| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/05/2010 | CN1628282B Input device, mobile telephone, and mobile information device |
| 05/05/2010 | CN1607898B Circuit board fabrication method and circuit board |
| 05/05/2010 | CN1573445B Liquid crystal display device and method of fabricating the same |
| 05/05/2010 | CN1549336B 半导体装置 Semiconductor device |
| 05/05/2010 | CN1532919B Circuit device and its producing method |
| 05/05/2010 | CN1518099B Lead frame and its manufacturing method and semiconductor device using the lead frame |
| 05/05/2010 | CN1467832B Recovery processing method of an electrode |
| 05/05/2010 | CN101702870A Interconnection method of flexible board and rigid board and system |
| 05/05/2010 | CN101702869A Method for directly producing circuit boards from insulated substrate without cladding copper |
| 05/05/2010 | CN101702868A Method for keeping consistency of thickness of copper-clad plate |
| 05/05/2010 | CN101700593A Wave-soldering unit and mechanical gripper thereof |
| 05/05/2010 | CN101023717B Electrode substrate |
| 05/04/2010 | USRE41306 Liquid crystal display device having rubber bushes for receiving ends of a fluorescent tube and enabling connection of lamp cables thereat |
| 05/04/2010 | USRE41305 Liquid crystal display device having a mold case and rubber bushes for receiving ends of a fluorescent tube enabling connection of lamp cables thereat |
| 05/04/2010 | US7709968 Micro pin grid array with pin motion isolation |
| 05/04/2010 | US7709939 Metal-base circuit board and its manufacturing method |
| 05/04/2010 | US7709746 Pb-free solder-connected structure and electronic device |
| 05/04/2010 | US7709379 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof |
| 05/04/2010 | US7709159 Mask, mask forming method, pattern forming method, and wiring pattern forming method |
| 05/04/2010 | US7708910 Independently dispersed metal ultrafine particles-containing liquid dispersion |
| 05/04/2010 | US7708856 Hot pressing ceramic distortion control |
| 05/04/2010 | US7708848 Component bonding method and component bonding device |
| 05/04/2010 | US7708381 Fluid ejection device with resistive element close to drive circuits |
| 05/04/2010 | US7707715 Method of fabricating multilayer printed circuit board |
| 05/04/2010 | US7707713 Component-embedded circuit board fabrication method |
| 05/04/2010 | US7707712 Apparatus for assembling camera module |
| 05/04/2010 | US7707711 Acoustic noise reduction in a computer system having a vented cover |
| 04/29/2010 | WO2010047411A1 Thermosetting resin composition |
| 04/29/2010 | WO2010047384A1 Laser processing method and laser processing device |
| 04/29/2010 | WO2010047374A1 Adhesive film |
| 04/29/2010 | WO2010047253A1 Laminated film |
| 04/29/2010 | WO2010047228A1 Wiring board and method for manufacturing same |
| 04/29/2010 | WO2010047200A1 Anisotropic electroconductive film |
| 04/29/2010 | WO2010046235A1 Method to form solder deposits on substrates |
| 04/29/2010 | US20100104829 Process for thick film circuit patterning |
| 04/29/2010 | US20100103634 Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipment |
| 04/29/2010 | US20100103630 Anisotropic conductive material, connected structure, and production method thereof |
| 04/29/2010 | US20100103605 multi-configuration processor-memory substrate device |
| 04/29/2010 | US20100103604 Multi-configuration processor-memory substrate device |
| 04/29/2010 | US20100103138 Curved capacitive touch panel and manufacture method thereof |
| 04/29/2010 | US20100102903 Conformal reference planes in substrates |
| 04/29/2010 | US20100102127 Device for Protecting an Electronic Component |
| 04/29/2010 | US20100101962 Immersion method |
| 04/29/2010 | US20100101852 Multilayer printed wiring board with filled viahole structure |
| 04/29/2010 | US20100101851 Wiring substrate and method of manufacturing the same |
| 04/29/2010 | US20100101850 Printed circuit board and method of manufacturing the same |
| 04/29/2010 | US20100101849 Electronic component built-in substrate and method of manufacturing the same |
| 04/29/2010 | US20100101848 Substrate unit, information processor and method of manufacturing substrate unit |
| 04/29/2010 | US20100101847 Electronic component embedded printed circuit board and manufacturing method thereof |
| 04/29/2010 | US20100101844 Multi-piece board and fabrication method thereof |
| 04/29/2010 | US20100101840 Application of a self-assembled monolayer as an oxide inhibitor |
| 04/29/2010 | US20100101838 Multilayer printed wiring board |
| 04/29/2010 | US20100101836 Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate |
| 04/29/2010 | US20100101829 Magnetic nanowires for tco replacement |
| 04/29/2010 | US20100101084 Same layer microelectronic circuit patterning using hybrid laser projection patterning (lpp) and semi-additive patterning(sap) |
| 04/29/2010 | US20100101083 Method for fabricating circuit board structure with concave conductive cylinders |
| 04/29/2010 | US20100101082 Mounting apparatus, mounting method and board imaging device transfer method employed in the mounting apparatus |
| 04/29/2010 | US20100101081 Manufacturing method for protection circuit module of secondary battery |
| 04/29/2010 | DE19653499B4 Lotzuführgerät und Lotzuführverfahren Lotzuführgerät and Lotzuführverfahren |
| 04/29/2010 | DE112008000704T5 Kontaktlochbildungsverfahren, das ein elektrophotographisches Druckverfahren verwendet Contact hole formation method using an electrophotographic printing method |
| 04/29/2010 | DE102009008032A1 Selbstmontage von Bauelementen Self-assembly of components |
| 04/29/2010 | DE102009001628A1 Montagegerät Mounting device |
| 04/29/2010 | DE102004041035B4 Verfahren zum Befestigen von Bauteilen auf einem Substrat Method for fastening components on a substrate |
| 04/28/2010 | EP2180772A1 Multilayered wiring board and semiconductor device |
| 04/28/2010 | EP2180771A1 Wiring board and manufacturing method thereof |
| 04/28/2010 | EP2180770A1 Method to form solder deposits on substrates |
| 04/28/2010 | EP2180026A1 Adhesive composition, film-like adhesive, and connection structure for circuit member |
| 04/28/2010 | EP2179844A1 Release sheet |
| 04/28/2010 | EP2179634A1 High-speed router with backplane using multi-diameter drilled thru-holes and vias |
| 04/28/2010 | EP2179633A1 Method for producing thin, conductive structures on surfaces |
| 04/28/2010 | EP2179632A1 Substrate comprising a highly conductive layer |
| 04/28/2010 | EP2179426A2 Multilayer system comprising contact elements, and method for the production of a contact element for a multilayer system |
| 04/28/2010 | EP2178673A1 Method and apparatus for laser beam processing of an element with total transmission for light of at least 10-5 |
| 04/28/2010 | EP1965614B1 Circuit board connecting structure, circuit board connecting section, and electronic apparatus |
| 04/28/2010 | EP1455563B1 ELECTROMAGNETIC WAVE SHIELDED LIGHT−TRANSMISSIVE MATERIAL AND MANUFACTURING METHOD THEREOF |
| 04/28/2010 | CN201444723U Corrosion resistant device of alternating current servo controller |
| 04/28/2010 | CN1980522B Optical identifying point manufacture method for printed circuit board |
| 04/28/2010 | CN1960607B Method for pressfitting flexible circuit boards and vacuum, quick pressing device |
| 04/28/2010 | CN1898051B Fine metal particles and fine metal oxide particles in dry powder form, and use thereof |
| 04/28/2010 | CN1886707B Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same |
| 04/28/2010 | CN1856558B Adhesive aid composition |
| 04/28/2010 | CN1701952B Layer sequence for producing a composite material for electromechanical components |
| 04/28/2010 | CN1697164B Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape |
| 04/28/2010 | CN1684573B Mounting substrate |
| 04/28/2010 | CN1681099B Method for forming interconnection structure |
| 04/28/2010 | CN1620225B Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus |
| 04/28/2010 | CN1619731B Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
| 04/28/2010 | CN1595626B Tin-ball forming method for electronic component |
| 04/28/2010 | CN1578594B Copper compound and method for producing copper thin film using the same |
| 04/28/2010 | CN101699940A Manufacture method of golden finger printed board |
| 04/28/2010 | CN101699939A Method for rolling PCB |
| 04/28/2010 | CN101699938A Circuit board processing method and circuit board |
| 04/28/2010 | CN101699937A Method for producing stepped PCB board |
| 04/28/2010 | CN101699936A Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| 04/28/2010 | CN101699935A Method for producing locatable high heat conduction ceramic circuit board |
| 04/28/2010 | CN101699934A Method for producing conductive high heat conduction ceramic circuit board |
| 04/28/2010 | CN101699933A Production method of bright-copper-face high-heat-conductivity ceramic circuit board |
| 04/28/2010 | CN101699932A Method for producing high thermal conductivity ceramic circuit board |
| 04/28/2010 | CN101699931A Method for manufacturing high-heat conduction ceramic circuit board |
| 04/28/2010 | CN101699930A Glue filling and laminating method of circuit board |