Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2010
05/19/2010CN101160193B Jet solder vessel
05/19/2010CN101009971B Wired-circuit-board assembly sheet
05/18/2010US7719851 Electronics module and method for manufacturing the same
05/18/2010US7719174 Surface mounting discharge tube has soldering tapers formed at peripheral edges of electrode side surfaces that seal and project outwardly from opposite ends of cylindrical ceramic envelope
05/18/2010US7718903 Component placement substrate and production method thereof
05/18/2010US7718902 Z interconnect structure and method
05/18/2010US7718901 Electronic parts substrate and method for manufacturing the same
05/18/2010US7718714 Photosetting, thermosetting liquid ink
05/18/2010US7718273 Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
05/18/2010US7718216 cross-linked by free-radical or cationic polymerization at low temperature; activated by heat or exposure to light to polymerize mixture
05/18/2010US7718090 spherical silver-coated copper powder, fatty acid coating; epoxy resins; adhesives; reduced silver electroplating; migration resistance; electronics
05/18/2010US7717627 Electrical component connector with misalignment compensation
05/18/2010US7717316 Method and device for applying a solder to a substrate
05/18/2010US7716826 Circuit substrate manufacturing method
05/18/2010US7716825 Method for manufacturing printed wiring board
05/18/2010US7716823 Bonding an interconnect to a circuit device and related devices
05/18/2010US7716822 Method of moving at least two elements of a placement machine
05/18/2010US7716821 Method of manufacturing a circuit board assembly for a controller
05/18/2010CA2313611C Semiconductor device
05/14/2010WO2010053203A1 Electrical inspecting apparatus
05/14/2010WO2010053185A1 Resin composition for printed wiring board
05/14/2010WO2010053123A1 Multi-piece substrate and method for manufacturing the same
05/14/2010WO2010053081A1 Apparatus for adhering anisotropic conductive film
05/14/2010WO2010053046A1 Multi-piece board manufacturing method
05/14/2010WO2010052942A1 Wiring board with built-in electronic component and method for manufacturing the wiring board
05/14/2010WO2010052871A1 Electronic device manufacturing method and electronic device
05/14/2010WO2010052811A1 Photocurable resin composition, dry film and cured product of the photocurable resin composition, and printed wiring board using the photocurable resin composition, the dry film, and the cured product
05/14/2010WO2010052783A1 Multilayer printed circuit board, method for examining multilayer printed circuit board, system for examining multilayer printed circuit board, and method for manufacturing multilayer printed circuit board
05/14/2010WO2010052202A1 Component support
05/14/2010WO2010022825A3 Process chamber and method for electroplating substrates in said process chambers
05/13/2010US20100120266 Backplane To Mate Boards With Different Widths
05/13/2010US20100119853 Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet
05/13/2010US20100118505 Termination apparatus and method for planar components on printed circuit boards
05/13/2010US20100118504 Multi-piece board and fabrication method therefor
05/13/2010US20100118503 Electric drive with a circuit board
05/13/2010US20100118502 Printed circuit board
05/13/2010US20100118443 Suspension board with circuit and producing method thereof
05/13/2010US20100117985 Capacitive touch screen and strategic geometry isolation patterning method for making touch screens
05/13/2010US20100117761 Selectable capacitance circuit
05/13/2010US20100117308 Pressure sensing module having an integrated seal plate and method of assembling pressure sensing module
05/13/2010US20100117102 Light emitting diodes and backlight unit having the same
05/13/2010US20100116999 High Resolution Imaging System
05/13/2010US20100116782 Method for manufacturing multilayer wiring board
05/13/2010US20100116537 Printed circuit board and method of manufacturing the same
05/13/2010US20100116534 Printed Circuit Board Having Flow Preventing Dam And Manufacturing Method Thereof
05/13/2010US20100116526 Extremely stretchable electronics
05/13/2010US20100116376 Anti-tombstoning lead free alloys for surface mount reflow soldering
05/13/2010US20100116057 Mems sensor and method of manufacturing the same
05/13/2010US20100115767 Method for fabricating printed circuit board having capacitance components
05/13/2010US20100115766 Fabrication method for multi-piece board
05/12/2010EP2184960A1 Circuit board and method for manufacturing circuit board
05/12/2010EP2184959A2 Circuit board for assembly with surface-mounted and wired components and method for producing a circuit board
05/12/2010EP2184957A1 Printed circuit board and method of manufacturing the same
05/12/2010EP1960119B1 Device, system and method for treating the surfaces of substrates
05/12/2010DE19519211B4 Verfahren zur Behandlung von Gegenständen, insbesondere von Leiterplatten, sowie Vorrichtung zur Durchführung dieses Verfahrens A method for treating objects, in particular printed circuit boards, as well as apparatus for carrying out this method
05/12/2010DE102008057005A1 Verfahren zum Positionieren und/oder Führen mindestens eines beliebigen Prozesskopfes für die Metallisierung von dünnen Substraten in einem definierten Abstand über der Substratoberfläche A method for positioning and / or guiding at least one head any process for the metallization of thin substrates at a defined distance above the substrate surface
05/12/2010DE102008056826A1 Leiterplatte zur Bestückung mit oberflächenmontierbaren und drahtgebundenen Bauteilen und Verfahren zur Herstellung einer Leiterplatte Circuit board for use with surface mounted and wired devices and methods for producing a printed circuit board
05/12/2010DE102008043543A1 Screen printing device for applying printing paste on substrate, has frame and printing screen held in frame under mechanical pre-stressing
05/12/2010DE10193432B4 Montageplatte, Verfahren zum Montieren einer Montageplatte und Birnenhalter mit einer Montageplatte Mounting plate method for mounting a mounting plate and bulb holder with a mounting plate
05/12/2010CN201467620U Linear feeding device
05/12/2010CN201467568U Polishing machine for clearing ink protruding out of both ends of conduction hole of printed circuit board
05/12/2010CN201467567U Alignment fixture for FPC paste gummed paper
05/12/2010CN201467566U Vacuum flexible ejectorpin movable bracket
05/12/2010CN201467565U Operation clamping tool of circuit board
05/12/2010CN201467564U Improved frame structure for improving copper raising at edge of PCB (printed circuit board)
05/12/2010CN201458885U Preceding stage water treatment system for printed circuit board cleaning machines
05/12/2010CN201455487U Precision desktop reflow soldering machine with temperature testing and analyzing system
05/12/2010CN201455485U Rear nozzle flow guiding plate adjusting device for wave crest soldering furnace
05/12/2010CN201455481U Reflow-soldering modularized heating structure
05/12/2010CN1991588B Method for fabricating printing plate with fine pattern using electric field
05/12/2010CN1991486B Patterning method and method for manufacturing liquid crystal display device using the same
05/12/2010CN1971899B Package substrate
05/12/2010CN1957298B Method of forming a metal pattern on a substrate
05/12/2010CN1954651B Circuit board and electronic apparatus employing it
05/12/2010CN1946266B Method of manufacturing a printed circuit board
05/12/2010CN1945434B Photohardenable and thermosetting resin compositions, their hardened product, and printing circuit boards using the same
05/12/2010CN1938878B Method for providing a substrate with a printed pattern
05/12/2010CN1927944B Resin composition, cured composition and printed circuit board using same
05/12/2010CN1913752B Method for manufacturing blended multi-layer circuit substrate
05/12/2010CN1906986B Multilayer substrate incorporating chip type electronic component and production method therefor
05/12/2010CN1901177B Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
05/12/2010CN1898764B Circuit connecting structure and connecting method
05/12/2010CN1867226B Method of manufacturing wiring circuit board
05/12/2010CN1867225B Multilayer module and method of manufacturing the same
05/12/2010CN1862259B Inspection standard setting device and method, and process inspection device
05/12/2010CN1856218B Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
05/12/2010CN1852638B Printing welding-paste method and printing tin steel-screen
05/12/2010CN1842742B Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing printed wiring board, and method for removing photocured product
05/12/2010CN1838856B Method and apparatus for routing a differential pair on a printed circuit board
05/12/2010CN1829417B Method and apparatus for printed circuit board different material layer separation in supercritical liquid
05/12/2010CN1829413B Wired circuit board
05/12/2010CN1826048B Method for binding IC chip and flexible circuitboard on panel display
05/12/2010CN1805657B Wired circuit board
05/12/2010CN1780533B Bonding apparatus using conductive material
05/12/2010CN1758902B Cataplasm base and cataplasm using the same
05/12/2010CN1729731B Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
05/12/2010CN1669372B Selective area solder placement
05/12/2010CN1652333B High frequency circuit module
05/12/2010CN1560911B Manufacturing method of circuit board
05/12/2010CN1516334B Voltage-controlled oscillator and its related making method