Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2010
06/16/2010CN1722535B Stud bump socket
06/16/2010CN1722315B Circuit protection device
06/16/2010CN1685508B Electronic module having canopy-type carriers
06/16/2010CN1685454B Process for producing laminated ceramic capacitor
06/16/2010CN1662679B Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
06/16/2010CN1660597B Method for depositing ink jet printable composition on basis material
06/16/2010CN1605229B Epoxy washer for retention of inverted SMT components
06/16/2010CN1604731B Electronic component mounting apparatus
06/16/2010CN101743786A Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials
06/16/2010CN101743480A An improved ball mounting apparatus and method
06/16/2010CN101743283A Resin composition and its use
06/16/2010CN101743089A Method of and apparatus for laser drilling holes with improved taper
06/16/2010CN101742828A Manufacturing method of multi-layered circuit board
06/16/2010CN101742827A Circuit board bearing device
06/16/2010CN101742826A Method for repairing circuits of embedded circuit board
06/16/2010CN101742825A Method for improving precision of distance from circuits to board edges on printed-circuit board
06/16/2010CN101742824A Method for manufacturing circuit board and copper clad substrate suitable for same
06/16/2010CN101742823A Circuit board bearing device and application method thereof
06/16/2010CN101742822A Method for peeling rigid board from flexible board area of flexible-rigid board
06/16/2010CN101742821A Circuit board bearing device and application method thereof
06/16/2010CN101742820A Productive technology of flexible printed circuit board
06/16/2010CN101742818A Packaging method for combining telescopic screw with printed circuit board
06/16/2010CN101742816A Combined device of rigid circuit board and flexible circuit board, communication equipment and circuit boards
06/16/2010CN101742813A Mount board and semiconductor module
06/16/2010CN101742812A Printed circuit board and method of manufacturing the same
06/16/2010CN101742811A Printed circuit board and method of manufacturing the same
06/16/2010CN101742810A Multilayered wiring board
06/16/2010CN101740538A Printed circuit board having flow preventing dam and manufacturing method thereof
06/16/2010CN101739608A Method of creating substrate production schedule
06/16/2010CN101738861A Light-sensitive resin composite and method for manufacturing printed circuit board using same
06/16/2010CN101738858A Flame retardant photocurable resin composition, dry film and cured product thereof, and printed wiring board using the same
06/16/2010CN101736331A Adhesive layer forming liquid and adhesive layer forming process
06/16/2010CN101736328A Pretreatment solution and process of electroless copper plating of flexible printed circuit board
06/16/2010CN101735755A Adhesive composition and method for manufacturing flexible printed-circuit board by using same
06/16/2010CN101735575A Resin composition and method for preparing FPC coverlay by using same
06/16/2010CN101734004A Screen printing machine and printing unit
06/16/2010CN101733501A Pneumatic tin discharging structure of tin stove
06/16/2010CN101733439A Machining device and machining method
06/16/2010CN101733438A Robot for punching positioning holes on circuit board
06/16/2010CN101466205B Circuit board preparation method
06/16/2010CN101409982B Method for manufacturing circuit board
06/16/2010CN101351086B Inside imbedded type line structural technique
06/16/2010CN101346044B Line forming method adopting printing means
06/16/2010CN101345297B Button battery electrical connection structure and its manufacture process
06/16/2010CN101340782B Multilayered circuit board having interlayer contraposition checking system and contraposition checking method thereof
06/16/2010CN101330801B Method for forming pattern, method for manufacturing electro-optical device, and method for manufacturing electronic device
06/16/2010CN101325843B Method of fabricating paste bump for printed circuit board
06/16/2010CN101247702B Multilayer printed circuit board
06/16/2010CN101241903B Semiconductor device having wiring board
06/16/2010CN101238229B Method of depositing copper in lead-free solder, method of granulating (CuX)6Sn5 compound and method of separating the same, and method of recovering tin
06/16/2010CN101232773B Flexible printed circuit board
06/16/2010CN101203094B Method for multi-layer board semi-curing glue transferring of flexible printed wiring board
06/16/2010CN101203089B Multilayer printed circuit board
06/16/2010CN101194540B Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
06/16/2010CN101188909B A flexible circuit board and its copper plating method
06/16/2010CN101180727B Printed wiring board and manufacturing method thereof
06/16/2010CN101170878B Method for manufacturing print circuit board
06/16/2010CN101155480B Pattern forming apparatus and pattern forming method
06/16/2010CN101150121B Flexible circuits having improved reliability and thermal dissipation
06/16/2010CN101106125B Composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assembly
06/16/2010CN101073037B Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same
06/16/2010CN101047090B Image correction device and coating unit thereof
06/16/2010CN101018454B Device and method for manufacturing flexible printing substrate
06/16/2010CN101001519B Electronic component mounting apparatus and electronic component mounting method
06/15/2010US7738258 Semiconductor mounting board
06/15/2010US7738256 Multilayer substrate including components therein
06/15/2010US7737911 Display apparatus
06/15/2010US7737796 Constant temperature type crystal oscillator
06/15/2010US7737707 Sheet-like probe, method of producing the probe, and application of the probe
06/15/2010US7737366 Multilayer printed wiring board with filled viahole structure
06/15/2010US7737025 Via including multiple electrical paths
06/15/2010US7736997 Production method of flexible electronic device
06/15/2010US7736834 Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product
06/15/2010US7736749 Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board
06/15/2010US7736489 Rendering electroconductivity polymer nonconductivity; contacting with electrolyte; applying electric voltage ; electrochemistry response at interface between electrolyte and polymer in response to voltage
06/15/2010US7736152 Land grid array fabrication using elastomer core and conducting metal shell or mesh
06/15/2010US7735741 Method for production of a card with a double interface and microcircuit card obtained thus
06/15/2010US7735221 Method for manufacturing a multilayer wiring board
06/15/2010US7735219 Method for machining a board
06/15/2010US7735216 Micro-electromechanical sub-assembly having an on-chip transfer mechanism
06/10/2010WO2010065596A1 Electrical interconnection system
06/10/2010WO2010064602A1 Method for manufacturing circuit board, and circuit board obtained using the manufacturing method
06/10/2010WO2010064467A1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
06/10/2010WO2010064428A1 Reflow furnace
06/10/2010WO2010064386A1 Pattern-forming method
06/10/2010WO2010064364A1 Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object
06/10/2010WO2010063576A1 Device for ejecting droplets of a fluid having a high temperature
06/10/2010WO2010063481A1 Method for generation of electrically conducting surface structures, apparatus therefor and use
06/10/2010WO2010063194A1 Multilayer mixed-compressing printed circuit board and its manufacture method and manufacture device
06/10/2010US20100144216 Oblique Parts or Surfaces
06/10/2010US20100144166 Electrical connector assembly with low profile
06/10/2010US20100143811 Water Oxidation Catalyst
06/10/2010US20100143582 Liquid films containing nanostructured materials
06/10/2010US20100142896 Printed circuit board element and method for producing the same
06/10/2010US20100142170 Chip embedded printed circuit board and manufacturing method thereof
06/10/2010US20100141453 Method and Apparatus for Making a Radio Frequency Inlay
06/10/2010US20100141358 Chiral Metamaterials
06/10/2010US20100141298 Permutable switching network with enhanced multicasting signals routing for interconnection fabric
06/10/2010US20100140803 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
06/10/2010US20100140800 Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device