| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/12/2010 | CN101707857A PCB welding machine and welding method |
| 05/12/2010 | CN101707856A Pulling plate device of wave-soldering furnace |
| 05/12/2010 | CN101707855A Welding equipment of circuit board and method |
| 05/12/2010 | CN101707854A Circuit board processing method and circuit board |
| 05/12/2010 | CN101704149A Locating guide device of wave-soldering furnace |
| 05/12/2010 | CN101704148A Adjustable solder machine |
| 05/12/2010 | CN101704147A Tinning furnace |
| 05/12/2010 | CN101207974B Electronic component mounting method and sensor device made by the method |
| 05/12/2010 | CN101155478B Method for multi-layer flexible printed circuit board vacuum laminating photosensory membrane and its fake attaching tools |
| 05/12/2010 | CN101151947B Ball capturing method and solder ball arrangement method |
| 05/12/2010 | CN101087673B Solder paste and electronic device |
| 05/12/2010 | CN101048036B Built-in film risitance and its manufacturing method, multi-layer substrate |
| 05/12/2010 | CN101026933B Printed circuit board waveguide |
| 05/11/2010 | US7715204 Ultrasound probe wiring apparatus |
| 05/11/2010 | US7714598 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/11/2010 | US7714232 Circuit device and method of manufacturing the same |
| 05/11/2010 | US7713899 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 05/11/2010 | US7713872 Method of manufacturing semiconductor device and semiconductor device |
| 05/11/2010 | US7713790 Method and system of tape automated bonding |
| 05/11/2010 | US7713578 includes bank forming step of forming banks in predetermined pattern on substrate, disposing first liquid droplets made of a function liquid between banks to form pattern, disposing second liquid droplets made of function liquid on said first pattern, and drying step |
| 05/11/2010 | US7712874 Electrostatic suction type fluid discharge device, electrostatic suction type fluid discharge method, and plot pattern formation method using the same |
| 05/11/2010 | US7712649 Using a simultaneously tilting and moving bonding apparatus |
| 05/11/2010 | US7712432 Printing apparatus and method for bonding material |
| 05/11/2010 | US7712213 Angular encapsulation of tandem stacked printed circuit boards |
| 05/11/2010 | US7712212 Method for manufacturing printed wiring board |
| 05/11/2010 | US7712211 Method for packaging circuits and packaged circuits |
| 05/11/2010 | US7712210 Method of providing a printed circuit board with an edge connection portion |
| 05/11/2010 | CA2656773A1 Method for positioning and/or guiding at least one arbitrary process head for the metallization of thin substrates at a defined distance above the substrate surface |
| 05/06/2010 | WO2010051192A1 Molded components |
| 05/06/2010 | WO2010050896A1 Insulated metal substrate and method of forming the same |
| 05/06/2010 | WO2010050627A1 Printed wiring board and method for manufacturing same |
| 05/06/2010 | WO2010050472A1 Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device |
| 05/06/2010 | WO2010050397A1 Multi-piece substrate and method for manufacturing same |
| 05/06/2010 | WO2010050266A1 Method for surface treatment of copper and copper |
| 05/06/2010 | WO2010050209A1 Method and apparatus for bonding electronic component and flexible film substrate |
| 05/06/2010 | WO2010050193A1 Multilayer wiring substrate and method for producing same |
| 05/06/2010 | WO2010049730A1 Improvements relating to additive manufacturing processes |
| 05/06/2010 | WO2010049139A1 Operating device comprising a fastening element |
| 05/06/2010 | WO2010048654A1 Method for integrating an electronic component into a printed circuit board |
| 05/06/2010 | WO2010001208A3 Lead-free tin plated member and method of forming plating layer |
| 05/06/2010 | WO2009045932A8 Improved systems and methods for drilling holes in printed circuit boards |
| 05/06/2010 | US20100112829 Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity |
| 05/06/2010 | US20100112489 Efficient pitch multiplication process |
| 05/06/2010 | US20100112195 Method for the fabrication of conductive electronic features |
| 05/06/2010 | US20100110650 Soldering Strategies for Printed Circuit Board Assemblies |
| 05/06/2010 | US20100110647 Molded Memory Card With Write Protection Switch Assembly |
| 05/06/2010 | US20100109688 Printing of redistribution traces on electronic component |
| 05/06/2010 | US20100109142 Interposer for semiconductor package |
| 05/06/2010 | US20100108673 Plastic cap with ic tag and method of attaching ic tag to the cap |
| 05/06/2010 | US20100108637 Multilayer printed wiring board and method of manufacturing the same |
| 05/06/2010 | US20100108373 Double-stacked ebg structure |
| 05/06/2010 | US20100108371 Wiring board with built-in electronic component and method for manufacturing the same |
| 05/06/2010 | US20100108370 System and method of forming a patterned conformal structure |
| 05/06/2010 | US20100108368 Resin composition for forming insulating layer of printed wiring board |
| 05/06/2010 | US20100108366 Preparation method for an electroconductive patterned copper layer and a patterned copper layer formed by the method |
| 05/06/2010 | US20100107762 Acceleration sensor and method for its manufacture |
| 05/06/2010 | US20100107410 Component placement device as well as a method for transporting substrates through such a component placement device |
| 05/06/2010 | US20100107409 Method for Pulling and Cutting a Z-Axis Electrical Interconnector |
| 05/06/2010 | US20100107400 Method of manufacturing an acoustic mirror |
| 05/06/2010 | DE10361087B4 Gedruckte Schaltplatte mit eingebetteten Kondensatoren und Verfahren zur Herstellung derselben Printed circuit board with embedded capacitors and methods for making same |
| 05/06/2010 | DE102009046183A1 Vorrichtung mit einem magnetischen Bauelement und Verfahren zu dessen Herstellung Device with a magnetic component and method for its production |
| 05/06/2010 | DE102006043811B4 Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung Articles with a coating of electrically conductive polymer and precious / semi-precious metal as well as methods for their preparation |
| 05/06/2010 | DE10136114B4 Verfahren zur Herstellung eines flächigen Schaltungsträgers A process for producing a sheet-like circuit carrier |
| 05/06/2010 | CA2741925A1 Improvements relating to additive manufacturing processes |
| 05/05/2010 | EP2182787A1 Improvements relating to additive manufacturing processes |
| 05/05/2010 | EP2182786A1 Improved hot melt compositions |
| 05/05/2010 | EP2182630A1 Constant temperature type crystal oscillator |
| 05/05/2010 | EP2182585A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 05/05/2010 | EP2182097A1 Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface |
| 05/05/2010 | EP2182019A1 Heat curable resin compositon |
| 05/05/2010 | EP2181570A1 Electric circuit configuration and method for producing an electric circuit configuration |
| 05/05/2010 | EP2181569A1 Method for fabricating electrical bonding pads on a wafer |
| 05/05/2010 | EP1735820B1 Fabrication and use of superlattice |
| 05/05/2010 | CN201450672U 线路板焊接工装 PCB welding equipment |
| 05/05/2010 | CN201450671U Special clamp for hot air leveling of unit PCBs |
| 05/05/2010 | CN201450670U Automatic circuit board loading frame |
| 05/05/2010 | CN201450668U PCB and PCB base boards |
| 05/05/2010 | CN201450664U Ultra-long film spliced PCB |
| 05/05/2010 | CN201446763U Track presser device |
| 05/05/2010 | CN201446329U Wave soldering furnace claw piece |
| 05/05/2010 | CN1914356B Surface-treating agent for metal |
| 05/05/2010 | CN1914239B 固化性树脂组合物 The curable resin composition of the |
| 05/05/2010 | CN1910975B Providing differentiated levels of solder paste for a circuit paste for a circuit board |
| 05/05/2010 | CN1906984B Printed circuit board, a printed circuit assembly and electronic apparatus |
| 05/05/2010 | CN1906028B Continuous production method for both-sided conductor polyimide laminate |
| 05/05/2010 | CN1813084B Process for producing metal plating film, process for producing electronic part and plating film forming apparatus |
| 05/05/2010 | CN1791324B Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates |
| 05/05/2010 | CN1783227B Suspension board with circuit |
| 05/05/2010 | CN1761773B Novel imidazole compound and usage thereof |
| 05/05/2010 | CN1761379B Producing method of wired circuit board |
| 05/05/2010 | CN1747628B Electric equipment |
| 05/05/2010 | CN1744303B Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device |
| 05/05/2010 | CN1732565B Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
| 05/05/2010 | CN1728918B Circuitized substrate |
| 05/05/2010 | CN1717147B Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus |
| 05/05/2010 | CN1697099B Inductive devices and methods |
| 05/05/2010 | CN1694602B Flat flexible circuit board strucure with shield plane layer |
| 05/05/2010 | CN1678961B Removing solution |
| 05/05/2010 | CN1672222B Chip resistor and method of manufacturing the same |
| 05/05/2010 | CN1648640B Ingredient analysis method and ingredient analysis apparatus |