Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2010
05/26/2010CN101257767B Printed circuit board and manufacturing method thereof
05/26/2010CN101177657B Striping agent additive on printed circuit board and method for producing the same
05/26/2010CN101142864B Method of manufacturing printed wiring board
05/26/2010CN101052273B PCB plate connection structure and connection method
05/26/2010CN101043793B Connection device
05/26/2010CN101031183B Suspension board with circuit
05/25/2010US7725860 Contact mapping using channel routing
05/25/2010US7725420 Systems for predicting sporting success conditions
05/25/2010US7724475 Conductive member, disk drive using same, and conductive member fabricating method
05/25/2010US7723642 Laser-based system for memory link processing with picosecond lasers
05/25/2010US7723244 Method for internal electrical insulation of a substrate for a power semiconductor module
05/25/2010US7723156 Electronic system modules and method of fabrication
05/25/2010US7722962 Cu metal particles and Sn particles as solder particles by rolling for solder bonding on the high temperature; preventing generation of voids during or after bonding process
05/25/2010US7722797 Method for producing a ceramic substrate
05/25/2010US7721440 Method for manufacturing inkjet head
05/25/2010US7721427 Method for manufacturing single sided substrate
05/25/2010US7721426 Method of producing electrically conductive patterns on a substrate
05/25/2010US7721425 Method for connecting electronic parts
05/25/2010US7721424 Electronic component mounting method
05/25/2010US7721423 Method of manufacturing alloy circuit board
05/25/2010US7721422 Methods of making microelectronic assemblies
05/20/2010WO2010056306A1 Polymeric conductive donor and transfer method
05/20/2010WO2010054924A1 Illumination device comprising two printed circuit boards
05/20/2010WO2010054623A2 Method for positioning and/or guiding at least one random processing head for the metallization of thin substrates at a defined distance above the substrate surface
05/20/2010WO2010054478A1 Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips
05/20/2010US20100125359 Vertically separated pass through conveyor system and method in surface mount technology process equipment
05/20/2010US20100124038 Multi-piece board and fabrication method therefor
05/20/2010US20100124010 Waterproof usb drives and method of making
05/20/2010US20100123670 Touch Screen Sensor
05/20/2010US20100123582 Surveillance Devices with Multiple Capacitors
05/20/2010US20100122842 Printed circuit board and manufacturing method thereof
05/20/2010US20100122840 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
05/20/2010US20100122839 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
05/20/2010US20100122837 Circuit Board and Method of Producing a Circuit Board
05/20/2010US20100122457 Application method and apparatus for resin
05/20/2010US20100122456 Integrated Alignment and Bonding System
05/20/2010US20100122455 Component mounting apparatus and component mounting method
05/20/2010DE202010000187U1 Leitfähiger Steckverbinder einer Hauptplatine bzw. eines Schnittstellen-Bausteines Conductive Connector a motherboard or an interface module
05/20/2010DE102009053434A1 Substrat mit einem Loch mit einer Metallsilizidschicht Substrate with a hole with a metal silicide
05/20/2010DE102009023629A1 Leiterplatte und Herstellungsverfahren PCB and manufacturing processes
05/20/2010DE102008058203A1 Socket for printed circuit board, has contact elements that are arranged at lower ring region for mechanical and electrical connection with printed circuit board, where window is provided in lower ring region
05/20/2010DE102008043884A1 Printed circuit board arrangement for fastening e.g. ignition coils, to printed circuit board of e.g. antilock brake system controller in vehicle, has conductive adhesive filling free areas in conducting through-connection element
05/20/2010DE102008043882A1 Printed circuit board arrangement for connecting e.g. ignition coils to printed circuit board of antilock brake system controller in automobile, has insulating wire with stripped end area wound around pin in cylindrical or spiral-shape
05/20/2010DE102008043877A1 Printed circuit board arrangement for e.g. anti-lock brake system control device, of vehicle, has press part pressed into contacting-element by press fit to produce conductive connection between wire end region and contacting element
05/20/2010DE102008027461A1 Vorrichtung und Verfahren zur mikrostrukturierten Plasmabehandlung Apparatus and method for microstructured plasma treatment
05/20/2010DE10137667B4 Schutzvorrichtung für Baugruppen mit Abstandhalter Protection device for assemblies with spacers
05/19/2010EP2187720A1 Flexible wiring board, and its manufacturing method
05/19/2010EP2187719A1 Binder for solder pins
05/19/2010EP2187718A1 Electric drive with a circuit board
05/19/2010EP2187717A1 Circuit board, circuit module and circuit board manufacturing method
05/19/2010EP2187716A1 Central component for a flexibly expandable automation device
05/19/2010EP2187435A1 Electronic component
05/19/2010EP2187262A1 Microcontact printing stamp
05/19/2010EP2186864A1 Easily flowing inks for extrusion
05/19/2010CN201479477U Vertical automatic lifting seal door mechanism for PCB vacuum hot press
05/19/2010CN201479476U Single-face electro-nickel golden board manufacturing device
05/19/2010CN201479475U Manual plate discharge device of reflow oven
05/19/2010CN201479474U Air box for removing hole-plugging ink of circuit board
05/19/2010CN201479473U Circuit board and adhesive tape composite device
05/19/2010CN201479472U Rivet locator for PCB manufacture
05/19/2010CN201479471U Laminated board positioning device of multi-layer PCB (printed circuit board)
05/19/2010CN201479463U Printed circuit board with bonding pad with air exhaust through holes
05/19/2010CN201479455U Metal base flexible circuit copper-clad plate and metal base flexible circuit board
05/19/2010CN201479454U Circuit board with metal covering film of insulated rubber film attached to element surface thereof
05/19/2010CN201478338U Flip-chip element for golden ball to golden ball connection (GGI) welding process
05/19/2010CN201471043U Anti-oxidation device of wave soldering machine
05/19/2010CN201471038U Selective de-bridging device for wave-soldering
05/19/2010CN201471037U Wave crest generating device for wave-soldering
05/19/2010CN201471036U Chain pawl cleaning device for crest welder
05/19/2010CN201471035U Automatic tin adding device for crest welder
05/19/2010CN201471034U Solder machine peak motor belt conveying device with heat insulation protection
05/19/2010CN201471033U Return air device of reflow oven
05/19/2010CN201471032U Conveying guide rail of reflow oven
05/19/2010CN201471031U Lifting device of reflow oven
05/19/2010CN1980541B Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure
05/19/2010CN1975942B Sheet capacitor
05/19/2010CN1972571B Method for manufacturing multilayer wiring substrate with cable
05/19/2010CN1942049B Circuit board and method of manufacturing circuit board
05/19/2010CN101711488A Method in manufacturing of circuit boards
05/19/2010CN101711101A Process for pressing galvanized PCB boards and multi-layer PCB board
05/19/2010CN101711100A Method for preparing multilayer printed circuit board
05/19/2010CN101711099A Method for preparing multilayer printed circuit board
05/19/2010CN101711098A Twice laminating technique of flexible printed circuits
05/19/2010CN101711097A Method for processing network connection layer of printed circuit board
05/19/2010CN101711096A Micro hole manufacturing process of multilayer HDI circuit board
05/19/2010CN101711095A Copper-plating hole-filling process of HDI flexible printed circuit
05/19/2010CN101711094A Preparation method of flexible and hard combined circuit board and flexible and hard combined circuit board
05/19/2010CN101711093A Reversible clamp for welding circuit board
05/19/2010CN101711092A Direct gold plating technique adopted by flexible printed circuits
05/19/2010CN101711091A Technique for applying anisotropic conductive paste to flexible printed circuits
05/19/2010CN101711090A Method for manufacturing double-sided hollow flexible circuit board
05/19/2010CN101711089A Preparation method of metallized stepped chute of PCB board
05/19/2010CN101347054B Glass substrate having circuit pattern and process for producing the same
05/19/2010CN101312617B Manufacturing method of insulating medium layer of high-density printed circuit board
05/19/2010CN101304879B 丝网印刷设备和丝网印刷方法 Screen printing equipment and screen printing method
05/19/2010CN101283632B Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
05/19/2010CN101238763B Method of forming conductive pattern and wiring board
05/19/2010CN101214478B Real time monitoring and diagnosing method for glue dropping machine
05/19/2010CN101212165B Motor module
05/19/2010CN101171894B Printed wiring board
1 ... 250 251 252 253 254 255 256 257 258 259 260 261 262 263 264 265 266 267 268 269 270 ... 1185