Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2010
04/28/2010CN101699351A Solder resist composition and printing circuit board formed thereby
04/28/2010CN101698373A Method for discharging liquid material, method for manufacturing wiring board, method for manufacturing color filter, and method for manufacturing organic EL(electroluminescent) element
04/28/2010CN101698261A Air-out plate of reflow furnace
04/28/2010CN101698260A Full-automatic ball attachment machine
04/28/2010CN101698259A Soldering tin jet device
04/28/2010CN101698257A Soldering tin jet device
04/28/2010CN101698256A Jet plate
04/28/2010CN101698255A Heat transferring device
04/28/2010CN101698254A Metal heating apparatus, metal heating method, and light source apparatus
04/27/2010US7706046 Rearview mirror element having a circuit mounted to the rear surface of the element
04/27/2010US7705812 Liquid crystal display device having a drive IC mounted on a flexible board directly connected to a liquid crystal panel
04/27/2010US7705697 Waveguide coupler
04/27/2010US7705452 Carrier assembly for an integrated circuit
04/27/2010US7705420 Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
04/27/2010US7705247 Built-up printed circuit board with stack type via-holes
04/27/2010US7704799 Method of manufacturing wiring substrate
04/27/2010US7704365 uniform thickness via aligning lines of electric force uniformly and parallel by disposing pair of conductive perforated plates, which are electrically connected to each other, between plating metals immersed in plating solution
04/27/2010US7703889 Printed wiring board and electric device using the same
04/27/2010US7703657 Device for mounting electric component
04/27/2010US7703203 Method of making an electrical circuit
04/27/2010US7703202 Method for manufacturing a transmission line equalizer
04/27/2010US7703199 Method to accommodate increase in volume expansion during solder reflow
04/27/2010US7703198 Method of manufacturing capacitor-embedded low temperature co-fired ceramic substrate
04/27/2010US7703195 Methods of manipulating electrical wall fixtures
04/22/2010WO2010044315A1 Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate
04/22/2010WO2010043540A1 Method for producing a ductile substrate provided with electrical elements
04/22/2010WO2010043291A1 Method for improving the adhesion between silver surfaces and resin materials
04/22/2010WO2010011841A3 Metal nanoparticle ink compositions
04/22/2010WO2010002962A3 Hydrophobic circuit board coating of electrotransport drug delivery devices
04/22/2010WO2009057102A3 Laminated digitizer sensor
04/22/2010US20100099274 Sinking Type Electrical Connector and Assembly of the Sinking Type Electrical Connector and a Circuit Board
04/22/2010US20100098937 Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
04/22/2010US20100098374 Optoelectronic component based on premold technology
04/22/2010US20100097776 Assembling Stacked Substrates That Can Form 3-D Structures
04/22/2010US20100097770 Printed circuit board and manufacturing method thereof
04/22/2010US20100096178 Non-shirinkage ceramic substrate and manufacturing method thereof
04/22/2010US20100096177 Coreless substrate having filled via pad and method of manufacturing the same
04/22/2010US20100096170 Circuit board and layout method thereof
04/22/2010US20100096071 METHOD FOR MANUFACTURING HYDROGEN SENSORS USING Pd NANO WIRE
04/22/2010US20100095523 Multilayer printed wiring board for semiconductor devices and method for manufacturing the board
04/22/2010US20100095522 Method of manufacture of an identification wristband construction
04/22/2010US20100095519 Apparatus for manufacturing wireless communication device
04/22/2010DE102008052616A1 Electrical arrangement for use in pneumatic valve unit for contacting electrical/hydraulic components, has conductive path region provided at lower side of one plate and coming in contact with path regions at upper side of another plate
04/22/2010CA2740786A1 Method and apparatus for reacting thin films on low-temperature substrates at high speeds
04/21/2010EP2178354A1 A method of connecting printed circuit boards and corresponding arrangement
04/21/2010EP2178353A1 Circuit module, and electronic device using the module
04/21/2010EP2178352A2 Method and apparatus for accurately applying structures to a substrate
04/21/2010EP2178351A1 Method for the manufacture of products including conductive tracks.
04/21/2010EP2178116A1 Ic mounting substrate and method for manufacturing the same
04/21/2010EP2178094A1 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
04/21/2010EP2177645A1 Method for structuring inorganic or organic layers
04/21/2010EP2177568A2 Impregnating resin
04/21/2010EP2177305A1 In-containing lead-free solder for on-vehicle electronic circuit
04/21/2010EP2177304A1 Lead-free solder for vehicle, and in-vehicle electronic circuit
04/21/2010EP1292999B1 Cylindrical battery clip for key fobs
04/21/2010EP1137333B1 Multilayer build-up wiring board
04/21/2010CN201440760U Buried hole and through hole structure of circuit board
04/21/2010CN201440759U Template for adjusting height of nozzle
04/21/2010CN201440758U Vehicle-mounted repair system
04/21/2010CN201440757U Warping correcting tool for printed circuit board
04/21/2010CN201440756U Sheet browned tin tool
04/21/2010CN201440755U Array circuit board
04/21/2010CN201440740U Heater monitoring device
04/21/2010CN201440190U Tool equipment for processing liquid crystal circuit board
04/21/2010CN201439258U Screen printing backing plate
04/21/2010CN201439148U Tin furnace lead-out rack with rotary function
04/21/2010CN1939718B Mounting structure of transverse leak-proof and silk screen printing device
04/21/2010CN1934293B Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display using the surface-treated copper
04/21/2010CN1906705B Conductive fine particle and anisotropic conductive material
04/21/2010CN1701137B Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conducti
04/21/2010CN1645253B Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board
04/21/2010CN1607897B Technique for interconnecting multilayer circuit boards
04/21/2010CN101697667A Method for making embedded hole in pad on circuit board
04/21/2010CN101697666A Circuit board plating device and method
04/21/2010CN101697665A Hot air levelling machine for processing circuit board
04/21/2010CN101697664A Dialing ear compression joint mechanism of circuit board
04/21/2010CN101697663A Circuit board and method for assembling surface joint elements and circuit board
04/21/2010CN101697662A High heat-resistance organic solder ability preservative
04/21/2010CN101697661A Methods for plugging hole of PCB and manufacturing double-sided PCB
04/21/2010CN101697660A Method for processing stepped groove bottom patterned circuit board
04/21/2010CN101695781A Heating device of solder-reflow furnace
04/21/2010CN101297610B Bending-type rigid printed wiring board and process for producing the same
04/21/2010CN101236943B Heat-radiation no-chip board film base plate with built-in chip and its making method
04/21/2010CN101213889B Method and device for removing micro component
04/21/2010CN101133689B Multi-layered printed circuit board comprising conductive test surfaces, and method for determining a misalignment of an inner layer
04/20/2010USRE41242 Package substrate
04/20/2010US7701069 Solder interface locking using unidirectional growth of an intermetallic compound
04/20/2010US7701053 Electronic component and method for producing the same
04/20/2010US7701047 Integrated-circuit chip with offset external pads and method for fabricating such a chip
04/20/2010US7700678 surface treatment using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder; by mixing with a curable polysiloxane, with ability to be cured into a cured product with electrical properties that have minimal changes over time
04/20/2010US7699672 Grouped element transmission channel link with pedestal aspects
04/20/2010US7699624 Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same
04/20/2010US7699440 Inkjet printhead with heater element close to drive circuits
04/20/2010US7699210 Soldering an electronics package to a motherboard
04/20/2010US7698812 using alumina ceramic sheets; resistant to thermal cracking; used in electrical heaters having ceramic support or bond, which heat large areas under periodic high thermal stress; toner fusers for electrophotography, household and industrial cooking surfaces, self-heating pots
04/20/2010US7698811 Method for manufacturing multilayer printed circuit boards using inner substrate
04/15/2010WO2010042407A1 Mechanical reclosable fastener component
04/15/2010WO2010041644A1 Polyamideimide resin, adhesive composition using the resin, ink for printed circuit board using the adhesive composition, cover lay film, adhesive sheet and printed circuit board
04/15/2010WO2010041621A1 Substrate having built-in functional element, method for manufacturing same, and electronic device
04/15/2010WO2010041614A1 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound
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