Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2010
06/08/2010US7730610 Method of mounting electronic circuit constituting member and relevant mounting apparatus
06/08/2010US7730609 Method and apparatus for carrying circuit assemblies
06/08/2010US7730606 Manufacturing method for a wireless communication device and manufacturing apparatus
06/08/2010CA2403864C Method for making an electroconductive joint
06/03/2010WO2010061980A1 Resin composition
06/03/2010WO2010061795A1 Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
06/03/2010WO2010061752A1 Wiring board and method for manufacturing same
06/03/2010WO2010061563A1 Protective film for electronic component, manufacturing method therefor, and use thereof
06/03/2010WO2010061428A1 Electronic device manufacturing method, substrate for mounting electronic component and method for manufacturing the substrate
06/03/2010WO2010061259A1 Plating substrate having sn plating layer, and fabrication method therefor
06/03/2010WO2010060286A1 Structure of conductive holes of multilayer board and manufacturing method thereof
06/03/2010WO2010002679A3 Method of forming a microstructure
06/03/2010US20100136821 Connector terminal and method for making the same
06/03/2010US20100136669 Microchip with accessible front side
06/03/2010US20100136252 Method of manufacturing pattern-forming metal structures on a carrier substrate
06/03/2010US20100136223 Methods and compositions for dielectric materials
06/03/2010US20100134991 Chip embedded printed circuit board and manufacturing method thereof
06/03/2010US20100134945 Electrical connects for charge distribution applique
06/03/2010US20100134143 Permutable switching network with enhanced multicasting signals routing for interconnection fabric
06/03/2010US20100133347 Method for making smart cards capable of operating with and without contact
06/03/2010US20100132997 Multilayer wiring substrate and method for manufacturing the same
06/03/2010US20100132994 Apparatus and method for reducing pitch in an integrated circuit
06/03/2010US20100132987 Method for producing an electrically conductive path on a plastic component
06/03/2010US20100132985 Printed circuit board having metal bump and method of manufacring the same
06/03/2010US20100132980 Wiring board and fabrication method therefor
06/03/2010US20100132507 Method for patterning metal using nanoparticle containing precursors
06/03/2010US20100132191 Method for Forming a Circuit Board Via Structure for High Speed Signaling
06/03/2010US20100132190 Injection tool for encapsulating electronic circuits with light sources, and related encapsulation processes
06/03/2010US20100132189 Method for taking an electronic component out of a carrier tape
06/02/2010EP2192825A1 An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process
06/02/2010EP2192598A1 Paste composition for forming heat-resistant conductive patterns on substrate
06/02/2010EP2191702A1 Method for the hot embossing of at least one conductor track onto a substrate and substrate comprising at least one conductor track
06/02/2010EP2191701A1 Improved systems and methods for drilling holes in printed circuit boards
06/02/2010EP2191536A1 Method of manufacturing an approach sensor sealed against the external environment, approach sensor sealed against the external environment and associated handle
06/02/2010EP1966824B1 Metal-ceramic substrate
06/02/2010EP1795058B1 Flexible cable for high-speed interconnect
06/02/2010EP1670596B1 Method of pattern coating
06/02/2010DE112008000147T5 Kapazitive Kopplung von Schichten eines Mehrschichtbauelements Capacitive coupling of layers of a multi-layer component
06/02/2010DE102009044607A1 Niederviskose Polymerdrucklösungen und elektronische Bauteile mit Polyimid auf Basis der niederviskosen Polymerdrucklösungen Low-viscosity polymer printing solutions and electronic components with polyimide based on the low-viscosity polymer printing solutions
06/02/2010DE102009008032B4 Selbstmontage von Bauelementen Self-assembly of components
06/02/2010DE102008058287A1 Electronic module i.e. motor vehicle control device, has sealing agent formed by edges of film that is applied on sides of interconnect device via components of device in order to mechanically fasten components to interconnect device
06/02/2010DE10136082C5 Verfahren zum Vercrimpen und Anschlussklemmencrimpvorrichtung Method for crimping and Anschlussklemmencrimpvorrichtung
06/02/2010DE10081175B4 Verfahren zur Herstellung einer dreidimensionalen Leiterplatte A process for producing a three-dimensional printed circuit board
06/02/2010CN201499379U Supporting structure for circuit board double-surfaced soldermask printing
06/02/2010CN201499378U Horizontal jig for top of PCB
06/02/2010CN201499376U Interlayer conducting structure of PCB
06/02/2010CN201499370U Metal-based circuit board for etched metal heat dissipating surface
06/02/2010CN201497853U Pcb exposure machine
06/02/2010CN201493428U Binding post riveted tooling for welding lead wire on printed board
06/02/2010CN1701649B Method for supplying solder and solder projection forming method
06/02/2010CN1551710B Copper foil for fine pattern printed circuits and method of production of same
06/02/2010CN1543292B Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
06/02/2010CN1233349B Low profile connector
06/02/2010CN101720568A Method for manufacturing substrate for mounting component thereon, and substrate for mounting component thereon
06/02/2010CN101720567A Process for producing printed wiring board and printed wiring board produced by the production process
06/02/2010CN101720175A Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board
06/02/2010CN101720174A Soft-hard printed circuit board combination process
06/02/2010CN101720173A Method for processing PCB
06/02/2010CN101720172A Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof
06/02/2010CN101720171A Pressing method for flexible circuit board of flat display device
06/02/2010CN101720170A Flexible print wiring plate and its manufacturing method
06/02/2010CN101720169A Flexible printed circuit board steel disc reinforcing hot-pressing making process
06/02/2010CN101720168A Method for routing vacant sites for prepregs of circuit board and multi-layer circuit board
06/02/2010CN101720167A Method for producing circuit board by filling resin in holes on inner core plate
06/02/2010CN101720165A Component built-in wiring substrate and manufacturing method thereof
06/02/2010CN101719476A High-precision automatic ball-embedding equipment and BGA solder ball-embedding method using same
06/02/2010CN101717613A High-temperature resistant copper foil glue and preparation and application thereof
06/02/2010CN101716744A Board surface leveling method of loop-free blind hole high-density interconnection printing circuit board
06/02/2010CN101436549B Method for making copper-core layer multi-layer encapsulation substrate
06/02/2010CN101393331B Pressure bench structure and press joint device
06/02/2010CN101378628B Sticking method for local additional sticking material of various printed circuit boards
06/02/2010CN101374388B Method for preparing fine line flexible circuit board with high peeling strength
06/02/2010CN101371355B Interposer and electronic device using the same and their production method
06/02/2010CN101365299B Manufacturing method for memory card series circuit board having thickened golden finger and memory card
06/02/2010CN101360398B Circuit board construction of inner fovea type conductive column and preparation thereof
06/02/2010CN101351092B Inside imbedded type line board technique with conductive hole
06/02/2010CN101346047B Multi-layer circuit board production method and inner layer substrates for producing the same
06/02/2010CN101346037B Multi-layer substrate and manufacturing method thereof
06/02/2010CN101341585B Method of bonding
06/02/2010CN101336040B General solder pad construction
06/02/2010CN101296582B Method for replacing and mending bad circuit area on multi-layer printed circuit board
06/02/2010CN101262741B Measuring butt point method for measuring base plate size in base plate technology
06/02/2010CN101257771B Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
06/02/2010CN101256962B Electronic part and method for manufacturing the same
06/02/2010CN101252808B Soldering circuit plate and soldering method thereof
06/02/2010CN101252090B Surface treating process of circuit board
06/02/2010CN101232783B Printed circuit board productttion mthod
06/02/2010CN101229711B Test method and mechanism of single optic axis in visual imprinter
06/02/2010CN101229601B Device and method for soldering
06/02/2010CN101226914B Chip carrier substrate capacitor and method for fabrication thereof
06/02/2010CN101193498B Printed circuit board, printed circuit board assembly manufacturing method, warpage correcting method
06/02/2010CN101179901B Circuit board output terminal bevelling machine
06/02/2010CN101166402B Mounting method for mounting microphone on flexible printed circuit board
06/02/2010CN101146408B Wiring forming system and wiring forming method for forming wiring on wiring board
06/02/2010CN101107053B Method and apparatus for treatment of exhaust gas
06/02/2010CN101105628B Light solidifying/heat solidifying one-part welding resistant agent composition
06/02/2010CN101094560B PC board and its manufacturing method
06/02/2010CN101083875B Perforating device for printed circuit wiring board and reference perforating method
06/02/2010CN101025398B Hollow-bulge analyzing method for micro-pore after filled by copper
06/01/2010US7728710 Electronic parts board and method of producing the same
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