace |
| 04/14/2010 | CN201437176U Soldering furnace of crest soldering machine |
| 04/14/2010 | CN1975944B Thin-film laminate, and electronic parts |
| 04/14/2010 | CN1969065B Device and method for electrolytically treating flat work pieces |
| 04/14/2010 | CN1917743B Method of forming metal plate pattern and circuit board |
| 04/14/2010 | CN1910100B Coverlay film laminating device and cutting and carrying device thereof |
| 04/14/2010 | CN1897793B Method of treating and probing a path |
| 04/14/2010 | CN1874651B Wired circuit board and production method thereof |
| 04/14/2010 | CN1820942B Apparatus and method for manufacturing copper clad laminate |
| 04/14/2010 | CN1806301B High-frequency heating device |
| 04/14/2010 | CN1741707B Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same |
| 04/14/2010 | CN1689811B Ejection apparatus and method of manufacturing photoelectricity unit |
| 04/14/2010 | CN1585107B Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards |
| 04/14/2010 | CN1532256B Adhesive for circuit connection |
| 04/14/2010 | CN101695224A Method for processing multilayer printed circuit board |
| 04/14/2010 | CN101695223A Method for producing circuit board |
| 04/14/2010 | CN101695222A Preparation method of non-curling high-adhesiveness glue-free flexible copper-clad plate |
| 04/14/2010 | CN101695221A Technique for accommodating electronic components on a multilayer signal routing device |
| 04/14/2010 | CN101695220A Method for manufacturing PCB with stepped groove |
| 04/14/2010 | CN101695219A Selective immersion process of PCB |
| 04/14/2010 | CN101695218A Method for manufacturing printed circuit board with half-edge hole |
| 04/14/2010 | CN101695217A Method for producing printed board combining rigidness and flexibleness |
| 04/14/2010 | CN101695216A Printed circuit board and manufacturing method thereof |
| 04/14/2010 | CN101695215A Copper foil with low profile bond enhancement |
| 04/14/2010 | CN101693318A Solder pre-coating method and workpiece for electronic devices |
| 04/14/2010 | CN101693315A Molten state lead-free welding flux anti-oxidation reducing agent and preparation process thereof |
| 04/14/2010 | CN101437358B Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| 04/14/2010 | CN101326865B Apparatus and method for soldering flat work piece |
| 04/14/2010 | CN101326864B Padless substrate for surface mounted components |
| 04/14/2010 | CN101267714B Electronic device and electronic component mounting method |
| 04/14/2010 | CN101104727B Halogen-free resin composition and resin-coated copper foil of the same for high-density interconnection |
| 04/14/2010 | CN101090075B Manufacturing method for vertical built-in capacity substrate and its structure |
| 04/14/2010 | CN101036422B Long film circuit board, and production method and production device therefor |
| 04/13/2010 | US7697300 Electronic unit and method for manufacturing an electronic unit |
| 04/13/2010 | US7696849 Electronic component |
| 04/13/2010 | US7696617 Package for semiconductor devices |
| 04/13/2010 | US7696614 Driver module structure |
| 04/13/2010 | US7696613 Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same |
| 04/13/2010 | US7696611 Conductive material compositions, apparatus, systems, and methods |
| 04/13/2010 | US7696519 Wiring substrate, electronic device, electro-optical device, and electronic apparatus |
| 04/13/2010 | US7696007 Semiconductor package board using a metal base |
| 04/13/2010 | US7696005 Method for manufacturing an electronic module in an installation base |
| 04/13/2010 | US7695887 Method for producing pattern-forming body |
| 04/13/2010 | US7695605 Tin plating method |
| 04/13/2010 | US7694869 Universal mold for injection molding of solder |
| 04/13/2010 | US7694868 Method and apparatus for mounting at least two types of electronic components |
| 04/13/2010 | US7694416 Producing method of wired circuit board |
| 04/13/2010 | US7694415 Method of manufacturing component-embedded printed wiring board |
| 04/13/2010 | US7694414 Method of manufacturing multilayered electronic component |
| 04/08/2010 | WO2010040121A1 Production process for surface-mounting ceramic led package, surface-mounting ceramic led package produced by said production process, and mold for producing said package |
| 04/08/2010 | WO2010038977A2 Entry sheet for perforating pcb (printed circuit board) and fabrication method thereof |
| 04/08/2010 | WO2010038894A1 Treatment method using plasma |